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GB2133783B - Oxidising compositions - Google Patents

Oxidising compositions

Info

Publication number
GB2133783B
GB2133783B GB08301103A GB8301103A GB2133783B GB 2133783 B GB2133783 B GB 2133783B GB 08301103 A GB08301103 A GB 08301103A GB 8301103 A GB8301103 A GB 8301103A GB 2133783 B GB2133783 B GB 2133783B
Authority
GB
United Kingdom
Prior art keywords
oxidising compositions
oxidising
compositions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08301103A
Other versions
GB8301103D0 (en
GB2133783A (en
Inventor
Peter James Towler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems Electronics Ltd
Original Assignee
Marconi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Co Ltd filed Critical Marconi Co Ltd
Priority to GB08301103A priority Critical patent/GB2133783B/en
Publication of GB8301103D0 publication Critical patent/GB8301103D0/en
Publication of GB2133783A publication Critical patent/GB2133783A/en
Application granted granted Critical
Publication of GB2133783B publication Critical patent/GB2133783B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
    • C23C22/63—Treatment of copper or alloys based thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB08301103A 1983-01-15 1983-01-15 Oxidising compositions Expired GB2133783B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08301103A GB2133783B (en) 1983-01-15 1983-01-15 Oxidising compositions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08301103A GB2133783B (en) 1983-01-15 1983-01-15 Oxidising compositions

Publications (3)

Publication Number Publication Date
GB8301103D0 GB8301103D0 (en) 1983-02-16
GB2133783A GB2133783A (en) 1984-08-01
GB2133783B true GB2133783B (en) 1985-09-04

Family

ID=10536399

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08301103A Expired GB2133783B (en) 1983-01-15 1983-01-15 Oxidising compositions

Country Status (1)

Country Link
GB (1) GB2133783B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6086743A (en) * 1997-08-06 2000-07-11 Gould Electronics, Inc. Adhesion enhancement for metal foil
US6261466B1 (en) 1997-12-11 2001-07-17 Shipley Company, L.L.C. Composition for circuit board manufacture
US6521139B1 (en) 2000-08-04 2003-02-18 Shipley Company L.L.C. Composition for circuit board manufacture
WO2004045655A2 (en) * 2002-11-14 2004-06-03 Selective Micro Technologies, Llc Cleaning methods using chlorine dioxine solutions

Also Published As

Publication number Publication date
GB8301103D0 (en) 1983-02-16
GB2133783A (en) 1984-08-01

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20020115