GB2287837A - CPU cooling device - Google Patents
CPU cooling device Download PDFInfo
- Publication number
- GB2287837A GB2287837A GB9415495A GB9415495A GB2287837A GB 2287837 A GB2287837 A GB 2287837A GB 9415495 A GB9415495 A GB 9415495A GB 9415495 A GB9415495 A GB 9415495A GB 2287837 A GB2287837 A GB 2287837A
- Authority
- GB
- United Kingdom
- Prior art keywords
- base plate
- flat base
- radiating fins
- cooling device
- cpu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A CPU cooling device includes a radiating flange (4) having a plurality of radiating fins (402) spaced on a flat base plate (401), and a fan (5) mounted on the flat base plate and surrounded by the radiating fins. <IMAGE>
Description
CPU COOLING DEVICE
BACKGROUND OF THE INVENTION
The present invention relates to a CPU cooling device for cooling the CPU of an electronic apparatus, and relates more particularly to a CPU cooling device comprised of an integral radiating flange and a fan mounted on the radiating flange and surrounded by radiating fins of the radiating flange.
During the operation of the CPU of a computer system or the like, heat must be quickly carried away from the CPU so as not to damage the other components of the electronic circuit of the computer system or the like. Figure 4 shows a CPU cooling device according to the prior art, which comprises a radiating flange 2 mounted on the CPU 1 at the top by hooked joints, and a fan 3 fastened to the radiating flange 2 at the top by screws 201. When operated, currents of air are caused by the fan 3 and distributed through radial gaps between radiating fins of the radiating flange to quickly carry heat away. This structure of CPU cooling device is effective in use, however, it needs much installation space. Because the radiating flange 2 is mounted on the CPU 1 at the top and the fan 3 is fastened to the radiating flange 2 at the top, the combined height of the CPU 1, the radiating flange 2, and the fan 3 relatively increases the height of the mainframe of the computer system or the like.
SUMMARY OF THE INVENTION
The present invention has been accomplished to provide a CPU cooling device which eliminates the aforesaid problem. According to one aspect of the present invention, the radiating flange has a plurality of fins integrally molded on a flat base plate thereof at the top around a circle, and therefore the mounting process of the CPU cooling device is easy. According to another aspect of the present invention, the fan is mounted on the flat base plate and surrounded by the radiating fins, and therefore the height of the radiating flange is equal to the height of the CPU cooling device. According to still another aspect of the present invention, the radiating fins are radially spaced around the fan, and therefore currents of air caused by the fan flow through the gaps among the radiating fins to quickly carry heat away.
BRIEF DESCRIPTION OF THE DRAWINGS
Fig. 1 is an elevational view of a CPU cooling device according to the preferred embodiment of the present invention;
Fig. 2 is an exploded view of the CPU cooling device shown in Figure 1;
Fig. 3 is a sectional view of the CPU cooling device shown in Figure 1; and
Fig. 4 is an installed view in section a CPU cooling device according to the prior art.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
Referring to Figure 2, a CPU cooling device in accordance with the present invention is generally comprised of a radiating flange 4 and a fan 5. The radiating flange 4 comprises a base plate 401 and a plurality of radiating fins 402 integrally molded on the base plate 401 and radially spaced around a circle 403.
As an alternate form of the present invention, the radiating fins 402 at either side of the base plate 401 may be respectively arranged in parallel and disposed perpendicular to the corresponding side of the base plate 401. The diameter of the circle 403 is longer than the maximum outer diameter of the fan 5, and therefore the fan 5 can be received within the radiating fins 402. The fan 5 is a commercially available product, comprised of a stator 502 mounted on the base plate 401 in the center within the circle 403, and a rotor 503 with fan blades 501. The shaft 5031 (see
Figure 3) of the rotor 503 is inserted through a center through hole 5021 on the stator 502 and a center through hole 4011 on the base plate 401 and then retained to the base plate 401 by a spring washer (not shown).
When assembled, as shown in Figures 1 and 3, the fan 5 is received within the radiating fins 402, and the topmost edge of the fan 5 does not protrude beyond the elevation of the topmost edge of the radiating fins 402. Therefore, the height of the radiating flange is the total height of the CPU cooling device. During the operation of the CPU, the fan 5 is turned to to cause currents of air, and the currents of air are sent through the gaps 4021;4022;4023 among the radiating fins 402 to carry heat away from the CPU.
Claims (4)
1. A CPU cooling device comprising a
radiating flange mounted on the CPU of the mainframe of
a computer system, and a fan mounted on said radiating
flange and controlled to cause currents of air for
removing heat from said CPU, wherein said radiating
flange comprises a flat base plate, a plurality of
radiating fins spaced on said flat base plate around a
circle defining a plurality of air passage holes; said fan is mounted on said flat base plate within said
radiating fins and disposed at an elevation below the
topmost edge of said radiating fins.
2. The CPU cooling device of claim 1, wherein
said radiating fins are integrally molded on said flat
base plate.
3. The CPU cooling device of claim 1, wherein
said radiating fins are radially spaced from one another
around said circle.
4. A CPU cooling device substantially as described herein with reference to the drawings.
4. The CPU cooling device of claim 1, wherein
said radiating fins are spaced from one another around
said circle along four sides of said flat base plate,
the radiating fins at either side of said flat base
plate being disposed in parallel with one another and
perpendicularly extended from the corresponding side of
said flat base plate.
5. A CPU cooling device substantially as described herein with reference to the drawings.
Amendments to the claims have been filed as follows 1. A CPU cooling device comprising a radiating flange mounted on the CPU of the mainframe of a computer system, and a fan mounted on said radiating flange and controlled to cause currents of air for removing heat from said CPU, wherein said radiating flange comprises a flat base plate and a plurality of radiating fins spaced on said flat base plate around a circle defining a plurality of air passage holes; said fan being mounted on said flat base plate within said radiating fins and disposed at an elevation below the topmost edge of said radiating fins and said radiating fins being radially spaced from one another around said circle.
2. A CPU cooling device according to claim 1, wherein said radiating fins are integrally molded on said flat base plate.
3. A CPU cooling device according to claim 1 or claim 2, wherein said radiating fins are spaced from one another around said circle along four sides of said flat base plate, the radiating fins at either side of said flat base plate being disposed in parallel with one another and perpendicularly extended from the corresponding side of said flat base plate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US20903794A | 1994-03-09 | 1994-03-09 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB9415495D0 GB9415495D0 (en) | 1994-09-21 |
| GB2287837A true GB2287837A (en) | 1995-09-27 |
| GB2287837B GB2287837B (en) | 1997-10-08 |
Family
ID=22777064
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9415495A Expired - Fee Related GB2287837B (en) | 1994-03-09 | 1994-08-01 | CPU cooling device |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2287837B (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2309775A (en) * | 1996-02-01 | 1997-08-06 | Hewlett Packard Co | A fan assisted heat sink cooling device |
| EP0860875A3 (en) * | 1997-02-24 | 1999-01-07 | Fujitsu Limited | Heat sink and information processor using heat sink |
| FR2766302A1 (en) * | 1997-07-17 | 1999-01-22 | Valeo Climatisation | Cooling fin configuration for vehicle radiator |
| US6006426A (en) * | 1997-09-12 | 1999-12-28 | Fujitsu Limited | Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board |
| GB2348277A (en) * | 1996-02-01 | 2000-09-27 | Hewlett Packard Co | A fan assisted heat sink cooling device |
| US6176299B1 (en) | 1999-02-22 | 2001-01-23 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
| GB2415545A (en) * | 2005-04-29 | 2005-12-28 | Bestec Power Electronics Co Lt | Heat dissipating device |
| CN101364576B (en) * | 2008-09-19 | 2011-07-20 | 秦彪 | Radiator for semi-conductor electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4513812A (en) * | 1981-06-25 | 1985-04-30 | Papst-Motoren Gmbh & Co. Kg | Heat sink for electronic devices |
| EP0572326A2 (en) * | 1992-05-28 | 1993-12-01 | Fujitsu Limited | Heat sink for cooling a heat producing element and application |
| WO1994000727A1 (en) * | 1992-06-23 | 1994-01-06 | Pcubid Computer Technology Inc. | Low profile integrated heat sink and fan assembly |
| WO1994004013A1 (en) * | 1992-08-06 | 1994-02-17 | Pfu Limited | Cooler for heat generation device |
-
1994
- 1994-08-01 GB GB9415495A patent/GB2287837B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4513812A (en) * | 1981-06-25 | 1985-04-30 | Papst-Motoren Gmbh & Co. Kg | Heat sink for electronic devices |
| EP0572326A2 (en) * | 1992-05-28 | 1993-12-01 | Fujitsu Limited | Heat sink for cooling a heat producing element and application |
| WO1994000727A1 (en) * | 1992-06-23 | 1994-01-06 | Pcubid Computer Technology Inc. | Low profile integrated heat sink and fan assembly |
| WO1994004013A1 (en) * | 1992-08-06 | 1994-02-17 | Pfu Limited | Cooler for heat generation device |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5785116A (en) * | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
| GB2309775A (en) * | 1996-02-01 | 1997-08-06 | Hewlett Packard Co | A fan assisted heat sink cooling device |
| GB2309775B (en) * | 1996-02-01 | 2000-08-23 | Hewlett Packard Co | Fan assisted heat sink device |
| GB2348277A (en) * | 1996-02-01 | 2000-09-27 | Hewlett Packard Co | A fan assisted heat sink cooling device |
| GB2348277B (en) * | 1996-02-01 | 2001-02-14 | Hewlett Packard Co | Fan assisted heat sink device |
| US6227286B1 (en) | 1997-02-24 | 2001-05-08 | Fujitsu Limited | Heat sink and information processor using heat sink |
| EP0860875A3 (en) * | 1997-02-24 | 1999-01-07 | Fujitsu Limited | Heat sink and information processor using heat sink |
| US7828045B2 (en) | 1997-02-24 | 2010-11-09 | Fujitsu Limited | Heat sink and information processor using heat sink |
| US6460608B2 (en) | 1997-02-24 | 2002-10-08 | Fujitsu Limited | Heat sink and information processor using heat sink |
| FR2766302A1 (en) * | 1997-07-17 | 1999-01-22 | Valeo Climatisation | Cooling fin configuration for vehicle radiator |
| US6006426A (en) * | 1997-09-12 | 1999-12-28 | Fujitsu Limited | Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board |
| US6240634B1 (en) | 1997-09-12 | 2001-06-05 | Fujitsu Limited | Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board |
| US6122823A (en) * | 1997-09-12 | 2000-09-26 | Fujitsu Limited | Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board |
| US6176299B1 (en) | 1999-02-22 | 2001-01-23 | Agilent Technologies, Inc. | Cooling apparatus for electronic devices |
| GB2415545A (en) * | 2005-04-29 | 2005-12-28 | Bestec Power Electronics Co Lt | Heat dissipating device |
| GB2415545B (en) * | 2005-04-29 | 2006-06-28 | Bestec Power Electronics Co Lt | Heat dissipating device |
| CN101364576B (en) * | 2008-09-19 | 2011-07-20 | 秦彪 | Radiator for semi-conductor electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9415495D0 (en) | 1994-09-21 |
| GB2287837B (en) | 1997-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20000801 |