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GB2352872A - Cooling a component mounted on a PCB - Google Patents

Cooling a component mounted on a PCB Download PDF

Info

Publication number
GB2352872A
GB2352872A GB9917965A GB9917965A GB2352872A GB 2352872 A GB2352872 A GB 2352872A GB 9917965 A GB9917965 A GB 9917965A GB 9917965 A GB9917965 A GB 9917965A GB 2352872 A GB2352872 A GB 2352872A
Authority
GB
United Kingdom
Prior art keywords
component
aperture
circuit board
printed circuit
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9917965A
Other versions
GB9917965D0 (en
Inventor
Matthew V Volpone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Delphi Technologies Inc
Original Assignee
Delphi Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Delphi Technologies Inc filed Critical Delphi Technologies Inc
Priority to GB9917965A priority Critical patent/GB2352872A/en
Publication of GB9917965D0 publication Critical patent/GB9917965D0/en
Publication of GB2352872A publication Critical patent/GB2352872A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

An arrangement 10 for mounting an electronic component 12 on a printed circuit board 14 comprises forming an aperture 18 in the printed circuit board; filling the aperture with a heat conducting, electrically insulating, medium 20 ; mounting the component on one side of the printed circuit board adjacent the aperture; and mounting a heat sink 16 on the opposite side of the printed circuit board to the component adjacent the aperture. The arrangement provides improved heat transfer from the component to the heat sink.

Description

2352872 COMPONENT MOUNTING ON PCB
Technical Field
The present invention relates to an arrangement for mounting 5 an electronic component on a printed circuit board (PCB).
Background of the Invention
It is known to mounted an electronic component on one side of a PCB, and a heat sink on the opposite side of the PCB adjacent the io component in order to provide a means of heat conduction away from the component. However, the PCB can hinder heat transfer from the component to the heat sink.
Summary of the Invention
It is an object of the present invention to overcome the above mentioned problem.
An arrangement in accordance with the present invention for mounting an electronic component on a printed circuit board comprises forming an aperture in the printed circuit board; filling the aperture with a heat conducting, electrically insulating, medium; mounting the component on one side of the printed circuit board adjacent the aperture; and mounting a heat sink on the opposite side of the printed circuit board to the component adjacent the aperture.
The present invention provides improved heat transfer from the component to the heat sink.
Brief Description of the Drawings
The present invention will now be described, by way of example, with reference to the accompanying drawings, in which: - Figure 1 is a cross-sectional view of an arrangement for mounting a component on a PCB in accordance with the present invention.
2 Description of the Preferred Embodiment
Referring to the drawing, the arrangement 10 for mounting a component 12, for example, a MOSFET, on a printed circuit board (PCB) 14 includes placing a heat sink 16 on the opposite side of the PCB to the component. An aperture 18 is formed in the PCB 14 between the component 12 and the heat sink 16. A thermally conductive gel 20, or other heat conductive, electrically insulating, medium is placed in the aperture 18.
This arrangement 10 provides an improved heat conductive path io from the component 12 to the heat sink 16 to provide improved heat transfer from the component to the heat sink. Such an arrangement 10 allows for a reduction in the size of the heat sink compared to previously known arrangements.
3

Claims (4)

Claims
1. An arrangement for mounting an electronic component on a printed circuit board comprising forming an aperture in the printed circuit board; filling the aperture with a heat conducting, electrically insulating, medium; mounting the component on one side of the printed circuit board adjacent the aperture; and mounting a heat sink on the opposite side of the printed circuit board to the component adjacent the aperture.
2. An arrangement as claimed in Claim 1; wherein the heat conducting medium is a gel.
3. An arrangement as claimed in Claim I or Claim 2, wherein the component is a MOSFET.
4. An arrangement substantially as herein described with reference to, and as shown in, the accompanying drawings.
GB9917965A 1999-08-02 1999-08-02 Cooling a component mounted on a PCB Withdrawn GB2352872A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9917965A GB2352872A (en) 1999-08-02 1999-08-02 Cooling a component mounted on a PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9917965A GB2352872A (en) 1999-08-02 1999-08-02 Cooling a component mounted on a PCB

Publications (2)

Publication Number Publication Date
GB9917965D0 GB9917965D0 (en) 1999-09-29
GB2352872A true GB2352872A (en) 2001-02-07

Family

ID=10858270

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9917965A Withdrawn GB2352872A (en) 1999-08-02 1999-08-02 Cooling a component mounted on a PCB

Country Status (1)

Country Link
GB (1) GB2352872A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2375655A (en) * 2001-01-09 2002-11-20 Deere & Co Circuit board assembly
US7903417B2 (en) 2006-10-10 2011-03-08 Deere & Company Electrical circuit assembly for high-power electronics

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0055578A2 (en) * 1980-12-29 1982-07-07 Honeywell Information Systems Inc. Integrated circuit package
EP0602298A1 (en) * 1992-12-15 1994-06-22 STMicroelectronics S.r.l. Process for dissipating heat from a semiconductor package
US5467251A (en) * 1993-10-08 1995-11-14 Northern Telecom Limited Printed circuit boards and heat sink structures
EP0729183A2 (en) * 1995-02-24 1996-08-28 AT&T Corp. Thin packaging of multi-chip modules with enhanced thermal/power management

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0055578A2 (en) * 1980-12-29 1982-07-07 Honeywell Information Systems Inc. Integrated circuit package
EP0602298A1 (en) * 1992-12-15 1994-06-22 STMicroelectronics S.r.l. Process for dissipating heat from a semiconductor package
US5467251A (en) * 1993-10-08 1995-11-14 Northern Telecom Limited Printed circuit boards and heat sink structures
EP0729183A2 (en) * 1995-02-24 1996-08-28 AT&T Corp. Thin packaging of multi-chip modules with enhanced thermal/power management

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2375655A (en) * 2001-01-09 2002-11-20 Deere & Co Circuit board assembly
GB2375655B (en) * 2001-01-09 2004-03-10 Deere & Co Circuit board assembly
US7903417B2 (en) 2006-10-10 2011-03-08 Deere & Company Electrical circuit assembly for high-power electronics

Also Published As

Publication number Publication date
GB9917965D0 (en) 1999-09-29

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)