[go: up one dir, main page]

GB2232006B - Pre-testable semiconductor die package and fabrication method - Google Patents

Pre-testable semiconductor die package and fabrication method

Info

Publication number
GB2232006B
GB2232006B GB9013395A GB9013395A GB2232006B GB 2232006 B GB2232006 B GB 2232006B GB 9013395 A GB9013395 A GB 9013395A GB 9013395 A GB9013395 A GB 9013395A GB 2232006 B GB2232006 B GB 2232006B
Authority
GB
United Kingdom
Prior art keywords
semiconductor die
fabrication method
die package
testable semiconductor
testable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9013395A
Other versions
GB2232006A (en
GB9013395D0 (en
Inventor
Thanomsak Sankhagowit
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/628,106 external-priority patent/US4701781A/en
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Priority to GB9013395A priority Critical patent/GB2232006B/en
Publication of GB9013395D0 publication Critical patent/GB9013395D0/en
Publication of GB2232006A publication Critical patent/GB2232006A/en
Application granted granted Critical
Publication of GB2232006B publication Critical patent/GB2232006B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2896—Testing of IC packages; Test features related to IC packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
GB9013395A 1984-07-05 1990-06-15 Pre-testable semiconductor die package and fabrication method Expired - Fee Related GB2232006B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9013395A GB2232006B (en) 1984-07-05 1990-06-15 Pre-testable semiconductor die package and fabrication method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US06/628,106 US4701781A (en) 1984-07-05 1984-07-05 Pre-testable semiconductor die package
GB8706395A GB2202372B (en) 1984-07-05 1987-03-18 Pre-testable semiconductor die package and fabrication method
GB9013395A GB2232006B (en) 1984-07-05 1990-06-15 Pre-testable semiconductor die package and fabrication method

Publications (3)

Publication Number Publication Date
GB9013395D0 GB9013395D0 (en) 1990-08-08
GB2232006A GB2232006A (en) 1990-11-28
GB2232006B true GB2232006B (en) 1991-02-13

Family

ID=34219643

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8706395A Expired - Fee Related GB2202372B (en) 1984-07-05 1987-03-18 Pre-testable semiconductor die package and fabrication method
GB9013395A Expired - Fee Related GB2232006B (en) 1984-07-05 1990-06-15 Pre-testable semiconductor die package and fabrication method

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB8706395A Expired - Fee Related GB2202372B (en) 1984-07-05 1987-03-18 Pre-testable semiconductor die package and fabrication method

Country Status (1)

Country Link
GB (2) GB2202372B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2368195B (en) * 1997-03-21 2002-07-31 Rohm Co Ltd A leadframe and a method of manufacturing a semiconductor device by use of it
US6107676A (en) * 1997-03-21 2000-08-22 Rohm Co., Ltd. Leadframe and a method of manufacturing a semiconductor device by use of it

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE30604E (en) * 1979-03-05 1981-05-05 Honeywell Information Systems Inc. Reusable fixture for an integrated circuit chip
US4380042A (en) * 1981-02-23 1983-04-12 Angelucci Sr Thomas L Printed circuit lead carrier tape
FI76220C (en) * 1984-09-17 1988-09-09 Elkotrade Ag FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER.

Also Published As

Publication number Publication date
GB2202372A (en) 1988-09-21
GB2232006A (en) 1990-11-28
GB2202372B (en) 1991-02-13
GB8706395D0 (en) 1987-04-23
GB9013395D0 (en) 1990-08-08

Similar Documents

Publication Publication Date Title
EP0174185A3 (en) Semiconductor device and manufacturing method thereof
EP0187278A3 (en) Semiconductor device and method for manufacturing the same
EP0162677A3 (en) Semiconductor device and method for producing same
DE3565339D1 (en) Semiconductor memory device and method of manufacturing the same
DE3473384D1 (en) Semiconductor device and a method of manufacturing the same
EP0085988A3 (en) Semiconductor memory and method for fabricating the same
DE3573355D1 (en) Semiconductor package substrate and manufacturing process
GB8513262D0 (en) Semiconductor manufacturing method
EP0187596A3 (en) Semiconductor memory device and method for producing the same
DE3666753D1 (en) Integrated semiconductor structure and fabrication method
EP0253664A3 (en) Semiconductor photo-sensor and method for manufacturing the same
EP0166167A3 (en) Semiconductor device comprising misfets and a process for manufacturing the same
EP0163295A3 (en) A semiconductor photodetector and fabrication process for the same
DE3570066D1 (en) Sealed package, method for manufacturing and utilization of said package
GB8522166D0 (en) Encapsulating semiconductor components
DE3279378D1 (en) Package for semiconductor device and method for its production
GB8506111D0 (en) Encapsulating semiconductor components
GB2124024B (en) Semiconductor laser and manufacturing method therefor
HK41890A (en) Semiconductor device and fabrication process thereof
GB8403698D0 (en) Semiconductor device fabrication
EP0187260A3 (en) Semiconductor integrated-circuit device comprising a misfet and process for producing the same
EP0361283A3 (en) Resin-sealed type semiconductor device and method for manufacturing the same
DE3562634D1 (en) Semiconductor production method
EP0180457A3 (en) Semiconductor integrated circuit device and method for producing same
DE3569362D1 (en) Packaging method and package obtained by this method

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950318