GB2322237A - Ground conductor-based coplanar waveguide line - Google Patents
Ground conductor-based coplanar waveguide line Download PDFInfo
- Publication number
- GB2322237A GB2322237A GB9800737A GB9800737A GB2322237A GB 2322237 A GB2322237 A GB 2322237A GB 9800737 A GB9800737 A GB 9800737A GB 9800737 A GB9800737 A GB 9800737A GB 2322237 A GB2322237 A GB 2322237A
- Authority
- GB
- United Kingdom
- Prior art keywords
- conductor
- dielectric substrate
- ground conductors
- ground
- output end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/003—Coplanar lines
Landscapes
- Waveguides (AREA)
Abstract
A coplanar waveguide line comprising ground conductors 11, 12 on either side of the signal line conductor 13 mounted on a dielectric substrate 15, and a further ground conductor 16 on the base of the substrate includes means for electrically connecting the first ground conductors to the base ground conductor at the input and output faces 15a, 15b of the substrate. The connecting means may comprise through holes 17, (27 see fig 5), end plates (37, see fig 9, or 47, see fig 12), or side plates (54, see fig 15), or 64. By having grounding connection at the input and output ends, reflection loss can be reduced.
Description
Specification
Title of the Invention
Ground Conductor-Backed Coplanar Waveguide Line
Background of the Invention
The present invention relates to a ground conductor-backed coplanar waveguide line and, more particularly, to a coplanar waveguide line which improves the reflection characteristics of input and output in a high frequency range.
Conventionally, as a line for transmitting a high-frequency signal, a coplanar waveguide line (to be abbreviated as a CPW line hereinafter) is used because it has low dispersion characteristics, low radiation loss, and a low inductance and because it is not easily influenced by variations in thickness of the substrate.
As a CPW line, one obtained by forming a signal line conductor on a dielectric substrate and forming ground conductors on the two sides of the signal line conductor to be separate from it by predetermined distances is generally used. Also, as shown in "ANALYSIS OF
CONDUCTOR-BACKED COPLANAR WAVEGUIDE", ELECTRONICS
LETTERS, Vol. 18, No. 12, pp. 538-540, June 1982 and A HIGH PERFORMANCE QUARTZ PACKAGE FOR MILLIMETER-WAVE
APPLICATION", IEEE MTT-S Digest, pp. 1063-1066, a ground conductor-backed CPW line in which a ground conductor is formed also on the lower surface of the CPW line and electrically connected to the ground conductors on the upper surface of the CPW line is also used often, because it can be grounded easily when it is packaged.
Figs. 19 to 21 show an example of a conventional ground conductor-backed CPW line.
Referring to Fig. 19, this CPW line has a dielectric substrate 75 made of alumina or the like, and circuit patterns are formed on the upper and lower surfaces of the dielectric substrate 75 by printed wiring techniques. More specifically, as shown in Fig. 20, as the circuit patterns, a signal line conductor 73 and first and second ground conductors 71 and 72 are formed on the upper surface of the dielectric substrate 75, and a third ground conductor 76 is formed on the lower surface of the dielectric substrate 75. Generally, as shown in Fig. 21, the first, second, and third ground conductors 71, 72, and 76 are electrically connected to each other through through-holes 74, which are obtained by filling the through-holes of the dielectric substrate 75 with conductors 77, so that their potentials become equal to each other. As shown in Fig. 19, the through-holes 74 are arranged along the signal line conductor 73 equidistantly and symmetrically with respect to it, so that the electromagnetic field distributions of a transmission signal become symmetric.
In the conventional ground conductor-backed
CPW line having the arrangement described above, portions (Fig. 21) where the first and second ground conductors 71 and 72 are electrically connected to the third ground conductor 76 through the through-holes 74 and portions (Fig. 20) where they are not present alternate along the line. For this reason, when a transmission signal is in a high frequency range, an electric potential distribution is generated in the first and second ground conductors 71 and 72, and the potential changes moderately along the line. Then, the characteristic impedance of the line also changes moderately along the line. Where the first and second ground conductors 71 and 72 are electrically connected to the third ground conductor 76 through the through-holes 74 located on the line N - N of Fig. 19, the characteristic impedance becomes the closest to a desired value.
However, between the through-holes 74 located on the line M - M of Fig. 19, in other words, where the first and second ground conductors 71 and 72 are not electrically connected to the third ground conductor 76 through the through-holes 74, the characteristic impedance becomes the farthest from the desired value.
As a result, in the high frequency range, reflection occurs at all the portions along the line. In particular, if the first and second ground conductors 71 and 72 and the third ground conductor 76 are not electrically connected to each other near the input and output, impedance mismatching occurs on the input and output end faces with respect to the external circuits, and the reflection loss in the high frequency range therefore becomes larger than that in the low frequency range.
Summary of the Invention
It is an coject or at least the preferred bodnts of the present invention to provide a coplanar waveguide line which has good input/output reflection characteristics in the high frequency range.
According to the present invention, there is provided a coplanar waveguide line comprising a signal line conductor formed on one surface of a dielectric substrate, first and second ground conductors formed on two sides of the signal line conductor to be separate therefrom by a predetermined distance, a third ground conductor formed on the other surface of the dielectric substrate, first connecting means for electrically connecting one or both of the first and second ground conductors and the third ground conductor to each other on an input end face of the dielectric substrate, and second connecting means for electrically connecting one or both of the first and second ground conductors and the third ground conductor to each other on an output end face of the dielectric substrate.
In another aspect the invention provides a method of reducing transmission loss along a coplanar waveguide line comprising forming a signal line conductor on one surface of a dielectric substrate; forming first and second ground conductors on two sides of said signal line conductor to be separate therefrom by a predetermined distance; forming a third ground conductor on the other surface of said dielectric substrate; connecting first electrical connecting means between at least one of said first and second ground conductors and said third ground conductor to each on an input end face of said dielectric substrate; and connecting second electrical connecting means between at least one of said first and second ground conductors and said third ground conductor or an output end face of said dielectric substrate.
Brief Description of the Drawings
Fig. 1 is a perspective view of a coplanar waveguide line according to the first embodiment of the present invention;
Fig. 2 is a sectional view taken along the Line A - A of Fig. 1;
Fig. 3 is a sectional view taken along the line B - B of Fig. 1;
Fig. 4 is a sectional view taken along the line C - C of Fig. 1:
Fig. 5 is a perspective view of a coplanar waveguide line according to the second embodiment of the present invention;
Fig. 6 is a sectional view taken along the line D - D of Fig. 5;
Fig. 7 is a sectional view taken along the line E - E of Fig. 5;
Fig. 8 is a sectional view taken along the line F - F of Fig. 5;
Fig. 9 is a perspective view of a coplanar waveguide line according to the third embodiment of the present invention;
Fig. 10 is a sectional view taken along the line G - G of Fig. 9;
Fig. 11 is a sectional view taken along the line H - H of Fig. 9;
Fig. 12 is a perspective view of a coplanar waveguide line according to the fourth embodiment of the present invention;
Fig. 13 is a sectional view taken along the line I - I of Fig. 12;
Fig. 14 is a sectional view taken along the line J - J of Fig. 12;
Fig. 15 is a perspective view of a coplanar waveguide line according to the fifth embodiment of the present invention;
Fig. 16 is a sectional view taken along the line K - K of Fig. 15;
Fig. 17 is a perspective view of a coplanar waveguide line according to the sixth embodiment of the present invention;
Fig. 18 is a sectional view taken along the line L - L of Fig. 17;
Fig. 19 is a perspective view of a conventional coplanar waveguide line;
Fig. 20 is a sectional view taken along the line M - M of Fig. 19; Fig. 21 is a sectional view taken along the line N - N of Fig. 19; Fig. 22 is a graph showing S11 characteristics of the conventional example and of the first embodiment of the present invention; and
Fig. 23 is a graph showing S11 characteristics of the conventional example and of the second embodiment of the present invention.
Description of the Preferred Embodiments
The present invention will be described in detail by iay of exmple and with reference to the accompanying drawis.
Fig. 1 shows a coplanar waveguide line according to the first embodiment of the present invention, Fig. 2 shows a section taken along the line A - A of Fig. 1, Fig. 3 shows a section taken along the line B - B of Fig. 1, and Fig. 4 shows a section taken along the line C - C of Fig. 1. Referring to Figs. 1 and 2, the CPW line is constituted by a dielectric substrate 15, a signal line conductor 13 formed at the center of the upper surface of the dielectric substrate 15, first and second ground conductors 11 and 12 formed on the two sides of the signal line conductor 13 to be equidistant from it, and a third ground conductor 16 formed on the entire lower surface of the dielectric substrate 15.
As the dielectric substrate 15, an alumina thin plate having a thickness of 250 Rm is used. The width of the signal line, i.e., the width of the signal line conductor 13 is 240 Sm, the distance between the signal line conductor 13 and each of the first and second ground conductors 11 and 12 is 400 pm, and the line length of the signal line conductor 13 is 900 zm.
As shown in Figs. 3 and 4, the first, second, and third ground conductors 11, 12, and 16 are electrically connected to each other through first through-holes 14 having a circular cross section and second through-holes 17 having a semi-elliptic cross section, so that their potentials become equal to each other. The first and second through-holes 14 and 17 are arranged in two rows axi-symmetrically with respect to the signal line conductor 13.
Assume that the first through-holes 14 are defined as those obtained by plating the wall surfaces of the through-holes formed in the dielectric substrate 15, or by filling the through-holes with a conductor.
The hole diameter of the first through-holes 14 is 150 Wm, and the distance between the first and second through-holes 14 and 17 that are adjacent to each other in the longitudinal direction of the line is 450 Cun.
On an input end face 15a and an output end face 15b of the dielectric substrate 15, the second through-holes 17 electrically connect the first and second ground conductors 11 and 12, and the third ground conductor 16 to each other through long grooves from each end face to near each end face. The second through-holes 17 are open in the three surfaces, i.e., the upper and lower surfaces of the dielectric substrate 15 and the input or output end face 15a or 15b. The shape of each through-hole 17 is not limited to a
U-groove but can be arbitrary, e.g., a V-groove.
In the coplanar waveguide line having the above arrangement, the second through-holes 17 electrically connect the first and second ground conductors 11 and 12, and the third ground conductor 16 to each other on the input and output end faces 15a and 15b of the dielectric substrate 15. Therefore, the characteristic impedance at the input and output end faces 15a and 15b can be set at a constant value through a wide frequency range. As a result, the impedance mismatching at the input and output end faces 15a and 15b with respect to the external circuits is solved, and the reflection loss can accordingly be decreased.
Fig. 22 shows Sl1 characteristics (input reflection characteristics) obtained as a result of electromagnetic field analysis of the conventional line shown in Fig. 19 and the line according to the present invention shown in Fig. 1. As shown in Fig. 22, the effect of improvement conspicuously appears in the line of the present invention in the high frequency range.
Fig. 5 shows a coplanar waveguide line according to the second embodiment of the present invention, Fig. 6 shows a section taken along the line D - D of Fig. 5, Fig. 7 shows a section taken along the line E - E of Fig. 5, and Fig. 8 shows a section taken along the line F - F of Fig. 5. Referring to Figs. 5 and 6, the CPW line is constituted by a dielectric substrate 25, a signal line conductor 23, and first, second, and third ground conductors 21, 22, and 26, in the same manner as in the first embodiment. The basic arrangement of the second embodiment is accordingly the same as that of the first embodiment. The first, second, and third ground conductors 21, 22, and 26 are electrically connected to each other through first through-holes 24a and 24b, that are arranged in two rows on the two sides of the signal line conductor 23, and second through-holes 27, so that their potentials become equal to each other.
The first through-holes 24a formed in the first ground conductor 21 and the first through-holes 24b formed in the second ground conductor 22 are shifted from each other by half a pitch in the longitudinal direction of the line. The first and second ground conductors 21 and 22 are electrically connected to the ground conductor 26 through the long groove-like second through-holes 27 on an output end face 25b and an input end face 25a, respectively, of the dielectric substrate 25.
In the coplanar waveguide line having the above arrangement as well, the characteristic impedance at the input and output end faces 25a and 25b can be set at a constant value through a wide frequency range, in the same manner as in the first embodiment. As a result, the impedance mismatching at the input and output end faces 25a and 25b with respect to the external circuits is solved, and the reflection loss can accordingly be decreased.
Fig. 23 shows Sll characteristics obtained as a result of electromagnetic field analysis of the conventional line shown in Fig. 19 and the line according to the present invention shown in Fig. 5. The effect of improvement according to the present invention appears conspicuously in the high frequency range.
Fig. 9 shows a coplanar waveguide line according to the third embodiment of the present invention, Fig. 10 shows a section taken along the line
G - G of Fig. 9, and Fig. 11 shows a section taken along the line H - H of Fig. 9. Referring to Figs. 9 and 11, the CPW line is constituted by a dielectric substrate 35, a signal line conductor 33, and first, second, and third ground conductors 31, 32, and 36. The basic arrangement of the third embodiment is accordingly the same as that of the first embodiment. The first, second, and third ground conductors 31, 32, and 36 are electrically connected to each other through through-holes 34 arranged axi-symmetrically on the two sides of the signal line conductor 33, so that their potentials become the same.
As shown in Fig. 10, plating layers 37 for electrically connecting the first and second ground conductors 31 and 32, and the third ground conductor 36 to each other are formed on the input and output end faces of the dielectric substrate 35. In the CPW line having this arrangement as well, the same effect as those of the first and second embodiments described above can be obtained.
Fig. 12 shows a coplanar waveguide line according to the fourth embodiment of the present invention, Fig. 13 shows a section taken along the line
I - I of Fig. 12, and Fig. 14 shows a section taken along the line J - J of Fig. 12. Referring to Figs. 12 and 14, the CPW line is constituted by a dielectric substrate 45, a signal line conductor 43, and first, second, and third ground conductors 41, 42, and 46. The basic arrangement of the fourth embodiment is accordingly the same as that of the first embodiment.
The first, second, and third ground conductors 41, 42, and 46 are electrically connected to each other through through-holes 44 arranged axi-symmetrically on the two sides of the signal line conductor 43, so that their potentials become the same.
As shown in Figs. 12 and 13, plating surfaces 47 for electrically connecting the first and third ground conductors 41 and 46 to each other on the input side, and for electrically connecting the second and third ground conductors 42 and 46 to each other on the output side are formed on the input and output end faces of the dielectric substrate 45. In the CPW line having this arrangement as well, the reflection loss in the high frequency range can be decreased, in the same manner as in the respective embodiments described above.
Fig. 15 shows a coplanar waveguide line according to the fifth embodiment of the present invention, and Fig. 16 shows a section taken along the line K - K of Fig. 15. Referring to Fig. 15, the CPW line is constituted by a dielectric substrate 55, a signal line conductor 53, and first, second, and third ground conductors 51, 52, and 56. The basic arrangement of the fifth embodiment is accordingly the same as that of the first embodiment.
As shown in Fig. 16, the first, second, and third ground conductors 51, 52, and 56 are electrically connected to each other through plating layers 54, which are formed on the two opposing side surfaces of the dielectric substrate 55 that perpendicularly intersect the input and output end faces of the dielectric substrate 55, so that their potentials become the same.
The plating layers 54 electrically connect the first and second ground conductors 51 and 52, and the third ground conductor 56 to each other throughout the entire line length from the input end to the output end of the line.
The width of each of the first and second ground conductors 51 and 52 is set almost the same as the width of the signal line conductor 53. More specifically, the width of each of the first and second ground conductors 51 and 52 is set to 100 gm.
In this embodiment as well, the reflection loss in the high frequency range can be decreased, in the same manner as in the respective embodiments described above.
Fig. 17 shows a coplanar waveguide line according to the sixth embodiment of the present invention, and Fig. 18 shows a section taken along the line L - L of Fig. 17. Referring to Fig. 17, the CPW line is constituted by a dielectric substrate 65, a signal line conductor 63, and first, second, and third ground conductors 61, 62, and 66. The basic arrangement of the sixth embodiment is accordingly the same as that of the first embodiment.
The width of each of the first and second ground conductors 61 and 62 is set to almost equal the width of the signal line conductor 63. The two side surfaces of the dielectric substrate 65 that perpendicularly intersect the input and output end faces thereof are sandwiched with two metal plates 64 each having the same thickness as that of the dielectric substrate 65. These metal plates 64 electrically connect the first and second ground conductors 61 and 62, and the third ground conductor 66 to each other from the input end to the output end.
In this arrangement as well, the reflection loss in the high frequency range can be decreased, in the same manner as in the respective embodiments described above.
In the embodiments described above, alumina is employed as the material of the dielectric substrates 15, 25, 35, 45, 55, and 65. However, the present invention is not limited to this, and any dielectric material can be used. The width of the signal line, the distance between the signal line and each of the first and second ground conductors, the diameter of each through-hole, and the distance between the adjacent through-holes are not limited to the values described above.
As has been described above, in the coplanar waveguide line according to the present invention, the characteristic impedance at the input and output end faces can be set at a constant value through a wide frequency range. As a result, the impedance mismatching at the input and output end faces with respect to the external circuits is solved, and the input/output reflection characteristics can accordingly be improved.
Each feature disclosed in this specification (which term includes the claims) and/or shown in the drawings may be incorporated in the invention independently of other disclosed and/or illustrated features.
The text of the abstract filed herewith is repeated below as part of the specification.
A coplanar waveguide line includes a signal line conductor, first and second ground conductors, a third ground conductor, and first and second through-holes, plating layers, or metal plates. The signal line conductor is formed on one surface of a dielectric substrate. The first and second ground conductors are formed on two sides of the signal line conductor to be separate from it by a predetermined distance. The third ground conductor is formed on the other surface of the dielectric substrate. The first through-holes, plating layers, or metal plates electrically connect one or both of the first and second ground conductors and the third ground conductor each other on an input end face of the dielectric substrate. The second through-holes, plating layers or metal plates electrically connect one or both of the first and second ground conductors and the third ground conductor to each other on an output end face of the dielectric substrate.
Claims (20)
1. A coplanar waveguide line characterized by comprising:
a signal line conductor (13, 23, 33, 43, 53, 63) formed on one surface of a dielectric substrate;
first and second ground conductors (11, 21, 31, 41, 51, 61; 12, 22, 32, 42, 52, 62) formed on two sides of said signal line conductor to be separate therefrom by a predetermined distance;
a third ground conductor (16, 26, 36, 46, 56, 66) formed on the other surface of said dielectric substrate;
first connecting means (17, 27, 37, 47, 54, 64) for electrically connecting at least one of said first and second ground conductors and said third ground conductor to each other on an input end face (15a, 25a) of said dielectric substrate; and
second connecting means (17, 27, 37, 47, 54, 64) for electrically connecting at least one of said first and second ground conductors and said third ground conductor to each other on an output end face (lSb, 25b) of said dielectric substrate.
2. A line according to claim 1, wherein said first and second connecting means comprise through-holes (17, 27) formed in said dielectric substrate to connect said first and second ground conductors to each other and to expose said input and output end faces of said dielectric substrate.
3. A line according to claim 1, wherein said first and second connecting means comprise plating layers (37, 47) formed on said input and output end faces of said dielectric substrate to connect said first and second ground conductors to each other.
4. A line according to claim 1, wherein said first and second connecting means comprise plating layers (54) formed on side surfaces of said dielectric substrate that perpendicularly intersect said input and output end faces thereof to connect said first and second ground conductors to each other.
5. A line according to claim 4, wherein
said plating layers connect said first and second ground conductors, and said third ground conductor to each other from said input end face to said output end face throughout an entire length of said signal line conductor, and
each of said first and second ground conductors has a width which is substantially equal to a width of said signal line conductor.
6. A line according to claim l, wherein said first and second connecting means comprise a pair of conductor plates (64) formed on side surfaces of said dielectric substrate that perpendicularly intersect said input and output end faces thereof to sandwich said dielectric substrate in a widthwise direction and to connect said first and second ground conductors to each other.
7. A line according to claim 6, wherein
said conductor plates connect said first and second ground conductors, and said third ground conductor to each other from said input end face to said output end face throughout an entire length of said signal line conductor, and
each of said first and second ground conductors has a width which is substantially equal to a width of said signal line conductor.
8. A method of reducing transmission loss along a coplanar waveguide line comprising
the steps of:
forming a signal line conductor on one surface of a dielectric substrate;
forming first and second ground conductors on two sides of said signal line
conductor to be separate therefrom by a predetermined distance;
forming a third ground conductor on the other surface of said dielectric
substrate;
connecting first electrical connecting means between at least one of said first
and second ground conductors and said third ground conductor to each other on an
input end face of said dielectric substrate; and
connecting second electrical connecting means between at least one of said first
and second ground conductors and said third ground conductor on an output end face
of said dielectric substrate.
9. A method according to Claim 8, wherein said formation of said first and second
connecting means comprises the steps of
forming through-holes formed in said dielectric substrate to connect said first
and second ground conductors to each other and to expose said input and output end
faces of said conductor.
10. A method according to Claim 8, wherein said formation of first and second connecting
means comprises the step of
plating layers formed on said input and output end faces of said dielectric substrate to connect said first and second ground conductors to each other.
11. A method according to Claim 8, wherein said formation of first and second
connecting means comprises the step of
forming plating layers on side surfaces of said dielectric substrate that
perpendicularly intersect said input and output and faces thereof to connect said first
and second ground conductors to each other.
12. A method according to Claims 11 and 12, wherein the formation of plating layers
further comprises the step of
connecting said first and second ground conductors with said plating layers to
said third ground conductor from said input end face to said output end face
throughout an entire length of said signal line conductor.
13. A method according to Claim 8, wherein the formation of said first and second
connecting means comprises the step of
forming a pair of conductor plates on side surfaces of said dielectric substrate
that perpendicularly intersect said input and output end faces thereof;
sandwiching said dielectric substrate in a widthwise direction between said pair
of conductor plates; and
connecting said first and second ground conductors to each other
14. A method according to Claim 13, wherein the formation of said conducting plates
further comprises the step of
connecting said first and second ground conductors and said third ground
conductor to each other from said input end face to said output end face throughout
an entire length of said signal line conductor.
15. A method according to Claim 12 or 14, wherein each of said first and second ground
conductors is formed with a width substantially equal to a width of said signal line
conductor.
16. A method of reducing transmission loss according to any of Claims 8 to 15 in the
frequency range above 50 GHz.
17. A method of reducing transmission loss according to any of Claims 8 to 15 in the
frequency range above 50 to 60 GHz.
18. A method of reducing transmission loss according to any of Claims 8 to 15 in the
frequency range above 20 to 25 GHz.
19. A coplanar waveguide line substantially as described herein and as illustrated by
figures 1 to 18 of the accompanying drawings.
20. A method of reducing transmission loss along a coplanar waveguide substantially as
described herein and as illustrated by Figures 1 to 18 of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9004530A JPH10200311A (en) | 1997-01-14 | 1997-01-14 | Coplanar waveguide line with back ground conductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9800737D0 GB9800737D0 (en) | 1998-03-11 |
| GB2322237A true GB2322237A (en) | 1998-08-19 |
Family
ID=11586609
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9800737A Withdrawn GB2322237A (en) | 1997-01-14 | 1998-01-14 | Ground conductor-based coplanar waveguide line |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH10200311A (en) |
| GB (1) | GB2322237A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1058335A2 (en) * | 1999-06-03 | 2000-12-06 | Murata Manufacturing Co., Ltd. | High-frequency circuit device and communication apparatus using the same |
| EP1126540A2 (en) * | 2000-02-16 | 2001-08-22 | Murata Manufacturing Co., Ltd. | Circuit for suppression of spurious modes on planar transmission lines |
| WO2010003665A1 (en) | 2008-07-09 | 2010-01-14 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Stripe line having plated through holes |
| WO2019094477A1 (en) * | 2017-11-10 | 2019-05-16 | Raytheon Company | Millimeter wave transmission line architecture |
| US10813210B2 (en) | 2017-11-10 | 2020-10-20 | Raytheon Company | Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion |
| US10849219B2 (en) | 2018-02-28 | 2020-11-24 | Raytheon Company | SNAP-RF interconnections |
| US11089687B2 (en) | 2018-02-28 | 2021-08-10 | Raytheon Company | Additive manufacturing technology (AMT) low profile signal divider |
| US11121474B2 (en) | 2017-11-10 | 2021-09-14 | Raytheon Company | Additive manufacturing technology (AMT) low profile radiator |
| US11289814B2 (en) | 2017-11-10 | 2022-03-29 | Raytheon Company | Spiral antenna and related fabrication techniques |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004289590A (en) * | 2003-03-24 | 2004-10-14 | Kyocera Corp | High-frequency transmission line |
| JP2005223392A (en) * | 2004-02-03 | 2005-08-18 | Ntt Docomo Inc | Coupling line and filter |
| US7400213B2 (en) * | 2005-05-25 | 2008-07-15 | Kabushiki Kaisha Toshiba | System and method for configuring conductors within an integrated circuit to reduce impedance variation caused by connection bumps |
| JP2007006065A (en) * | 2005-06-23 | 2007-01-11 | Ngk Spark Plug Co Ltd | Substrate for transmitting high frequency signal and package for semiconductor element |
| JP2009021747A (en) * | 2007-07-11 | 2009-01-29 | Oki Electric Ind Co Ltd | Band-pass filter |
| US20120326812A1 (en) * | 2010-03-05 | 2012-12-27 | Nec Corporation | High-frequency transmission line and circuit substrate |
| JP5967518B2 (en) * | 2012-02-03 | 2016-08-10 | 住友電工デバイス・イノベーション株式会社 | Signal transmission path |
| JP6672878B2 (en) * | 2016-02-23 | 2020-03-25 | 三菱電機株式会社 | Optical semiconductor device |
| JP6825986B2 (en) * | 2017-05-26 | 2021-02-03 | 京セラ株式会社 | Wiring boards, electronic component storage packages and electronic devices |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4801905A (en) * | 1987-04-23 | 1989-01-31 | Hewlett-Packard Company | Microstrip shielding system |
| EP0506062A2 (en) * | 1991-03-27 | 1992-09-30 | Hughes Aircraft Company | Stripline shielding techniques in low temperature co-fired ceramic |
-
1997
- 1997-01-14 JP JP9004530A patent/JPH10200311A/en active Pending
-
1998
- 1998-01-14 GB GB9800737A patent/GB2322237A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4801905A (en) * | 1987-04-23 | 1989-01-31 | Hewlett-Packard Company | Microstrip shielding system |
| EP0506062A2 (en) * | 1991-03-27 | 1992-09-30 | Hughes Aircraft Company | Stripline shielding techniques in low temperature co-fired ceramic |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1058335A2 (en) * | 1999-06-03 | 2000-12-06 | Murata Manufacturing Co., Ltd. | High-frequency circuit device and communication apparatus using the same |
| EP1058335A3 (en) * | 1999-06-03 | 2002-03-27 | Murata Manufacturing Co., Ltd. | High-frequency circuit device and communication apparatus using the same |
| US6535089B1 (en) | 1999-06-03 | 2003-03-18 | Murata Manufacturing Co. Ltd. | High-frequency circuit device and communication apparatus using the same |
| EP1126540A2 (en) * | 2000-02-16 | 2001-08-22 | Murata Manufacturing Co., Ltd. | Circuit for suppression of spurious modes on planar transmission lines |
| EP1126540A3 (en) * | 2000-02-16 | 2002-03-27 | Murata Manufacturing Co., Ltd. | Circuit for suppression of spurious modes on planar transmission lines |
| US6504456B2 (en) | 2000-02-16 | 2003-01-07 | Murata Manufacturing Co., Ltd. | Communication device having a spurious wave blocking circuit formed of a plural fundamental pattern |
| EP1450433A1 (en) * | 2000-02-16 | 2004-08-25 | Murata Manufacturing Co., Ltd. | Circuit for suppression of spurious modes on planar transmission lines |
| WO2010003665A1 (en) | 2008-07-09 | 2010-01-14 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Stripe line having plated through holes |
| US8482367B2 (en) | 2008-07-09 | 2013-07-09 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Stripline having plated through-contacts |
| US10813210B2 (en) | 2017-11-10 | 2020-10-20 | Raytheon Company | Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion |
| WO2019094477A1 (en) * | 2017-11-10 | 2019-05-16 | Raytheon Company | Millimeter wave transmission line architecture |
| US10826147B2 (en) | 2017-11-10 | 2020-11-03 | Raytheon Company | Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line |
| US11121474B2 (en) | 2017-11-10 | 2021-09-14 | Raytheon Company | Additive manufacturing technology (AMT) low profile radiator |
| US11158955B2 (en) | 2017-11-10 | 2021-10-26 | Raytheon Company | Low profile phased array |
| US11289814B2 (en) | 2017-11-10 | 2022-03-29 | Raytheon Company | Spiral antenna and related fabrication techniques |
| US11581652B2 (en) | 2017-11-10 | 2023-02-14 | Raytheon Company | Spiral antenna and related fabrication techniques |
| US12021306B2 (en) | 2017-11-10 | 2024-06-25 | Raytheon Company | Low profile phased array |
| US10849219B2 (en) | 2018-02-28 | 2020-11-24 | Raytheon Company | SNAP-RF interconnections |
| US11089687B2 (en) | 2018-02-28 | 2021-08-10 | Raytheon Company | Additive manufacturing technology (AMT) low profile signal divider |
| US11375609B2 (en) | 2018-02-28 | 2022-06-28 | Raytheon Company | Method of manufacturing radio frequency interconnections |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9800737D0 (en) | 1998-03-11 |
| JPH10200311A (en) | 1998-07-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB2322237A (en) | Ground conductor-based coplanar waveguide line | |
| KR100456490B1 (en) | Impedance-tuned connector | |
| US6825738B2 (en) | Reduced size microwave directional coupler | |
| US5982249A (en) | Reduced crosstalk microstrip transmission-line | |
| US20050176292A1 (en) | Coaxial connector and connection structure including the same | |
| US5304959A (en) | Planar microstrip balun | |
| WO1999027606A2 (en) | Microstrip arrangement | |
| EP0747987B1 (en) | Vertical grounded coplanar waveguide H-bend interconnection apparatus | |
| US20020084514A1 (en) | Wiring substrate for high frequency applications | |
| US4867704A (en) | Fixture for coupling coaxial connectors to stripline circuits | |
| JP4671458B2 (en) | Signal line to wave guide transformer | |
| US5539360A (en) | Differential transmission line including a conductor having breaks therein | |
| US7026888B2 (en) | Broadband non-directional tap coupler | |
| US4862120A (en) | Wideband stripline to microstrip transition | |
| US4288761A (en) | Microstrip coupler for microwave signals | |
| US7002433B2 (en) | Microwave coupler | |
| WO2001056108A1 (en) | Balun formed from symmetrical couplers and method for making same | |
| JP3370076B2 (en) | Interconnecting high uniformity microstrips with deformed rectangular coaxial transmission lines | |
| US4309677A (en) | Microstrip "T" type attenuator network | |
| US4591812A (en) | Coplanar waveguide quadrature hybrid having symmetrical coupling conductors for eliminating spurious modes | |
| CN218677535U (en) | Strong coupling stripline structure of passive element | |
| US4361820A (en) | Hybrid microwave circuit | |
| US5812032A (en) | Stripline transition for twin toroid phase shifter | |
| KR20040036021A (en) | PCB Coaxial Connector | |
| EP1198860B1 (en) | Electrical transmission arrangement |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |