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GB2380960B - Wafer polishing apparatus - Google Patents

Wafer polishing apparatus

Info

Publication number
GB2380960B
GB2380960B GB0222815A GB0222815A GB2380960B GB 2380960 B GB2380960 B GB 2380960B GB 0222815 A GB0222815 A GB 0222815A GB 0222815 A GB0222815 A GB 0222815A GB 2380960 B GB2380960 B GB 2380960B
Authority
GB
United Kingdom
Prior art keywords
polishing
wafer
detector
temperature
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0222815A
Other versions
GB0222815D0 (en
GB2380960A (en
Inventor
Takao Inaba
Minoru Numoto
Kenji Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP29571998A external-priority patent/JP3045232B2/en
Priority claimed from JP29575598A external-priority patent/JP3082850B2/en
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority claimed from GB0014585A external-priority patent/GB2347102B/en
Publication of GB0222815D0 publication Critical patent/GB0222815D0/en
Publication of GB2380960A publication Critical patent/GB2380960A/en
Application granted granted Critical
Publication of GB2380960B publication Critical patent/GB2380960B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

Wafer polishing apparatus comprises a rotatable polishing platen which carries a polishing cloth, a wafer carrier 412 and a pad 611 and 612 arranged around a wafer which contacts the cloth at a predetermined pressure. The apparatus also comprises a detector 51 and 52 which measures the position of the pad relative to the back of the wafer or the wafer carrier 412. A temperature sensor 72 measures the temperature in the neighbourhood of the detector 51 and 52. The amount of polishing performed is calculated based on the signal from the detector 51 and 52 corrected by the measured temperature. The amount of polishing may also be corrected using measurements from temperature sensors 73 and 74 lying between the detector 51 and 52 and the back of the wafer and between the detector 51 and 52 and the portion of the pad 612 facing the polishing cloth. The temperature sensors 72-74 compensate for the different amounts of thermal expansion experienced by the apparatus during polishing.
GB0222815A 1998-10-16 1999-10-15 Wafer polishing apparatus Expired - Fee Related GB2380960B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP29571998A JP3045232B2 (en) 1998-10-16 1998-10-16 Wafer polishing apparatus and polishing amount detection method
JP29575598A JP3082850B2 (en) 1998-10-16 1998-10-16 Wafer polishing equipment
GB0014585A GB2347102B (en) 1998-10-16 1999-10-15 Wafer polishing apparatus and polishing quantity detection method

Publications (3)

Publication Number Publication Date
GB0222815D0 GB0222815D0 (en) 2002-11-06
GB2380960A GB2380960A (en) 2003-04-23
GB2380960B true GB2380960B (en) 2003-06-04

Family

ID=27255763

Family Applications (2)

Application Number Title Priority Date Filing Date
GB0222814A Expired - Fee Related GB2380700B (en) 1998-10-16 1999-10-15 Wafer polishing apparatus
GB0222815A Expired - Fee Related GB2380960B (en) 1998-10-16 1999-10-15 Wafer polishing apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB0222814A Expired - Fee Related GB2380700B (en) 1998-10-16 1999-10-15 Wafer polishing apparatus

Country Status (1)

Country Link
GB (2) GB2380700B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116423378A (en) * 2023-04-17 2023-07-14 华海清科股份有限公司 Metal film thickness on-line measurement and compensation method, film thickness sensor and equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6445568A (en) * 1987-08-11 1989-02-20 Mitsubishi Metal Corp Automatic dimensioning of lapping machine
JPH08288245A (en) * 1995-04-12 1996-11-01 Sony Corp Polishing apparatus and method
EP0806266A2 (en) * 1996-05-09 1997-11-12 Canon Kabushiki Kaisha Polishing method and polishing apparatus using the same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5775777A (en) * 1980-10-28 1982-05-12 Supiide Fuamu Kk Polishing machine
JPS63256360A (en) * 1987-04-10 1988-10-24 Sumitomo Electric Ind Ltd Grinding dimension measuring device
JPH10329014A (en) * 1997-05-26 1998-12-15 Tokyo Seimitsu Co Ltd Wafer polishing device attached with heat insulating mechanism
US6059636A (en) * 1997-07-11 2000-05-09 Tokyo Seimitsu Co., Ltd. Wafer polishing apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6445568A (en) * 1987-08-11 1989-02-20 Mitsubishi Metal Corp Automatic dimensioning of lapping machine
JPH08288245A (en) * 1995-04-12 1996-11-01 Sony Corp Polishing apparatus and method
EP0806266A2 (en) * 1996-05-09 1997-11-12 Canon Kabushiki Kaisha Polishing method and polishing apparatus using the same

Also Published As

Publication number Publication date
GB0222814D0 (en) 2002-11-06
GB2380700A (en) 2003-04-16
GB0222815D0 (en) 2002-11-06
GB2380700B (en) 2003-05-28
GB2380960A (en) 2003-04-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20071015