GB2317585B - Improvements in and relating to grinding machines - Google Patents
Improvements in and relating to grinding machinesInfo
- Publication number
- GB2317585B GB2317585B GB9712082A GB9712082A GB2317585B GB 2317585 B GB2317585 B GB 2317585B GB 9712082 A GB9712082 A GB 9712082A GB 9712082 A GB9712082 A GB 9712082A GB 2317585 B GB2317585 B GB 2317585B
- Authority
- GB
- United Kingdom
- Prior art keywords
- relating
- grinding machines
- grinding
- machines
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/18—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for positioning only
- B23Q3/186—Aligning devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B17/00—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor
- B24B17/04—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor involving optical auxiliary means, e.g. optical projection form grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B17/00—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor
- B24B17/04—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor involving optical auxiliary means, e.g. optical projection form grinding machines
- B24B17/06—Special adaptations of machines or devices for grinding controlled by patterns, drawings, magnetic tapes or the like; Accessories therefor involving optical auxiliary means, e.g. optical projection form grinding machines combined with electrical transmission means, e.g. controlled by photoelectric cells
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
- B24B5/04—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces externally
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
- B24B5/06—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding cylindrical surfaces internally
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/06—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels
- B24B53/07—Devices or means for dressing or conditioning abrasive surfaces of profiled abrasive wheels by means of forming tools having a shape complementary to that to be produced, e.g. blocks, profile rolls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9806247A GB2322318B (en) | 1996-06-15 | 1997-06-11 | Grinding machines for grinding discs or wafer workpieces |
GB9712082A GB2317585B (en) | 1997-06-11 | 1997-06-11 | Improvements in and relating to grinding machines |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9712082A GB2317585B (en) | 1997-06-11 | 1997-06-11 | Improvements in and relating to grinding machines |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9712082D0 GB9712082D0 (en) | 1997-08-13 |
GB2317585A GB2317585A (en) | 1998-04-01 |
GB2317585B true GB2317585B (en) | 1999-12-01 |
Family
ID=10813934
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9712082A Expired - Lifetime GB2317585B (en) | 1996-06-15 | 1997-06-11 | Improvements in and relating to grinding machines |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2317585B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100416446B1 (en) * | 1998-06-25 | 2004-01-31 | 우노바 유.케이. 리미티드 | Wafer edge polishing method and apparatus |
CN109262396B (en) * | 2018-10-15 | 2021-08-03 | 项孝泓 | Special equipment for machining head of automobile air inlet welding manifold |
CN110026845A (en) * | 2019-05-24 | 2019-07-19 | 哈电集团(秦皇岛)重型装备有限公司 | A kind of large container U-tube pipe end derusting burnishing device and polishing method |
CN111941244A (en) * | 2020-08-12 | 2020-11-17 | 中机城市建设有限公司 | Over-and-under type construction steel pipe inner wall rust cleaning grinding device |
CN112157745A (en) * | 2020-08-31 | 2021-01-01 | 衡阳市无量雕塑艺术有限公司 | A grinding device for production of wooden sculpture |
CN112405115B (en) * | 2020-09-22 | 2022-08-12 | 成都飞机工业(集团)有限责任公司 | Photographing type three-dimensional scanning device and method based on measurement of in-situ position of large part |
CN115502795B (en) * | 2022-08-11 | 2024-05-03 | 青岛高测科技股份有限公司 | Feeding device, feeding control method and system of grinding machine, equipment and medium |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2143447A (en) * | 1981-03-30 | 1985-02-13 | Energy Adaptive Grinding Inc | Improvements in grinding control method and apparatus |
EP0222521A2 (en) * | 1985-11-04 | 1987-05-20 | Silicon Technology Corporation | An automatic edge grinder |
US4793101A (en) * | 1986-10-22 | 1988-12-27 | Bbc Brown Boveri Ag | Method of making an encircling groove on the edge of a semiconductor slice of a power semiconductor component |
GB2296458A (en) * | 1994-11-28 | 1996-07-03 | Tokyo Seimitsu Co Ltd | A chamfer grinding system for wafers incorporating two chamfering means to increase throughput |
-
1997
- 1997-06-11 GB GB9712082A patent/GB2317585B/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2143447A (en) * | 1981-03-30 | 1985-02-13 | Energy Adaptive Grinding Inc | Improvements in grinding control method and apparatus |
EP0222521A2 (en) * | 1985-11-04 | 1987-05-20 | Silicon Technology Corporation | An automatic edge grinder |
US4793101A (en) * | 1986-10-22 | 1988-12-27 | Bbc Brown Boveri Ag | Method of making an encircling groove on the edge of a semiconductor slice of a power semiconductor component |
GB2296458A (en) * | 1994-11-28 | 1996-07-03 | Tokyo Seimitsu Co Ltd | A chamfer grinding system for wafers incorporating two chamfering means to increase throughput |
Also Published As
Publication number | Publication date |
---|---|
GB2317585A (en) | 1998-04-01 |
GB9712082D0 (en) | 1997-08-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
PE20 | Patent expired after termination of 20 years |
Expiry date: 20170610 |