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GB2272108B - Electrical assemblies - Google Patents

Electrical assemblies

Info

Publication number
GB2272108B
GB2272108B GB9321881A GB9321881A GB2272108B GB 2272108 B GB2272108 B GB 2272108B GB 9321881 A GB9321881 A GB 9321881A GB 9321881 A GB9321881 A GB 9321881A GB 2272108 B GB2272108 B GB 2272108B
Authority
GB
United Kingdom
Prior art keywords
electrical assemblies
assemblies
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9321881A
Other versions
GB2272108A (en
GB9321881D0 (en
Inventor
Terence Clifford Merriman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smiths Group PLC
Original Assignee
Smiths Group PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB929223008A external-priority patent/GB9223008D0/en
Application filed by Smiths Group PLC filed Critical Smiths Group PLC
Priority to GB9321881A priority Critical patent/GB2272108B/en
Publication of GB9321881D0 publication Critical patent/GB9321881D0/en
Publication of GB2272108A publication Critical patent/GB2272108A/en
Application granted granted Critical
Publication of GB2272108B publication Critical patent/GB2272108B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
GB9321881A 1992-11-03 1993-10-22 Electrical assemblies Expired - Fee Related GB2272108B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9321881A GB2272108B (en) 1992-11-03 1993-10-22 Electrical assemblies

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB929223008A GB9223008D0 (en) 1992-11-03 1992-11-03 Electrical assemblies
GB9321881A GB2272108B (en) 1992-11-03 1993-10-22 Electrical assemblies

Publications (3)

Publication Number Publication Date
GB9321881D0 GB9321881D0 (en) 1993-12-15
GB2272108A GB2272108A (en) 1994-05-04
GB2272108B true GB2272108B (en) 1995-10-18

Family

ID=26301904

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9321881A Expired - Fee Related GB2272108B (en) 1992-11-03 1993-10-22 Electrical assemblies

Country Status (1)

Country Link
GB (1) GB2272108B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19740542C1 (en) * 1997-09-15 1998-12-17 Siemens Nixdorf Inf Syst Damping device for active power diode
DE19752781A1 (en) * 1997-11-28 1999-06-02 Wabco Gmbh Circuit arrangement for protecting an electrical component from an electrical potential
EP0973363A1 (en) * 1998-07-15 2000-01-19 Artesyn Technologies A conductor
WO2011162005A1 (en) * 2010-06-24 2011-12-29 ボッシュ株式会社 Printed circuit board
US20160183386A1 (en) * 2014-12-19 2016-06-23 Qualcomm Incorporated Techniques for controlling equivalent series resistance of a capacitor

Also Published As

Publication number Publication date
GB2272108A (en) 1994-05-04
GB9321881D0 (en) 1993-12-15

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20001022