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GB2262743B - Electrically conductive copper paste - Google Patents

Electrically conductive copper paste

Info

Publication number
GB2262743B
GB2262743B GB9226903A GB9226903A GB2262743B GB 2262743 B GB2262743 B GB 2262743B GB 9226903 A GB9226903 A GB 9226903A GB 9226903 A GB9226903 A GB 9226903A GB 2262743 B GB2262743 B GB 2262743B
Authority
GB
United Kingdom
Prior art keywords
electrically conductive
conductive copper
copper paste
paste
electrically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9226903A
Other versions
GB9226903D0 (en
GB2262743A (en
Inventor
Hirofumi Hatanaka
Koichi Machida
Kazumi Suzuki
Toru Fukuda
Ichirou Nakayama
Tatsumi Hoshino
Seiji Yokode
Kunio Nishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Toatsu Chemicals Inc
Original Assignee
Mitsui Toatsu Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Toatsu Chemicals Inc filed Critical Mitsui Toatsu Chemicals Inc
Publication of GB9226903D0 publication Critical patent/GB9226903D0/en
Publication of GB2262743A publication Critical patent/GB2262743A/en
Application granted granted Critical
Publication of GB2262743B publication Critical patent/GB2262743B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Paints Or Removers (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
GB9226903A 1991-12-27 1992-12-24 Electrically conductive copper paste Expired - Fee Related GB2262743B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34604891 1991-12-27

Publications (3)

Publication Number Publication Date
GB9226903D0 GB9226903D0 (en) 1993-02-17
GB2262743A GB2262743A (en) 1993-06-30
GB2262743B true GB2262743B (en) 1995-11-01

Family

ID=18380787

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9226903A Expired - Fee Related GB2262743B (en) 1991-12-27 1992-12-24 Electrically conductive copper paste

Country Status (4)

Country Link
JP (1) JPH05325636A (en)
KR (1) KR930016000A (en)
GB (1) GB2262743B (en)
MY (1) MY108188A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2320728A (en) * 1996-12-30 1998-07-01 Coates Brothers Plc Depositing a metallic film involving pretreatment
JPH10256687A (en) * 1997-03-14 1998-09-25 Matsushita Electric Ind Co Ltd Conductor paste composition for filling it into via hole, and printed circuit board using the same
JP4803910B2 (en) * 2001-06-27 2011-10-26 三菱鉛筆株式会社 Manufacturing method of fiber guide ink guide member
KR100390638B1 (en) * 2001-07-09 2003-07-07 남애전자 주식회사 Electrically conductive silicone paste
KR20020061469A (en) * 2001-08-04 2002-07-24 김병만 Electric Conduition Nature Pasted For An Electron Parts
KR100403549B1 (en) * 2001-10-31 2003-10-30 남애전자 주식회사 A method for shielding electromagnetic interference waves by using form-in- place type electrically conductive silicone pastes
KR100484246B1 (en) * 2001-12-17 2005-04-20 (주)그린폴 Electroconductive composition containing waste electric wires
JP5907305B1 (en) * 2015-09-10 2016-04-26 東洋インキＳｃホールディングス株式会社 Conductive paste for laser processing
JP6566008B2 (en) * 2017-11-24 2019-08-28 東洋インキＳｃホールディングス株式会社 Electromagnetic shielding sheet and printed wiring board
JP7466348B2 (en) * 2020-03-25 2024-04-12 株式会社タムラ製作所 Anisotropic conductive paste and method for manufacturing electronic substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02155114A (en) * 1988-12-06 1990-06-14 Mitsui Toatsu Chem Inc Conductive copper paste
JPH10125311A (en) * 1996-10-25 1998-05-15 Toyota Motor Corp Manufacture of battery electrode

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02155114A (en) * 1988-12-06 1990-06-14 Mitsui Toatsu Chem Inc Conductive copper paste
JPH10125311A (en) * 1996-10-25 1998-05-15 Toyota Motor Corp Manufacture of battery electrode

Also Published As

Publication number Publication date
GB9226903D0 (en) 1993-02-17
GB2262743A (en) 1993-06-30
JPH05325636A (en) 1993-12-10
KR930016000A (en) 1993-07-24
MY108188A (en) 1996-08-30

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19961224