GB2327028A - Thin film type heater and method of manufacturing the same - Google Patents
Thin film type heater and method of manufacturing the same Download PDFInfo
- Publication number
- GB2327028A GB2327028A GB9811901A GB9811901A GB2327028A GB 2327028 A GB2327028 A GB 2327028A GB 9811901 A GB9811901 A GB 9811901A GB 9811901 A GB9811901 A GB 9811901A GB 2327028 A GB2327028 A GB 2327028A
- Authority
- GB
- United Kingdom
- Prior art keywords
- thin film
- film type
- layer
- type heater
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000010410 layer Substances 0.000 claims abstract description 66
- 238000010438 heat treatment Methods 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000011241 protective layer Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 6
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 8
- 229910003862 HfB2 Inorganic materials 0.000 claims description 6
- 229910018487 Ni—Cr Inorganic materials 0.000 claims description 6
- 229910004490 TaAl Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229910052681 coesite Inorganic materials 0.000 claims description 4
- 229910052906 cristobalite Inorganic materials 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910003465 moissanite Inorganic materials 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 229910052682 stishovite Inorganic materials 0.000 claims description 4
- 229910052905 tridymite Inorganic materials 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- -1 Sino2 Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000008236 heating water Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
- Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
A thin film type heater including a substrate 10, a plurality of single thickness unit heating layers 20 coated on the substrate 10 in a predetermined pattern, an electrode layer 30 for interconnecting the unit heating layers to form a current path and a protective layer 40 for protecting the heating layer 20 and the electrode layer 30. The method of manufacture involves using a metal mask to define the area of cover for each of the three individual layers. Connection terminals 31 are provided for connection of the heater to an electrical supply. The heater can be used in apparatus such as a boiler-type humidifier of a water heater.
Description
THIN FIlM TYPE HEATER AND METHOD
OF MANUFACTURING THE SAME
The present invention relates to a thin film type heater used as a heat source in a boiler type humidifier or a water heater, and a method of manufacturing the same.
In general, a boiler type humidifier generates vapours by heating water in a water tank and blows the vapours through a ventilator. In doing so, the amount of heat of the heater should be controlled to control the amount of vapor generated. The heater adapted for the boiler type humidifier mainly employs a nichrome wire or a bar heater having a desired resistance. The amount of heat of the heater changes by changing the resistance of an electrical contact, or by controlling the current passing through the heater.
In the conventional heater, the initial heating time required for normal humidification is high, and the contact point between electrodes may be short due to excess heat generated at the contact point.
With a view to solve or reduce the above problems, it is an aim of embodiments of the present invention to provide a thin film type heater in which a material having good electric resistance is employed to maximize an instantaneous heating efficiency capable of being miniaturized, and a method of manufacturing the same.
According to an aspect of the invention, there is provided a thin film type heater comprising: a substrate; a plurality of unit heating layers coated on the substrate in a predetermined pattern; an electrode layer for interconnecting the unit heating layers to form a current path; and a protective layer coated on the substrate for protecting the heating layer and the electrode layer.
Preferably, the heating layer is formed of one selected from the group consisting of TaAl, Ni-Cr alloy,
SnO2, HfB2 and Ta.
The heater may comprise a connection terminal for supplying current to the heating layer.
Preferably, the electrode layer is formed of one selected from the group consisting of Al, Au, Ag, RuO2 and
Pt.
The protective layer may be formed of one selected from the group consisting of Si3N4, SiO2 and SiC.
The protective layer is preferably formed along upper surfaces of the heating layer and the electrode layer to have a predetermined thickness.
According to another aspect of the invention, there is provided a method of manufacturing a thin film type heater comprising the steps of: (a) coating a thin film on a substrate with one selected from the group consisting of
TaAl, Ni-Cr alloy, Sino2, HfB2 and Ta in a predetermined pattern to from a unit heating layer; (b) forming an electrical path by interconnecting the unit heating layers to an electrode layer on the substrate; and (c) forming a protective layer on the substrate to protect the heating layer and the electrode layer.
For a better understanding of the invention, and to show how embodiments of the same may be carried into effect, reference will now be made, by way of example, to the accompanying diagrammatic drawings, in which:
Figure 1 is a schematic sectional view of a thin film type heater according to an embodiment of the present invention;
Figure 2 is a schematic plan view of the thin film type heater of Figure 1; and
Figures 3A through 3C are plan views for illustrating a method of manufacturing a thin film type heater according to embodiments of the present invention.
Referring to Figures 1 and 2, a thin film type heater according to an embodiment of the present invention comprises a plurality of unit heating layers 20 coated on a substrate 10 in a predetermined pattern, an electrode layer 30 coated on the substrate 10 interconnecting the unit heating layers 20 to form a current path, and a protective layer 40 coated on the unit heating layers 20, the electrode layer 30 and the substrate 10 for protecting the heating layers 20 and the electrode layer 30.
Reference numeral 31 indicates a connection terminal for supplying current to the heating layer 20, which is electrically connected to a main circuit substrate of, for instance, a boiler-type humidifier or a water heater through wire-bonding.
Preferably, the substrate 10 is a glass substrate, and the heating layer 20, the electrode layer 30 and the protective layer 40 are formed through a dry coating method such as PVD or CVD using a metal mask.
It is also preferable that the heating layer 20 is coated with a material selected from the group consisting of TaAl, Ni-Cr alloy, SnO2, HfB2 and Ta, and the electrode layer 30 is coated with a material selected from the group consisting of Al, Au, Ag, RuO2 and Pt having high electrical conductivity.
The protective layer 40 formed of a dielectric is coated with a material selected from the group consisting of Si3N4, SiO2 and SiC, along the upper surface line of the heating layer 20 and the electrode layer 30.
When current is applied through the connection terminal 31, the current flows to the unit heating layers 20 through the electrode layer 30, to thereby generate heat from the unit heating layers due to their electrical resistance. The material used for the heating layer 20 has a high electrical resistance so that it heats up to a desired temperature in a short time.
A method of manufacturing the thin film type heater will be described with reference to Figures 3A through 3C.
As shown in Figure 3A, a metal mask (not shown) where a unit heating layer pattern is formed covers a cleaned glass substrate 10, and the substrate 10 is heated to 200 - 5000C in a vacuum chamber of 5 x 10-7 torr, and then an argon (Ar) gas is injected and a material from the group consisting of TaAl, Ni-Cr alloy, SnO2, HfB2 and Ta is coated through PVD or CVD, to form a unit heating layer 20. At this time, the surface area and the thickness of the unit heating layer 20 can be controlled according to a desired electric resistance value.
Then, a metal mask (not shown) for forming an electrode covers the substrate 10 where the heating layer 20 is formed, and a material selected from the group consisting of Al, Au, Ag, RuO2 and Pt having good electrical conductivity is coated on the resultant in a vacuum chamber through PVD or CVD, to form an electrode layer 30 as shown in Figure 3B. At this time, the surface area and the thickness of the coated electrode layer 30 can be appropriately controlled according to the desired electric resistance value.
As shown in Figure 3C, a protective layer 40 for protecting the unit heating layer 20 and the electrode layer 30 is formed. That is, a metal mask (not shown) for forming a protective layer covers the substrate 10 where the heating layer 20 and the electrode layer 30 are formed and a material selected from the group consisting of Si3N4,
SiO2 and SiC is coated in a vacuum chamber through PVD or
CVD. At this time, preferably, the protective layer 40 is coated to have a predetermined thickness along the upper surface line of the unit heating layer 20 and the electrode layer 30.
According to the thin film type heater of embodiments of the present invention, a material having good electric resistance is adopted so that the initial heating time is short. Also, a small heater can be manufactured by thinfilm coating so that the heater can be uniformly formed on, for example, the entire inner surface of the water tank, to thereby maximize the instantaneous heating efficiency.
The reader's attention is directed to all papers and documents which are filed concurrently with or previous to this specification in connection with this application and which are open to public inspection with this specification, and the contents of all such papers and documents are incorporated herein by reference.
All of the features disclosed in this specification (including any accompanying claims, abstract and drawings), and/or all of the steps of any method or process so disclosed, may be combined in any combination, except combinations where at least some of such features and/or steps are mutually exclusive.
Each feature disclosed in this specification (including any accompanying claims, abstract and drawings), may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Thus, unless expressly stated otherwise, each feature disclosed is one example only of a generic series of equivalent or similar features.
The invention is not restricted to the details of the foregoing embodiment(s). The invention extends to any novel one, or any novel combination, of the features disclosed in this specification (including any accompanying claims, abstract and drawings), or to any novel one, or any novel combination, of the steps of any method or process so disclosed.
Claims (9)
1. A thin film type heater comprising:
a substrate;
a plurality of unit heating layers coated on the substrate in a predetermined pattern;
an electrode layer for interconnecting the unit heating layers to form a current path; and
a protective layer coated on the substrate for protecting the heating layer and the electrode layer.
2. The thin film type heater of claim 1, wherein the heating layer is formed of one selected from the group consisting of TaAl, Ni-Cr alloy, SnO2, HfB2 and Ta.
3. The thin film type heater of claim 1 or 2, further comprising a connection terminal for supplying current to the heating layer.
4. The thin film type heater of claim 1, 2 or 3, wherein the electrode layer is formed of one selected from the group consisting of Al, Au, Ag, RuO2 and Pt.
5. The thin film type heater of claim 1, 2, 3 or 4, wherein the protective layer is formed of one selected from the group consisting of Si3N4, SiO2 and SiC.
6. The thin film type heater of any of the preceding claims, wherein the protective layer is formed along upper surfaces of the heating layer and the electrode layer to have a predetermined thickness.
7. A method of manufacturing a thin film type heater comprising the steps of:
(a) coating a thin film on a substrate with one selected from the group consisting of TaAl, Ni-Cr alloy,
SnO2, HfB2 and Ta in a predetermined pattern to from a unit heating layer;
(b) forming an electrical path by interconnecting the unit heating layers to an electrode layer on the substrate; and
(c) forming a protective layer on the substrate to protect the heating layer and the electrode layer.
8. A thin film type heater substantially as herein described, with reference to the accompanying drawings.
9. A method of manufacturing a thin film type heater, the method being substantially as herein described with reference to the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019970024281A KR100213110B1 (en) | 1997-06-12 | 1997-06-12 | Thin film heater and its manufaturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9811901D0 GB9811901D0 (en) | 1998-07-29 |
| GB2327028A true GB2327028A (en) | 1999-01-06 |
Family
ID=19509321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9811901A Withdrawn GB2327028A (en) | 1997-06-12 | 1998-06-04 | Thin film type heater and method of manufacturing the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPH1131577A (en) |
| KR (1) | KR100213110B1 (en) |
| CN (1) | CN1202602A (en) |
| GB (1) | GB2327028A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1531651A2 (en) * | 2003-11-11 | 2005-05-18 | Olympus Corporation | Heating device |
| US7531016B2 (en) | 2002-03-29 | 2009-05-12 | Casio Computer Co., Ltd. | Chemical reaction apparatus and power supply system |
| US8873941B2 (en) | 2007-06-05 | 2014-10-28 | Resmed Limited | Electrical heater with particular application to humidification and fluid warming |
| US9063041B2 (en) | 2012-11-30 | 2015-06-23 | General Electric Company | Device and method for drying biological sample on substrate |
| EP3714930A1 (en) * | 2011-06-16 | 2020-09-30 | ResMed Pty Ltd | Humidifier with layered heating element |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100352892B1 (en) * | 2000-05-22 | 2002-09-16 | 주식회사 팍스텍 | Method for manufacturing thin film heating material and heating device thereof |
| TW592830B (en) | 2002-03-29 | 2004-06-21 | Casio Computer Co Ltd | Chemical reaction apparatus and power supply system |
| KR100577406B1 (en) * | 2003-09-17 | 2006-05-10 | 박재상 | Heater manufacturing method and heater using PCC method |
| CN101294854B (en) * | 2007-04-23 | 2010-12-01 | 博奥生物有限公司 | A chip heating device |
| KR100915708B1 (en) * | 2007-08-31 | 2009-09-04 | 한국기계연구원 | Heating substrate equipped with conductive-thin-film and electrode and manufacturing method of the same |
| US8765214B2 (en) * | 2008-11-20 | 2014-07-01 | Oerlikon Trading Ag, Truebbach | Cleaning method for coating systems |
| JP5603601B2 (en) * | 2010-01-15 | 2014-10-08 | 株式会社ブリヂストン | Heater unit |
| JP5842782B2 (en) * | 2012-10-17 | 2016-01-13 | 株式会社デンソー | Radiation heater device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4296309A (en) * | 1977-05-19 | 1981-10-20 | Canon Kabushiki Kaisha | Thermal head |
| GB2091527A (en) * | 1981-01-14 | 1982-07-28 | Boussois Sa | Heatable Panels |
| GB2154403A (en) * | 1984-01-31 | 1985-09-04 | Glaverbel | Heatable glazing panels |
| WO1986006241A1 (en) * | 1985-04-15 | 1986-10-23 | Email Limited | Heating element |
| US5189284A (en) * | 1988-02-29 | 1993-02-23 | Fuji Xerox Co., Ltd. | Resistor, process for producing the same, and thermal head using the same |
-
1997
- 1997-06-12 KR KR1019970024281A patent/KR100213110B1/en not_active IP Right Cessation
-
1998
- 1998-06-01 CN CN98108722A patent/CN1202602A/en active Pending
- 1998-06-04 GB GB9811901A patent/GB2327028A/en not_active Withdrawn
- 1998-06-08 JP JP10159658A patent/JPH1131577A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4296309A (en) * | 1977-05-19 | 1981-10-20 | Canon Kabushiki Kaisha | Thermal head |
| GB2091527A (en) * | 1981-01-14 | 1982-07-28 | Boussois Sa | Heatable Panels |
| GB2154403A (en) * | 1984-01-31 | 1985-09-04 | Glaverbel | Heatable glazing panels |
| WO1986006241A1 (en) * | 1985-04-15 | 1986-10-23 | Email Limited | Heating element |
| US5189284A (en) * | 1988-02-29 | 1993-02-23 | Fuji Xerox Co., Ltd. | Resistor, process for producing the same, and thermal head using the same |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7531016B2 (en) | 2002-03-29 | 2009-05-12 | Casio Computer Co., Ltd. | Chemical reaction apparatus and power supply system |
| EP1531651A2 (en) * | 2003-11-11 | 2005-05-18 | Olympus Corporation | Heating device |
| EP1531651A3 (en) * | 2003-11-11 | 2005-06-22 | Olympus Corporation | Heating device |
| US7049556B2 (en) | 2003-11-11 | 2006-05-23 | Olympus Corporation | Heating device |
| US8873941B2 (en) | 2007-06-05 | 2014-10-28 | Resmed Limited | Electrical heater with particular application to humidification and fluid warming |
| US11786691B2 (en) | 2007-06-05 | 2023-10-17 | ResMed Pty Ltd | Electrical heater with particular application to humidification and fluid warming |
| EP3714930A1 (en) * | 2011-06-16 | 2020-09-30 | ResMed Pty Ltd | Humidifier with layered heating element |
| US10940285B2 (en) | 2011-06-16 | 2021-03-09 | ResMed Pty Ltd | Humidifier and layered heating element |
| US11504495B2 (en) | 2011-06-16 | 2022-11-22 | ResMed Pty Ltd | Humidifier and layered heating element |
| US12168100B2 (en) | 2011-06-16 | 2024-12-17 | ResMed Pty Ltd | Humidifier and layered heating element |
| US9063041B2 (en) | 2012-11-30 | 2015-06-23 | General Electric Company | Device and method for drying biological sample on substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| KR19990001077A (en) | 1999-01-15 |
| GB9811901D0 (en) | 1998-07-29 |
| CN1202602A (en) | 1998-12-23 |
| KR100213110B1 (en) | 1999-08-02 |
| JPH1131577A (en) | 1999-02-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |