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GB2214931B - Apparatus for selectively coating part of a member - Google Patents

Apparatus for selectively coating part of a member

Info

Publication number
GB2214931B
GB2214931B GB8806544A GB8806544A GB2214931B GB 2214931 B GB2214931 B GB 2214931B GB 8806544 A GB8806544 A GB 8806544A GB 8806544 A GB8806544 A GB 8806544A GB 2214931 B GB2214931 B GB 2214931B
Authority
GB
United Kingdom
Prior art keywords
coating part
selectively coating
selectively
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8806544A
Other versions
GB2214931A (en
GB8806544D0 (en
Inventor
Ronald Frederick Lester
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Publication of GB8806544D0 publication Critical patent/GB8806544D0/en
Priority to EP89300904A priority Critical patent/EP0327298A3/en
Priority to JP1025610A priority patent/JPH01275794A/en
Publication of GB2214931A publication Critical patent/GB2214931A/en
Priority to US07/617,969 priority patent/US5100524A/en
Application granted granted Critical
Publication of GB2214931B publication Critical patent/GB2214931B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0753—Reversing fluid direction, e.g. in holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
GB8806544A 1988-02-03 1988-03-18 Apparatus for selectively coating part of a member Expired - Fee Related GB2214931B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP89300904A EP0327298A3 (en) 1988-02-03 1989-01-31 Apparatus for selectively coating part of a member
JP1025610A JPH01275794A (en) 1988-02-03 1989-02-03 Apparatus for selectively coating part of member
US07/617,969 US5100524A (en) 1988-02-03 1990-11-26 Apparatus for selectively coating part of a member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB888802393A GB8802393D0 (en) 1988-02-03 1988-02-03 Apparatus for selectively coating part of member

Publications (3)

Publication Number Publication Date
GB8806544D0 GB8806544D0 (en) 1988-04-20
GB2214931A GB2214931A (en) 1989-09-13
GB2214931B true GB2214931B (en) 1991-11-13

Family

ID=10630989

Family Applications (2)

Application Number Title Priority Date Filing Date
GB888802393A Pending GB8802393D0 (en) 1988-02-03 1988-02-03 Apparatus for selectively coating part of member
GB8806544A Expired - Fee Related GB2214931B (en) 1988-02-03 1988-03-18 Apparatus for selectively coating part of a member

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB888802393A Pending GB8802393D0 (en) 1988-02-03 1988-02-03 Apparatus for selectively coating part of member

Country Status (1)

Country Link
GB (2) GB8802393D0 (en)

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3644181A (en) * 1969-07-24 1972-02-22 Sylvania Electric Prod Localized electroplating method
GB1422466A (en) * 1972-06-09 1976-01-28 Ibm Method of plating holes
GB1569994A (en) * 1975-11-17 1980-06-25 Schering Ag Process for the selective electrodeposition of metals
GB1599832A (en) * 1977-02-04 1981-10-07 Schering Ag Electroplating process
GB2100520A (en) * 1981-04-10 1982-12-22 Italtel Spa Making conductive holes in printed circuit boards
WO1984001392A1 (en) * 1982-09-27 1984-04-12 Economics Lab Apparatus and method for electroless plating
US4445978A (en) * 1983-03-09 1984-05-01 Rca Corporation Method for fabricating via connectors through semiconductor wafers
GB2143473A (en) * 1983-06-06 1985-02-13 Int Standard Electric Corp Screen printing process and apparatus and electrical printed circuits obtained therewith
US4514264A (en) * 1984-02-21 1985-04-30 Meco Equipment Engineers B.V. Method and device for galvanically applying a metal coating on metal objects
EP0147901A2 (en) * 1983-12-20 1985-07-10 ITALTEL SOCIETA ITALIANA TELECOMUNICAZIONI s.p.a. Method for coating with ink the walls of through holes in supports for electric circuits, and machine for implementing said method
EP0169456A2 (en) * 1984-07-26 1986-01-29 International Business Machines Corporation Method of eliminating short circuits in electrical circuitry
EP0194247A2 (en) * 1985-03-05 1986-09-10 Svecia Silkscreen Maskiner AB A screen printer adapted for providing a layer of material on the inner surface of a hole passing through a plate
EP0197595A1 (en) * 1985-04-05 1986-10-15 Trt Telecommunications Radioelectriques Et Telephoniques Metallization process for through holes used as thick-film links between the faces of a substrate during serigraphic printing
GB2181743A (en) * 1985-07-16 1987-04-29 Kay Kazuo Metal plating of through holes in printed circuit boards
US4692222A (en) * 1984-11-19 1987-09-08 Pellegrino Peter P Electroplating method and apparatus for electroplating high aspect ratio thru-holes

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3644181A (en) * 1969-07-24 1972-02-22 Sylvania Electric Prod Localized electroplating method
GB1422466A (en) * 1972-06-09 1976-01-28 Ibm Method of plating holes
GB1569994A (en) * 1975-11-17 1980-06-25 Schering Ag Process for the selective electrodeposition of metals
GB1599832A (en) * 1977-02-04 1981-10-07 Schering Ag Electroplating process
GB2100520A (en) * 1981-04-10 1982-12-22 Italtel Spa Making conductive holes in printed circuit boards
WO1984001392A1 (en) * 1982-09-27 1984-04-12 Economics Lab Apparatus and method for electroless plating
US4445978A (en) * 1983-03-09 1984-05-01 Rca Corporation Method for fabricating via connectors through semiconductor wafers
GB2143473A (en) * 1983-06-06 1985-02-13 Int Standard Electric Corp Screen printing process and apparatus and electrical printed circuits obtained therewith
EP0147901A2 (en) * 1983-12-20 1985-07-10 ITALTEL SOCIETA ITALIANA TELECOMUNICAZIONI s.p.a. Method for coating with ink the walls of through holes in supports for electric circuits, and machine for implementing said method
US4514264A (en) * 1984-02-21 1985-04-30 Meco Equipment Engineers B.V. Method and device for galvanically applying a metal coating on metal objects
EP0169456A2 (en) * 1984-07-26 1986-01-29 International Business Machines Corporation Method of eliminating short circuits in electrical circuitry
US4692222A (en) * 1984-11-19 1987-09-08 Pellegrino Peter P Electroplating method and apparatus for electroplating high aspect ratio thru-holes
EP0194247A2 (en) * 1985-03-05 1986-09-10 Svecia Silkscreen Maskiner AB A screen printer adapted for providing a layer of material on the inner surface of a hole passing through a plate
EP0197595A1 (en) * 1985-04-05 1986-10-15 Trt Telecommunications Radioelectriques Et Telephoniques Metallization process for through holes used as thick-film links between the faces of a substrate during serigraphic printing
GB2181743A (en) * 1985-07-16 1987-04-29 Kay Kazuo Metal plating of through holes in printed circuit boards

Also Published As

Publication number Publication date
GB8802393D0 (en) 1988-03-02
GB2214931A (en) 1989-09-13
GB8806544D0 (en) 1988-04-20

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19940318