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GB2244602B - Printed wiring board with electromagnetic wave shielding layer - Google Patents

Printed wiring board with electromagnetic wave shielding layer

Info

Publication number
GB2244602B
GB2244602B GB9108285A GB9108285A GB2244602B GB 2244602 B GB2244602 B GB 2244602B GB 9108285 A GB9108285 A GB 9108285A GB 9108285 A GB9108285 A GB 9108285A GB 2244602 B GB2244602 B GB 2244602B
Authority
GB
United Kingdom
Prior art keywords
wiring board
electromagnetic wave
printed wiring
shielding layer
wave shielding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9108285A
Other versions
GB2244602A (en
GB9108285D0 (en
Inventor
Hirotaka Okonogi
Katsutomo Nikaido
Junichi Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Publication of GB9108285D0 publication Critical patent/GB9108285D0/en
Publication of GB2244602A publication Critical patent/GB2244602A/en
Application granted granted Critical
Publication of GB2244602B publication Critical patent/GB2244602B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
GB9108285A 1990-04-18 1991-04-18 Printed wiring board with electromagnetic wave shielding layer Expired - Fee Related GB2244602B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10214790A JPH04794A (en) 1990-04-18 1990-04-18 Printed wiring board with electromagnetic shielding layer

Publications (3)

Publication Number Publication Date
GB9108285D0 GB9108285D0 (en) 1991-06-05
GB2244602A GB2244602A (en) 1991-12-04
GB2244602B true GB2244602B (en) 1993-11-10

Family

ID=14319634

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9108285A Expired - Fee Related GB2244602B (en) 1990-04-18 1991-04-18 Printed wiring board with electromagnetic wave shielding layer

Country Status (2)

Country Link
JP (1) JPH04794A (en)
GB (1) GB2244602B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5293004A (en) * 1991-09-02 1994-03-08 Nippon Cmk Corp. Printed circuit board having an electromagnetic shielding layer
JPH08107257A (en) * 1991-09-30 1996-04-23 Cmk Corp Method for manufacturing printed wiring board having electromagnetic wave shield

Also Published As

Publication number Publication date
GB2244602A (en) 1991-12-04
GB9108285D0 (en) 1991-06-05
JPH04794A (en) 1992-01-06

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950418