GB2207009A - Waveguide construction - Google Patents
Waveguide construction Download PDFInfo
- Publication number
- GB2207009A GB2207009A GB08716508A GB8716508A GB2207009A GB 2207009 A GB2207009 A GB 2207009A GB 08716508 A GB08716508 A GB 08716508A GB 8716508 A GB8716508 A GB 8716508A GB 2207009 A GB2207009 A GB 2207009A
- Authority
- GB
- United Kingdom
- Prior art keywords
- waveguide
- insulating body
- conductive material
- waveguide arrangement
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/12—Hollow waveguides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/001—Manufacturing waveguides or transmission lines of the waveguide type
- H01P11/002—Manufacturing hollow waveguides
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Waveguides (AREA)
- Waveguide Aerials (AREA)
Description
2207009 I/7424/MEDL A Waveguide Arrangement This invention relates to a
waveguide arrangement and more particularly, but not exclusively, to a waveguide of the type formed from two parts, each having a c.hannel and means for connecting the parts together so that the two channels cooperate to form a rectangular waveguide.
One such waveguide is shown in Figures 1A, 1B and 1C which show a known waveguide in perspective view, a transverse section of the waveguide of Figure 1A and a sectional view along the line W-W of Figure 1B respectively.
Waveguides formed in this way are most efficient the 'Ispliti. between the two parts is mid-way along broad dimension of the rectangular crosssection of waveguide. This is because at this position if the the the radio frequency current is zero or near zero and thus the split has little effect on the performance of the waveguide. This technique is known generally as "E-plane technology" because the split is in the plane of the electric or E 20 field of the dominant waveguide mode.
E-plane technology is employed in integrated systems comprising a number of components joined by waveguides, both waveguides and components being fabricated in a common conductive block. In many such systems it is desirable to mount conductors or components inside the 1>- - 2 waveguide at or near the E-plane, for instance in fin-line switches. These conductors or components are often mounted on printed circuit boards (P.C.B's). This introduces a problem in that the P.C.B substrate provides a route for energy travelling along the waveguide to escape, which is obviously undesirable.
In a first known method, a P.C.B. substrate is supported in detents in the sides of the waveguide, the detents being so small compared to the wavelength of the radiation carried in the waveguide that they have negligible effect on its propogation. Such a waveguide is shown in Figures 2A, 2B and 2C which show a waveguide of this known type in perspective view, a transverse cross section of the waveguide of Figre 2A and a sectional view on the line X-X of Figure 2B respectively. This method has the disadvantage.of complexity and expense because it requires the P.C.B.1s to be manufactured and placed with great accuracy. Also it is difficult to D.C. isolate the P.C.B's from the waveguide walls if this is required.
In another known method, a P.C.B. substrate passes through the walls of the waveguide and a system of R.F.
chokes is used to prevent the escape of radiation from the waveguide. Such a waveguide is shown in Figures 3A, 3B and 3C which show a waveguide of that known type in perspective view, a transverse cross section of the waveguide of Figure 3A and a sectional view on the line Y Y of Figure 3B respectively. The problem with this method i i i k, 25 is that the increases space required for the chokes greatly the size of the waveguide assembly and the chokes allow a significant amount of radiation to escape from the waveguide.
According to the invention there is provided a waveguide arrangement comprising a waveguide and an insulating body arranged to partially occupy the waveguide, at least some of the surfaces of the insulating body bearing conductive material which is substantially coplanar with a surface of the waveguide.
This gives the advantage that the problems of the known methods outlined above are avoided, such an arrangement prevents the escape of radiation without the need for chokes and because the insulating body defines the edges of the w.aveguide the very accurate manufacturing and assembly required to use detents is not needed, also it is relatively simple to D. C. isolate the insulating body from the waveguide walls.
Preferably the insulating body is substantially planar and the surfaces bearing conductive material are edges of the insulating body.
Advantageously the surfaces bearing conductive material are provided by apertures through the insulating body.
A waveguide assembly embodying theinvention will now be described with reference to the accompanying figures in X- - 4 which:
Figure 4A shows a waveguide assembly in accordance with the invention, Figure 4B shows a transverse cross section of the 5 waveguide of Figure 4A, Figure 4C shows a sectional view on the line Z-Z of Figure 4B, Figure 5 shows a more detailed transverse cross section through the waveguide of Figure 4A, Figure 6 shows a cross section through another type of waveguide assembly constructed according to the invention, Figure 7 shows a top view of the PCB used in the waveguide of Figure 5, and Figure 8 shows a transverse cross section through yet another type of waveguide assembly constructed according to the invention; identical parts having the same reference numerals throughout.
Referring to Figures 4A, B and C and 5, in a k i Y1 - 5 waveguide assembly constructed in accordance with the invention, a P.C.B. 10 separates the two conductive bodies 2 and 3. The P.C.B. 10 has a number of slots 11 cut in it, which are plated through with a layer of conductive 5 material 12. The slots 11 are positioned so that when the P. C.B. 10 is in place, the layer of conductive material 12 is coplanar with a side wall of the waveguide 1 such that the two conductive bodies 2 and 3 and the conductive layer 12 form a single conductive surface.
The conductive layer 12 acts as a part of the waveguide wall and prevents the escape of the radiation propagated along the wavegude. In order to give good results, the portions of the PCB 13 between the slots should be made as small as possible, in order to prevent the escape of radiation through them, however the gaps must also be large enough to give the P.C.B. 10 the necessary physical strength. It has been found that a slot separation in the approximate range X/10 to X/20 gives good results.
The length 14 and width 15 of the slots 11 must be such that they do not form resonant cavities and radiate the radiation propagating along the waveguide 1 to the outside, the length 14 of the slots being near to an odd number of X/4 and the width 15 being in the approximate range X/10 to X/20 has been found, to prevent resonance.
The assembly shown in Figures 6 and 7 is used when it is necessary to D.C. isolate the P.C.B. 1.0 from the - 6 conductive bodies 2 and 3 in order to allow D.C. biasing and control signals to pass to components on the P.C.B. 10 in the waveguide 1.
Referring to figure 6, a conductive pattern 16 is laid down in the surface of the P.C.B. 10 to carry power to a diode 17 mounted on the P.C.B. 10 in the waveguide 1.
An insulating layer 18 is then laid down on the conductive surface of the P.C.B. 10 so that when the waveguide is assembled the insulating layer separates the conductive surface of the P.C.B. 10 from the conductive bodies 2 and 3. This insulating layer 18 insulates the conductive pattern 16 and the conductive layers 12 from the conductive bodies 2 and 3 and so allows D.C. isolation.
Another way in which the invention could be used is is shown in Figure 8. A P.C.B. 19 is supported by detents 20 in conductive bodies 2 and 3. Conductive layers 21 on the edges of the P.C.B. 19 are arranged to form a part of the waveguide walls together with the conductive bodies 2 and The conductive layers 21 cannot, of course, be coplanar with the conductive bodies 2 and 3 because there must be enough overlap to support the P.C.B. 10, but if the overlap is small enough the overlap will not affect the radiation propagating in the waveguide 1. Since the detents 20 cut into the conductive bodies 2 and 3 do not define the walls of the waveguide 1 they need not be i i i 1 1 P _z i 1 i i 1 7 - formed with precision.
Although this description refers to a P.C.B. any other type of insulating substrate could be used.
i i - 8
Claims (8)
1. A waveguide arrangement comprising a waveguide and an insulating body arranged to partially occupy the waveguide, at least some of the surfaces of the insulating body bearing conductive material which is substantially coplanar with a surface of the waveguide.
2. A waveguide arrangement as claimed in claim 1 in which the insulating body is substantially planar and the surfaces bearing conductive material are edges of the insulating body.
3. A waveguide arrangement as claimed in any preceding claim in which the surfaces bearing conductive material are provided by apertures through the insulating body.
4. A waveguide arrangement as claimed in claim 3 in is which the apertures have, at least one planar-face bearing conductive material and arranged to be substantially coplanar with a surface of the.waveguide.
5. A waveguide arrangement as claimed in any preceding claim in which the insulating body is a printed circuit board.
6. A waveguide arrangement as claimed in claim 5 when A dependent on claim 4 in which the conductive material is provided by through plating of apertures in the printed circuit board.
7. A waveguide arrangement substantially as shown in and as described with reference to Figures 4 to 7 of the accompanying drawings.
- 9
8. A waveguide arrangement substantially as shown in and as described with reference to Figure 8 of the accompanying drawings.
Published 19b13 at The Paten., Offlile, State House. 66-71 Hi'.ti Holborn, London WC1R 4TP. Further copies may be ob-.ained from The Patent Office, --- Rt Cray. Orpington, Xent. BR5 3RD Frinted by Mjllilje-, techniT-xes ltd, St, Mary Cray, Kent. Con. 11877.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08716508A GB2207009A (en) | 1987-07-14 | 1987-07-14 | Waveguide construction |
EP88305248A EP0299616A3 (en) | 1987-07-14 | 1988-06-09 | A waveguide arrangement |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08716508A GB2207009A (en) | 1987-07-14 | 1987-07-14 | Waveguide construction |
Publications (2)
Publication Number | Publication Date |
---|---|
GB8716508D0 GB8716508D0 (en) | 1987-08-19 |
GB2207009A true GB2207009A (en) | 1989-01-18 |
Family
ID=10620597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08716508A Withdrawn GB2207009A (en) | 1987-07-14 | 1987-07-14 | Waveguide construction |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0299616A3 (en) |
GB (1) | GB2207009A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4970522A (en) * | 1988-08-31 | 1990-11-13 | Marconi Electronic Devices Limited | Waveguide apparatus |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6265833B2 (en) * | 2014-05-27 | 2018-01-24 | 三菱電機株式会社 | Waveguide slot antenna, transceiver, waveguide slot antenna manufacturing method, and transmitter / receiver manufacturing method |
FR3074612B1 (en) * | 2017-12-05 | 2020-09-11 | Univ Bordeaux | MICROWAVE COMPONENT AND ASSOCIATED MANUFACTURING PROCESS |
CN109103556A (en) * | 2018-08-30 | 2018-12-28 | 深圳大学 | Waveguide filter and its manufacturing method |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1240430A (en) * | 1969-06-23 | 1971-07-21 | Siemens Ag | Improvements in or relating to microwave tubes |
GB1560533A (en) * | 1977-05-18 | 1980-02-06 | Marconi Co Ltd | Waveguide expansion joint |
GB2067020A (en) * | 1979-12-03 | 1981-07-15 | Varian Associates | Circular electric mode microwave window |
GB2082844A (en) * | 1980-07-26 | 1982-03-10 | Philips Nv | Microwave window assembly |
GB2111317A (en) * | 1981-10-19 | 1983-06-29 | Varian Associates | Broadband modefree ceramic waveguide windows |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1210710A (en) * | 1958-06-04 | 1960-03-10 | Thomson Houston Comp Francaise | New waterproof window for waveguides |
US2932806A (en) * | 1958-12-02 | 1960-04-12 | Bomac Lab Inc | Broadband microwave window |
BE772078A (en) * | 1971-03-19 | 1972-01-17 | Thomson Csf | THIN METAL WALL HYPERFREQUENCY COUPLERS |
US4052683A (en) * | 1974-02-28 | 1977-10-04 | U.S. Philips Corporation | Microwave device |
GB2129224B (en) * | 1982-08-27 | 1986-01-15 | Philips Electronic Associated | R f circuit |
-
1987
- 1987-07-14 GB GB08716508A patent/GB2207009A/en not_active Withdrawn
-
1988
- 1988-06-09 EP EP88305248A patent/EP0299616A3/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1240430A (en) * | 1969-06-23 | 1971-07-21 | Siemens Ag | Improvements in or relating to microwave tubes |
GB1560533A (en) * | 1977-05-18 | 1980-02-06 | Marconi Co Ltd | Waveguide expansion joint |
GB2067020A (en) * | 1979-12-03 | 1981-07-15 | Varian Associates | Circular electric mode microwave window |
GB2082844A (en) * | 1980-07-26 | 1982-03-10 | Philips Nv | Microwave window assembly |
GB2111317A (en) * | 1981-10-19 | 1983-06-29 | Varian Associates | Broadband modefree ceramic waveguide windows |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4970522A (en) * | 1988-08-31 | 1990-11-13 | Marconi Electronic Devices Limited | Waveguide apparatus |
Also Published As
Publication number | Publication date |
---|---|
EP0299616A3 (en) | 1990-03-28 |
EP0299616A2 (en) | 1989-01-18 |
GB8716508D0 (en) | 1987-08-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11626652B2 (en) | Ridge gap waveguide and multilayer antenna array including the same | |
US4829314A (en) | Microwave plane antenna simultaneously receiving two polarizations | |
US4527165A (en) | Miniature horn antenna array for circular polarization | |
US6320547B1 (en) | Switch structure for antennas formed on multilayer ceramic substrates | |
US4672384A (en) | Circularly polarized radio frequency antenna | |
KR101089195B1 (en) | Input / output coupling structure of dielectric waveguide | |
US4614947A (en) | Planar high-frequency antenna having a network of fully suspended-substrate microstrip transmission lines | |
US6535088B1 (en) | Suspended transmission line and method | |
US5361049A (en) | Transition from double-ridge waveguide to suspended substrate | |
US4691179A (en) | Filled resonant cavity filtering apparatus | |
US20120242421A1 (en) | Microwave transition device between a microstrip line and a rectangular waveguide | |
JPH05114803A (en) | High-frequency filter and manufacture thereof | |
US6608535B2 (en) | Suspended transmission line with embedded signal channeling device | |
US3292115A (en) | Easily fabricated waveguide structures | |
EP0275650B1 (en) | Satellite antenna feed networks | |
EP1698016B1 (en) | Triangular conforming transmission structure | |
KR100276012B1 (en) | Dielectric filter, transmitting/receiving duplexer, and communication apparatus | |
US4970522A (en) | Waveguide apparatus | |
CN108604723B (en) | High speed data communication system | |
GB2207009A (en) | Waveguide construction | |
US5004993A (en) | Constricted split block waveguide low pass filter with printed circuit filter substrate | |
JPH04802A (en) | Triplate line type inter-substrate connecting element | |
JPH0340961B2 (en) | ||
US11621464B2 (en) | Waveguide assembly | |
EP0432729B1 (en) | Radio frequency signal combining/sorting apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |