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GB2350928B - Improvements in or relating to image sensor packaging - Google Patents

Improvements in or relating to image sensor packaging

Info

Publication number
GB2350928B
GB2350928B GB9923463A GB9923463A GB2350928B GB 2350928 B GB2350928 B GB 2350928B GB 9923463 A GB9923463 A GB 9923463A GB 9923463 A GB9923463 A GB 9923463A GB 2350928 B GB2350928 B GB 2350928B
Authority
GB
United Kingdom
Prior art keywords
relating
image sensor
sensor packaging
packaging
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9923463A
Other versions
GB2350928A (en
GB9923463D0 (en
Inventor
David Hugh Stevenson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics Ltd Great Britain
Vision Group PLC
STMicroelectronics lnc USA
Original Assignee
STMicroelectronics Ltd Great Britain
Vision Group PLC
SGS Thomson Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics Ltd Great Britain, Vision Group PLC, SGS Thomson Microelectronics Inc filed Critical STMicroelectronics Ltd Great Britain
Publication of GB9923463D0 publication Critical patent/GB9923463D0/en
Priority to US09/591,886 priority Critical patent/US6856357B1/en
Publication of GB2350928A publication Critical patent/GB2350928A/en
Application granted granted Critical
Publication of GB2350928B publication Critical patent/GB2350928B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
GB9923463A 1999-06-11 1999-10-06 Improvements in or relating to image sensor packaging Expired - Fee Related GB2350928B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US09/591,886 US6856357B1 (en) 1999-06-11 2000-06-09 Image sensor packaging

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB9913516.2A GB9913516D0 (en) 1999-06-11 1999-06-11 Improvements in or relating to image sensor packaging

Publications (3)

Publication Number Publication Date
GB9923463D0 GB9923463D0 (en) 1999-12-08
GB2350928A GB2350928A (en) 2000-12-13
GB2350928B true GB2350928B (en) 2001-07-25

Family

ID=10855097

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB9913516.2A Ceased GB9913516D0 (en) 1999-06-11 1999-06-11 Improvements in or relating to image sensor packaging
GB9923463A Expired - Fee Related GB2350928B (en) 1999-06-11 1999-10-06 Improvements in or relating to image sensor packaging

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB9913516.2A Ceased GB9913516D0 (en) 1999-06-11 1999-06-11 Improvements in or relating to image sensor packaging

Country Status (1)

Country Link
GB (2) GB9913516D0 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818094A (en) * 1995-01-20 1998-10-06 Kyocera Corporation Package for housing a semiconductor element
US5923958A (en) * 1998-05-28 1999-07-13 Pan Pacific Semiconductor Co., Ltd. Method for semiconductor chip packaging

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5818094A (en) * 1995-01-20 1998-10-06 Kyocera Corporation Package for housing a semiconductor element
US5923958A (en) * 1998-05-28 1999-07-13 Pan Pacific Semiconductor Co., Ltd. Method for semiconductor chip packaging

Also Published As

Publication number Publication date
GB2350928A (en) 2000-12-13
GB9913516D0 (en) 1999-08-11
GB9923463D0 (en) 1999-12-08

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20081006