GB2126795A - Optical device - Google Patents
Optical device Download PDFInfo
- Publication number
- GB2126795A GB2126795A GB08324035A GB8324035A GB2126795A GB 2126795 A GB2126795 A GB 2126795A GB 08324035 A GB08324035 A GB 08324035A GB 8324035 A GB8324035 A GB 8324035A GB 2126795 A GB2126795 A GB 2126795A
- Authority
- GB
- United Kingdom
- Prior art keywords
- thick film
- integrated circuit
- optical
- film circuits
- light active
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 25
- 239000013307 optical fiber Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 description 8
- 239000000835 fiber Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000008393 encapsulating agent Substances 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
A low cost optical device for transmitting or receiving light is formed by securing a light active device (LED or photodiode) on to a hybrid board, preferably a thick film circuit, which also provides the interconnections necessary for the integrated circuit driver/receiver.
Description
SPECIFICATION
Optical device
The present invention relates to optical devices and more particularly to the design and fabrication of low cost fibre optic link transmitter and receiver components.
A fibre optic link transmitter and receiver requires a light emitting diode (LED) or detector and a driver or amplifier circuit associated respectively therewith.
It is an object of the present invention to provide a low cost fibre optic link transmitter and receiver component.
The present invention provides an optical fibre receiver or transmitter component comprising light active device which may be a receiver or transmitter of light and an associated respective integrated circuit in which the integrated circuit and light active device are mounted on the same hybrid board.
In a preferred embodiment the light active device is mounted in a recess in the hybrid board on which the integrated circuit substrate is mounted.
Preferably the integrated circuit is covered by a hermetically sealed cover to produce an integrated circuit package on the hybrid board. The light active device is preferably provided with a "pigtail" which is rigidly secured to the upper surface of the cover of the integrated package.
In a further preferred embodiment the optical device incorporates an optical connector for attachment to an optical cable.
Preferably the hybrid board is a thick film or a plurality of inter-connecting thick film circuits providing a complex connection pattern.
Embodiments of the present invention will now be described with reference to the accompanying drawings in which
Figure 1 shows a hybrid printed wiring board for the present invention,
Figure 2 shows the board of Figure 1 in a second stage of production with a cut out for an
LED,
Figure 3 shows the board of Figures 1 and 2 in a third stage of production with the connection legs attached,
Figure 4 shows the board of Figures 1, 2 and 3 in a fourth stage of production,
Figure 5 shows the board of Figures 1 to 4 following a fifth stage of production to produce the optical fibre receiver and transmitter component according to the present invention,
Figure 6 shows a schematic view of a component according to the present invention in cut away form,
Figure 7 shows an alternative mounting for the light active device,
Figure 8 shows a perspective view of a transmitter module,
Figure 9 shows a perspective view of a receiver module,
Figure 10 shows a partial cross section of a first optical device assembly according to the present invention and,
Figure 11 shows a partial cross section of a second optical device assembly according to the present invention incorporating an optical connector.
Referring now to Figure 1, a printed wiring board 10 has a number of tracks 1 2 on its upper surface each connected to a first pad 14 and to a second smaller pad 16. The tracks 12 and pads 1 6 are arranged to leave two areas 1 8, 20 clear for reasons which will become apparent with reference to Figure 2. Only a few of the tracks 12 which would be present on a practical component are shown for clarity. In a practical embodiment the board 10 is a ceramic thick film circuit of typical dimension 21 inch \ 1 inch.
In Figure 2 the area 20 has been cut out to give a shape suitable for later reception of an LED (see
Figure 5). The invention will be described using an
LED and associated integrated circuit. However a photodiode and an integrated circuit for amplification of a received signal may be substituted therefore. On the area 18 an integrated circuit chip 22 is mounted for control of the light emitted from LED 30 (see Figure 5).
Electrical connections are made via gold or aluminium wires 23 of which one only is shown for clarity.
In a preferred embodiment the integrated circuit 22 is mounted on a ceramic thick film circuit 24 with appropriate conductor tracking to contact/bond pads for the integrated circuit and optical device (LED) attachment.
With reference to Figure 3 in a further stage the board 10 is equipped with connection legs 26 to enable the completed device to be mounted as a standard integrated circuit package.
In Figure 4 the integrated circuit is shown after bonding to the thick film circuit 24 and encapsulation with a ceramic inverted lid 28.
In Figure 5 the optical component 30, which may be a light emitting device (LED) or a light detection device (photodiode), is shown fixed to the board 10. This component is hermetically sealed within the package 30. The component package 30 may be soldered or bonded with a suitable adhesive to this board. The glass fibre tail 32 of the component 30 may be treated so as to be solderable to the upper surface of the ceramic lid 28 as shown at 32. Thus the optical component and electronic circuit are fixed rigidly to one another as shown in the elevation view of
Figure 5a.
The optical component and integrated circuit hybrid may be encapsulated with a low cost plastic enclosure 34 which may or may not be sealed/potted with resin. This allows cable attachment if required or alternatively a fibre pigtail 36 can be used as shown in Figure 6 or a connector attached to the fibre.
The mixture of hermetically sealed active components together with plastic encapsulation gives the advantage of high package environmental resistance, reliability and low cost packaging.
If higher performance receivers are required then high quality front-end components e.g. SaSs
FET; Si JFET; Si MOSFET can be encapsulated under the ceramic lid 28 together with the integrated circuit 22.
The construction concept is applicable to any wavelength fibre optic component e.g. 0.8; 0.85; 0.9; 1.3; or 1.6 microns.
With reference to Figure 7, an alternative arrangement to the cut out 20 is shown. In this arrangement a heat sink bock 40 (e.g. made of copper) is mounted on top of the board 10 for example by soldering on to a pad on the board and is provided with a hole 42 for reception of the optical component.
The arrangement of Figure 7 is further exemplified in Figure 8 which shows an optical transmitter device prior to insertion of the light emitting diode and integrated circuit.
With reference to Figure 8 the block 40 is mounted onto a ceramic thick film circuit 44.
The light emitting device 46 is mounted in the block 40 and the optical fibre tail (not shown) may be secured to a plate 48 shown in dotted outline which provides a seal for a recess 50 within which the integrated circuit chip 22 (see Figure 2) is mounted. The lid 48 provides a hermetic seal for the integrated circuit 22 which may be further enforced by a secondary seal formed by filling the external enclosure with an encapsulant as described hereinafter with reference to Figures 10, 11.
The light emitting device 46 may be provided with power via track 52 and conductive block 40 and via a lead 54 to track 46.
With reference now to Figure 9 there is shown a receiver module prior to invention of the photodiode and integrated circuit.
The photodiode is mounted in the saddle shaped structure 60 which structure provides a heat sink for the diode. The output lead of the diode is soldered to one of the pads, for example 62 on a ceramic thick film circuit layer 64.
The thick film circuit comprises a plurality of layers 63, 64, 66 and 68 which are joined together and enable a greater complexity of connections to the integrated circuit 22 (not shown) which is connected in a recess 70 in layer 66. As in Figure 8 a lid 72 indicated by dotted lines is provided to seal the enclosure 74. The sealing lid is again preferably made from gold plated kovar. A metal plate 76 may be provided underneath the thick film substrate 68 to provide further heat sinking. This plate may also be present in the previous embodiments.
With reference now to Figure 10 a partial cross section through Figure 9 is shown including a top cover 80 and a bush 82 which supports the optical fibre "pigtail" 84. The space 86 within the cover 80 may be filled with an encapsulant material to provide additional environmental protection.
With reference to Figure 11 the hybrid thick film structure is as for Figure 10 but instead of the bush 82 and "pigtail" 84 the light emitting diode or the photodiode 90 (shown dotted) is enclosed in one part of an optical connector 92. Thus connection can be made by use of the other mating part of the optical connector.
Again as in Figure 10 the space 86 may be filled with an encapsulating material which provides an additional environmental protection for the integrated circuit 94 and for the connector arrangement. The integrated circuit is therefore hermetically sealed as a stand alone component, it is sealed within the enclosure formed by the ceramic thick film circuit and the lid 72 ,which enclosure may in all cases be partially or wholly filled with an encapsulant material and it is protected by the top cover 80 and by any encapsulant 86 introduced therein. The completed device is therefore extremely rugged and environmentally well protected.
Claims (7)
1. An optical device for transmitting or receiving light via an optical fibre including a light active device and an associated electrical circuit in which the integrated circuit and light active device are mounted on the same hybrid board.
2. An optical device as claimed in claim 1 in which the hybrid board comprises one or more thick film circuits to provide connection between outputs pins and said integrated circuit and said light active device.
3. An optical device as claimed in claim 2 in which there are a plurality of thick film circuits and in which the integrated circuit is mounted within a recess formed in the plurality of thick film circuits and in which the enclosure formed in said plurality of thick film circuits is hermetically sealed by a lid.
4. An optical device as claimed in claim 3 in which the light active device is mounted in a thermally conductive mount secured to the bottom one of said plurality of thick film circuits.
5. An optical device as claimed in claim 4 in which a metal plate is secured to the outside surface of the bottom one of said plurality of thick film circuits to provide an additional heat sinking for the light active device.
6. An optical device as claimed in claim 3 in which the plurality of thick film circuits is provided with a cover, in which the cover provides a bush for protection of a pigtail optical fibre connected to said light active device.
7. An optical device as claimed in claim 3 in which the light active device is an integral part of one half of an optical fibre connector, which is secured to one of said plurality of thick film circuits.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08324035A GB2126795B (en) | 1982-09-09 | 1983-09-07 | Optical device |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8225789 | 1982-09-09 | ||
| GB08324035A GB2126795B (en) | 1982-09-09 | 1983-09-07 | Optical device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8324035D0 GB8324035D0 (en) | 1983-10-12 |
| GB2126795A true GB2126795A (en) | 1984-03-28 |
| GB2126795B GB2126795B (en) | 1986-12-03 |
Family
ID=26283797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08324035A Expired GB2126795B (en) | 1982-09-09 | 1983-09-07 | Optical device |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2126795B (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2140548A (en) * | 1983-05-27 | 1984-11-28 | Rau Swf Autozubehoer | Compact bulb support |
| EP0184747A1 (en) * | 1984-12-13 | 1986-06-18 | Heimann GmbH | Infrared detector |
| GB2173917A (en) * | 1985-04-12 | 1986-10-22 | Tektronix Inc | Optical fibre connected to electro-optical transducer |
| WO1987002833A1 (en) * | 1985-10-28 | 1987-05-07 | American Telephone & Telegraph Company | Multilayer ceramic laser package |
| US4802178A (en) * | 1986-04-10 | 1989-01-31 | Ortel Corporation | High speed fiberoptic laser module |
| EP0381370A2 (en) * | 1989-02-01 | 1990-08-08 | AT&T Corp. | Improved packaging techniques for optical transmitters/receivers |
| US4997253A (en) * | 1989-04-03 | 1991-03-05 | Tektronix, Inc. | Electro-optical transducer module and a method of fabricating such a module |
| EP0437931A2 (en) * | 1989-12-26 | 1991-07-24 | AT&T Corp. | Packaging for a pair of optical devices |
| EP0472755A1 (en) * | 1990-08-28 | 1992-03-04 | Sumitomo Electric Industries, Ltd. | Optical module |
| US5127071A (en) * | 1990-03-13 | 1992-06-30 | Sumitomo Electric Industries, Ltd. | Optical module including receptacle, and method of producing the same |
| US5304818A (en) * | 1990-03-16 | 1994-04-19 | Sumitomo Electric Industries, Ltd. | Lead frame |
| GB2295727A (en) * | 1994-11-30 | 1996-06-05 | Nikkodo Co Ltd | Light pickup device |
| EP0883003A2 (en) * | 1997-05-29 | 1998-12-09 | Shinko Electric Industries Co. Ltd. | Optical semiconductor device and lead frame used in it |
| EP1014132A2 (en) * | 1998-12-21 | 2000-06-28 | Sumitomo Electric Industries, Ltd. | Optical module |
| EP1388916A1 (en) * | 2002-08-09 | 2004-02-11 | Agilent Technologies, Inc. - a Delaware corporation - | Optoelectronic package |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69033400T2 (en) * | 1990-03-13 | 2000-05-11 | Sumitomo Electric Industries, Ltd. | Optical module and method for its production |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2044949A (en) * | 1979-03-07 | 1980-10-22 | Vero Electronics Ltd | A terminating connector for a fibre optic able |
| GB2052785A (en) * | 1979-07-05 | 1981-01-28 | Burr Brown Res Corp | Low profile optical coupling to planar-mounted optoelectronic device |
| GB2087681A (en) * | 1980-11-17 | 1982-05-26 | Geosource Inc | Seismic cable connector with otical transceiver |
| GB2096401A (en) * | 1981-04-04 | 1982-10-13 | Int Computers Ltd | Improvements in or relating to electro-optical systems |
-
1983
- 1983-09-07 GB GB08324035A patent/GB2126795B/en not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2044949A (en) * | 1979-03-07 | 1980-10-22 | Vero Electronics Ltd | A terminating connector for a fibre optic able |
| GB2052785A (en) * | 1979-07-05 | 1981-01-28 | Burr Brown Res Corp | Low profile optical coupling to planar-mounted optoelectronic device |
| GB2087681A (en) * | 1980-11-17 | 1982-05-26 | Geosource Inc | Seismic cable connector with otical transceiver |
| GB2096401A (en) * | 1981-04-04 | 1982-10-13 | Int Computers Ltd | Improvements in or relating to electro-optical systems |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2546608A1 (en) * | 1983-05-27 | 1984-11-30 | Rau Swf Autozubehoer | ILLUMINATION DEVICE, IN PARTICULAR FOR A MOTOR VEHICLE INSTRUMENT |
| GB2140548A (en) * | 1983-05-27 | 1984-11-28 | Rau Swf Autozubehoer | Compact bulb support |
| EP0184747A1 (en) * | 1984-12-13 | 1986-06-18 | Heimann GmbH | Infrared detector |
| GB2173917A (en) * | 1985-04-12 | 1986-10-22 | Tektronix Inc | Optical fibre connected to electro-optical transducer |
| US4722586A (en) * | 1985-04-12 | 1988-02-02 | Tektronix, Inc. | Electro-optical transducer module |
| GB2173917B (en) * | 1985-04-12 | 1989-06-21 | Tektronix Inc | Electro-optical transducer module |
| JP2580142B2 (en) | 1985-10-28 | 1997-02-12 | アメリカン テレフォン アンド テレグラフ カムパニー | Multilayer ceramic laser package |
| WO1987002833A1 (en) * | 1985-10-28 | 1987-05-07 | American Telephone & Telegraph Company | Multilayer ceramic laser package |
| US4802178A (en) * | 1986-04-10 | 1989-01-31 | Ortel Corporation | High speed fiberoptic laser module |
| EP0381370A2 (en) * | 1989-02-01 | 1990-08-08 | AT&T Corp. | Improved packaging techniques for optical transmitters/receivers |
| EP0381370A3 (en) * | 1989-02-01 | 1991-09-04 | AT&T Corp. | Improved packaging techniques for optical transmitters/receivers |
| US4997253A (en) * | 1989-04-03 | 1991-03-05 | Tektronix, Inc. | Electro-optical transducer module and a method of fabricating such a module |
| EP0437931A2 (en) * | 1989-12-26 | 1991-07-24 | AT&T Corp. | Packaging for a pair of optical devices |
| EP0437931A3 (en) * | 1989-12-26 | 1991-12-11 | American Telephone And Telegraph Company | Lightwave packaging for pairs of optical devices |
| US5127071A (en) * | 1990-03-13 | 1992-06-30 | Sumitomo Electric Industries, Ltd. | Optical module including receptacle, and method of producing the same |
| US5304818A (en) * | 1990-03-16 | 1994-04-19 | Sumitomo Electric Industries, Ltd. | Lead frame |
| EP0472755A1 (en) * | 1990-08-28 | 1992-03-04 | Sumitomo Electric Industries, Ltd. | Optical module |
| US5170453A (en) * | 1990-08-28 | 1992-12-08 | Sumitomo Electric Industries, Ltd. | Optical module |
| GB2295727A (en) * | 1994-11-30 | 1996-06-05 | Nikkodo Co Ltd | Light pickup device |
| EP0883003A2 (en) * | 1997-05-29 | 1998-12-09 | Shinko Electric Industries Co. Ltd. | Optical semiconductor device and lead frame used in it |
| EP0883003A3 (en) * | 1997-05-29 | 1999-10-20 | Shinko Electric Industries Co. Ltd. | Optical semiconductor device and lead frame used in it |
| EP1014132A2 (en) * | 1998-12-21 | 2000-06-28 | Sumitomo Electric Industries, Ltd. | Optical module |
| EP1014132A3 (en) * | 1998-12-21 | 2004-09-08 | Sumitomo Electric Industries, Ltd. | Optical module |
| EP1388916A1 (en) * | 2002-08-09 | 2004-02-11 | Agilent Technologies, Inc. - a Delaware corporation - | Optoelectronic package |
| US6841799B2 (en) | 2002-08-09 | 2005-01-11 | Agilent Technologies, Inc. | Optoelectronic package |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8324035D0 (en) | 1983-10-12 |
| GB2126795B (en) | 1986-12-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |