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GB2315158B - A method of manufacturing an active matrix liquid crystal display and the structure of the liquid crystal display manufactured by the same method - Google Patents

A method of manufacturing an active matrix liquid crystal display and the structure of the liquid crystal display manufactured by the same method

Info

Publication number
GB2315158B
GB2315158B GB9714111A GB9714111A GB2315158B GB 2315158 B GB2315158 B GB 2315158B GB 9714111 A GB9714111 A GB 9714111A GB 9714111 A GB9714111 A GB 9714111A GB 2315158 B GB2315158 B GB 2315158B
Authority
GB
United Kingdom
Prior art keywords
liquid crystal
crystal display
manufacturing
active matrix
same method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9714111A
Other versions
GB2315158A (en
GB9714111D0 (en
Inventor
Jeong Hyun Kim
Sung-Il Park
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Electronics Inc
Original Assignee
LG Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1019960027655A external-priority patent/KR100213966B1/en
Priority claimed from KR1019960027653A external-priority patent/KR100213967B1/en
Application filed by LG Electronics Inc filed Critical LG Electronics Inc
Publication of GB9714111D0 publication Critical patent/GB9714111D0/en
Publication of GB2315158A publication Critical patent/GB2315158A/en
Application granted granted Critical
Publication of GB2315158B publication Critical patent/GB2315158B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0221Manufacture or treatment of multiple TFTs comprising manufacture, treatment or patterning of TFT semiconductor bodies
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136227Through-hole connection of the pixel electrode to the active element through an insulation layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041Cleaning
    • H01L21/02043Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046Dry cleaning only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/28008Making conductor-insulator-semiconductor electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0312Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
    • H10D30/0316Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral bottom-gate TFTs comprising only a single gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6732Bottom-gate only TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739Conductor-insulator-semiconductor electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6746Amorphous silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Liquid Crystal (AREA)
  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
GB9714111A 1996-07-09 1997-07-03 A method of manufacturing an active matrix liquid crystal display and the structure of the liquid crystal display manufactured by the same method Expired - Lifetime GB2315158B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019960027655A KR100213966B1 (en) 1996-07-09 1996-07-09 Manufacturing Method of Active Matrix Liquid Crystal Display and Active Matrix Liquid Crystal Display
KR1019960027653A KR100213967B1 (en) 1996-07-09 1996-07-09 Manufacturing method of active matrix liquid crystal display device and active matrix liquid crystal display device

Publications (3)

Publication Number Publication Date
GB9714111D0 GB9714111D0 (en) 1997-09-10
GB2315158A GB2315158A (en) 1998-01-21
GB2315158B true GB2315158B (en) 1999-02-10

Family

ID=26631999

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9714111A Expired - Lifetime GB2315158B (en) 1996-07-09 1997-07-03 A method of manufacturing an active matrix liquid crystal display and the structure of the liquid crystal display manufactured by the same method

Country Status (4)

Country Link
JP (1) JPH1082997A (en)
DE (1) DE19729176C2 (en)
FR (1) FR2751131B1 (en)
GB (1) GB2315158B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100251091B1 (en) * 1996-11-29 2000-04-15 구본준 Manufacturing method of liquid crystal display device and liquid crystal display device manufactured by the manufacturing method
US6541369B2 (en) * 1999-12-07 2003-04-01 Applied Materials, Inc. Method and apparatus for reducing fixed charges in a semiconductor device
JP2001196591A (en) 2000-01-13 2001-07-19 Internatl Business Mach Corp <Ibm> Thin film transistor and method of manufacturing thin film transistor
US6794311B2 (en) 2000-07-14 2004-09-21 Applied Materials Inc. Method and apparatus for treating low k dielectric layers to reduce diffusion
KR100720099B1 (en) * 2001-06-21 2007-05-18 삼성전자주식회사 Thin film transistor substrate and manufacturing method thereof
JP2006178393A (en) * 2004-11-24 2006-07-06 Ricoh Co Ltd Image reader, and recording device with image reader
KR101213871B1 (en) * 2005-12-15 2012-12-18 엘지디스플레이 주식회사 Thin film transistor array substrate and manufacturing method of the same
KR101251351B1 (en) 2005-12-28 2013-04-05 삼성디스플레이 주식회사 Thin film transistor substrate, method for making the substrate and display panel having the substrate
KR101217182B1 (en) * 2006-07-28 2012-12-31 삼성디스플레이 주식회사 Thin film transistor substrate, method for making the same and display having the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045905A (en) * 1988-03-23 1991-09-03 Nippon Precision Circuits Ltd. Amorphous silicon thin film transistor
EP0486047A2 (en) * 1990-11-16 1992-05-20 Seiko Epson Corporation Thin film semiconductor device, process for fabricating the same, and silicon film
JPH04257826A (en) * 1991-02-13 1992-09-14 Sharp Corp Manufacture of active matrix substrate
US5177588A (en) * 1991-06-14 1993-01-05 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including nitride layer
US5281546A (en) * 1992-09-02 1994-01-25 General Electric Company Method of fabricating a thin film transistor using hydrogen plasma treatment of the intrinsic silicon/doped layer interface

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636038A (en) * 1983-07-09 1987-01-13 Canon Kabushiki Kaisha Electric circuit member and liquid crystal display device using said member
US4704783A (en) * 1986-05-05 1987-11-10 General Electric Company Method for passivating the back channel of amorphous silicon field effect transistors
JPS63157476A (en) * 1986-12-22 1988-06-30 Seiko Instr & Electronics Ltd Thin film transistor
DE69125886T2 (en) * 1990-05-29 1997-11-20 Semiconductor Energy Lab Thin film transistors
JPH06267986A (en) * 1993-03-17 1994-09-22 Hitachi Ltd Method of manufacturing thin film transistor
US5858819A (en) * 1994-06-15 1999-01-12 Seiko Epson Corporation Fabrication method for a thin film semiconductor device, the thin film semiconductor device itself, liquid crystal display, and electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5045905A (en) * 1988-03-23 1991-09-03 Nippon Precision Circuits Ltd. Amorphous silicon thin film transistor
EP0486047A2 (en) * 1990-11-16 1992-05-20 Seiko Epson Corporation Thin film semiconductor device, process for fabricating the same, and silicon film
JPH04257826A (en) * 1991-02-13 1992-09-14 Sharp Corp Manufacture of active matrix substrate
US5177588A (en) * 1991-06-14 1993-01-05 Mitsubishi Denki Kabushiki Kaisha Semiconductor device including nitride layer
US5281546A (en) * 1992-09-02 1994-01-25 General Electric Company Method of fabricating a thin film transistor using hydrogen plasma treatment of the intrinsic silicon/doped layer interface

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Patent Abstracts of Japan, Section P, Section No 1476, Vol 17, No 45, Pg 3, 28/1/93 & JP 04 257 826 A *

Also Published As

Publication number Publication date
FR2751131B1 (en) 2001-11-09
DE19729176A1 (en) 1998-01-22
GB2315158A (en) 1998-01-21
JPH1082997A (en) 1998-03-31
DE19729176C2 (en) 2002-04-25
FR2751131A1 (en) 1998-01-16
GB9714111D0 (en) 1997-09-10

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PE20 Patent expired after termination of 20 years

Expiry date: 20170702