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GB2295722B - Method of packaging integrated circuits - Google Patents

Method of packaging integrated circuits

Info

Publication number
GB2295722B
GB2295722B GB9424178A GB9424178A GB2295722B GB 2295722 B GB2295722 B GB 2295722B GB 9424178 A GB9424178 A GB 9424178A GB 9424178 A GB9424178 A GB 9424178A GB 2295722 B GB2295722 B GB 2295722B
Authority
GB
United Kingdom
Prior art keywords
integrated circuits
packaging integrated
packaging
circuits
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9424178A
Other versions
GB2295722A (en
GB9424178D0 (en
Inventor
Derek Thomson
Andrew Beaumont
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions UK Ltd
Original Assignee
Motorola Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Ltd filed Critical Motorola Ltd
Priority to GB9424178A priority Critical patent/GB2295722B/en
Publication of GB9424178D0 publication Critical patent/GB9424178D0/en
Publication of GB2295722A publication Critical patent/GB2295722A/en
Application granted granted Critical
Publication of GB2295722B publication Critical patent/GB2295722B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W72/01515—
    • H10W72/075—
    • H10W74/00—
    • H10W90/756—
GB9424178A 1994-11-30 1994-11-30 Method of packaging integrated circuits Expired - Fee Related GB2295722B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9424178A GB2295722B (en) 1994-11-30 1994-11-30 Method of packaging integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9424178A GB2295722B (en) 1994-11-30 1994-11-30 Method of packaging integrated circuits

Publications (3)

Publication Number Publication Date
GB9424178D0 GB9424178D0 (en) 1995-01-18
GB2295722A GB2295722A (en) 1996-06-05
GB2295722B true GB2295722B (en) 1997-12-17

Family

ID=10765214

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9424178A Expired - Fee Related GB2295722B (en) 1994-11-30 1994-11-30 Method of packaging integrated circuits

Country Status (1)

Country Link
GB (1) GB2295722B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009058796A1 (en) * 2009-12-18 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Optoelectronic component and method for producing an optoelectronic component
DE102014224628B4 (en) * 2014-12-02 2020-12-24 Ifm Electronic Gmbh Method for producing an electronic assembly overmolded with plastic, an electronic assembly of this type, and a capacitive sensor
DE202014010573U1 (en) 2014-12-02 2016-01-07 Ifm Electronic Gmbh A plastic encapsulated electronic assembly for a capacitive sensor
DE102023116498A1 (en) 2023-06-22 2024-12-24 Ifm Electronic Gmbh Process for producing a plastic-coated printed circuit board with electronic components

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4163072A (en) * 1977-06-07 1979-07-31 Bell Telephone Laboratories, Incorporated Encapsulation of circuits
EP0258098A1 (en) * 1986-07-25 1988-03-02 Fujitsu Limited Encapsulated semiconductor device and method of producing the same
US4784872A (en) * 1984-11-17 1988-11-15 Messerschmitt-Boelkow-Blohm Gmbh Process for encapsulating microelectronic semi-conductor and layer type circuits
US5019419A (en) * 1988-11-30 1991-05-28 Toshiba Silicone Co. Ltd. Process for producing an electronic part
US5097317A (en) * 1989-09-08 1992-03-17 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4163072A (en) * 1977-06-07 1979-07-31 Bell Telephone Laboratories, Incorporated Encapsulation of circuits
US4784872A (en) * 1984-11-17 1988-11-15 Messerschmitt-Boelkow-Blohm Gmbh Process for encapsulating microelectronic semi-conductor and layer type circuits
EP0258098A1 (en) * 1986-07-25 1988-03-02 Fujitsu Limited Encapsulated semiconductor device and method of producing the same
US5019419A (en) * 1988-11-30 1991-05-28 Toshiba Silicone Co. Ltd. Process for producing an electronic part
US5097317A (en) * 1989-09-08 1992-03-17 Mitsubishi Denki Kabushiki Kaisha Resin-sealed semiconductor device

Also Published As

Publication number Publication date
GB2295722A (en) 1996-06-05
GB9424178D0 (en) 1995-01-18

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19981130