GB2139122A

GB2139122A - A method of forming electrically conductive pins

Info

Publication number: GB2139122A
Application number: GB08411274A
Authority: GB
Inventors: David Lee
Original assignee: BICC PLC
Current assignee: Balfour Beatty PLC
Priority date: 1983-05-03
Filing date: 1984-05-02
Publication date: 1984-11-07
Also published as: JPS59207694A; GB8312011D0; EP0125098A1; GB8411274D0

Description

1

GB 2 139 122 A

1

SPECIFICATION

A method of forming electrically conductive pins

5 This invention relates to a method of forming electrically conductive pins for printed circuit boards, and particularly, though not exclusively,

pins for making a solderless connection to the conductive rails on the board.

10 Pins are used to electrically connect components or connectors to the conductive rails. In one known arrangement of printed circuit boards, each hole through the board has a surface layer of metal or metal alloy which is directly connected to a conduc-15 tive rail on the board. Connection between a rail and a pin is made by pushing a pin into the hole, the pin's size and cross-sectional shape being such that a portion of the pin is compliant and has a cross-sectional shape which is distorted to engage, and 20 electrically connect with, the surface layer of the hole, and hence the conductive rail. It is known to manufacture such pins from metal bar or wire stock, for example as shown in GB 1470007. This can constrain the design of the compliant section regard-25 ing material required and can be costly in terms of machinery large enough to perform the required operations on the metal bar.

According to the present invention a method of forming electrically conductive pins for printed cir-30 cuit boards from strip or sheet metal or metal alloy comprises the following steps:-

(a) shearing the strip or sheet to form a carrier strip and pin profiles, each pin profile having a defined portion for becoming the compliant section of the

35 pin, and each profile being attached to the carrier strip;

(b) coining the defined portion of each pin to increase its surface area; and

(c) folding the defined portion of each pin to form 40 the required cross-sectional shape of the compliant section.

Preferably the defined portion of each pin is folded into a substantially C-shaped cross-section. In this case a slot is preferably cut in the defined portion 45 between Steps (b) and (c), the slot extending in the longitudinal direction of the pin. Preferably the slot is centrally positioned in the defined portion. Alternatively the defined portion may be folded into a substantially S-shaped cross-section.

50 The pins may be sold attached to the carrier strip or individually. In the latter case, each pin is preferably removed from the carrier strip by shearing.

Preferably each pin is formed with the compliant 55 section positioned between two longitudinally extending posts. The posts may be defined by cut flat portions of the strip or sheet formed during Step (a) which extend away from the defined portion. In this case, the costs will have a substantially rectangular 60 cross-section. Preferably, however, the cut flat portions are folded round so the posts have a substantially circular cross-section. The folding of the posts is preferably carried out during Step (c).

Alternatively the compliant section may be posi-65 tioned between a post and an electric contact which is either capable of electrically connecting with an electrical (for example an insulation displacement contact or a crimpable ferrule) or capable of mating with a corresponding electric contact (for example a 70 spring contact). In this case the profile of the contacts is preferably formed during Step (a), and the contacts are preferably folded into the required shape during Step (c) if required.

Each pin is preferably formed with an enlarged 75 section adjacent the defined portion of each pin, the enlarged section being formed during Step (a). The enlarged section can be used either to retain each pin in a connector housing of insulating material from which the pin (including the compliant section) 80 projects, or to prevent over insertion of each pin in a hole in the printed circuit board. Preferably the enlarged section is substantially rectangular.

Preferably the sheet is of high strength copper alloy.

85 The invention also includes electrically conductive pins made by the method herein described.

Using this invention pins can be made at a reduced cost from previously known methods.

Although the pins are designed to make a solder-90 less connection with a printed circuit board, they can, if required, also be soldered in position.

The invention will now be described, by way of example only, with reference to the accompanying drawings, in which:-95 Figures 1 to 4 show the stepped formation of electrically conductive pins in accordance with the invention;

Figure 5 is a side view of an alternative electrically conductive pin made in accordance with the inven-100 tion; and

Figure 6 is a cross-sectional view along the line VI-VI of the electrically conductive pin shown in Figure 5.

A continuous sheet of high strength copper alloy is 105 sheared to form, as shown in Figure 1, a carrier strip 1 and a series of pin profiles 2 each having a defined portion 3 positioned between two longitudinally extending posts 4, each having a substantially rectangular cross-section.

110 The defined portion 3 of each pin profile is then coined to enlarge the surface area of the defined position, as shown in Figure 2.

A slot 5, as shown in Figure 3, is then cut into the enlarged defined portion 3 such that it is centrally 115 positioned in the defined portion and extends longitudinally with the axis of the pin profile 2. The defined portion 3 of each pin profile is then folded into a substantially C-shaped cross-section, as shown in Figure 4, to form the compliant section. 120 Each pin is separated from the carrier strip 1 by a shearing machine. The separated carrier strip is collected and recycled.

Figures 5 and 6 show an alternative embodiment of an electrically conductive pin comprising a folded 125 defined portion 3 having a C-shaped cross-section and slit 5 which form the compliant section; a rectangular enlarged section 6 adjacent the compliant section formed during the initial shearing of the copper sheet and which is used either to retain 130 the pin in a connector housing of insulating material

2

GB 2 139 122 A

2

from which the pin (including the compliant section) projects, orto prevent over insertion of the pin in a hole in a printed circuit board; and posts 7 having a substantially circular cross-section.

5

Claims

1. A method of forming electrically conductive pins for printed circuit boards from strip or sheet

10 metal or metal alloy comprises the following steps:-

(a) shearing the strip or sheet to form a carrier strip and pin profiles, each pin profile having a defined portion for becoming the compliant section of the pin, and each profile being attached to the carrier

15 strip;

(b) coining the defined portion of each pin to increase its surface area; and

(c) folding the defined portion of each pin to form the required cross-sectional shape of the compliant

20 section.

2. A method of forming electrically conductive pins as claimed in Claim 1, wherein the defined portion of each pin is folded into a substantially C-shaped cross-section.

25 3. A method of forming electrically conductive pins as claimed in Claim 2, wherein a slot is cut in the defined portion and extends in the longitudinal direction of the pin.

4. A method of forming electrically conductive

30 pins as claimed in Claim 3, wherein the slot is centrally positioned in the defined portion.

5. A method of forming electrically conductive pins as claimed in Claim 3 or Claim 4, wherein the slot is cut between Steps (b) and (c).

35 6. A method of forming electrically conductive pins as claimed in Claim 1, wherein the defined portion is folded into a substantially S-shaped cross-section.

7. A method of forming electrically conductive

40 pins is claimed in any one of Claims 1 to 6, wherein each pin is removed from the carrier strip by shearing.

8. A method of forming electrically conductive pins as claimed in any one of Claims 1 to 7, wherein

45 each pin is formed with the compliant section positioned between two longitudinally extending posts.

9. A method of forming electrically conductive pins as claimed in any one of Claims 1 to 8, wherein

50 at least one post is folded round to have a substantially circular cross-section.

10. A method of forming electrically conductive pins as claimed in Claim 9, wherein the at least one post is folded during Step (c).

55 11. A method of forming electrically conductive pins as claimed in any one Claims 1 to 8, wherein each pin is formed with the compliant section positioned between a post and an electrical contact.

12. A method of forming electrically conductive

60 pins as claimed in Claim 11, wherein the electric contact is formed whilst each pin is attached to the carrier strip.

13. A method of forming electrically conductive pins as claimed in any one of Claims 1 to 12, wherein

65 each pin is formed with an enlarged section adjacent the defined portion.

14. A method of forming electrically conductive pins as claimed in Claim 13, wherein the enlarged section is formed during Step (a).

70 15. A method of forming electrically conductive pins as claimed in Claim 13 or Claim 14, wherein the enlarged section is substantially rectangular.

16. A method of forming electrically conductive pins as claimed in any of Claims 1 to 15, wherein the

75 strip or sheet is of a high strength copper alloy.

17. A method of forming electrically conductive pins as hereinbefore described with reference to Figures 1 to 4 of the accompanying drawings.

18. Electrically conductive pins for printed circuit

80 boards made by a method as claimed in any one of

Claims 1 to 17.

19. Electrically conductive pins for printed circuit boards as hereinbefore described with reference to Figure 4 or Figures 5 and 6 of the accompanying

85 drawings.

Printed in the UKforHMSO, D8818935,9/84,7102.

Published fay The Patent Office, 25 Southampton Buildings, London,

WC2A1 AY, from which copies may be obtained.