GB2126250A - Production of electrotinned goods free from whiskers - Google Patents
Production of electrotinned goods free from whiskers Download PDFInfo
- Publication number
- GB2126250A GB2126250A GB08323942A GB8323942A GB2126250A GB 2126250 A GB2126250 A GB 2126250A GB 08323942 A GB08323942 A GB 08323942A GB 8323942 A GB8323942 A GB 8323942A GB 2126250 A GB2126250 A GB 2126250A
- Authority
- GB
- United Kingdom
- Prior art keywords
- tin
- goods
- electrotinned
- whiskers
- heat treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
- C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
Abstract
Process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers, characterised in that the electrotinned goods are subjected to subsequent heat treatment, during which they are heated to a temperature just below the melting point of the tin applied by electroplating or below the eutectic temperature of the tin alloy applied. The tinned goods are preferably heated to a temperature from 5 DEG C to 30 DEG C below the melting point of tin or below the eutectic temperature. Heating preferably carried out in an inert gas.
Description
SPECIFICATION
Process for the production of electrotinned goods substantially free from whiskers
The invention relates to a process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers.
The problem of the formation of whiskers exists in tinning, especially of wires or conductor tracks. These whiskers, which consist of filamentous monocrystals, grow on tin, for example on tinned wires or conductor tracks, and can lead to various troubles, such as, for example short circuits in conductor tracks, by growing from one conductor track to another and bridging them. This whisker formation is caused by the tension in the layer of tin or tin alloy applied. If this tension decreases in the course of time through ageing, whiskers are formed as a result of the energy released.
Various measures for avoiding such adverse formation of whiskers are already known. For example, if the tin is melted, less whisker formation occurs. Although layers of tin obtained by hot tinning or by melting layers of tin applied by electroplating have the advantage of a lower tendency to form whiskers, they have the disadvantage that, especially in the case of wires, the layer of tin applied is asymmetric to the core to be tinned. This asymmetry or non-uniformity of the layer of tin applied has the disadvantage that they do not have the minimum coating thicknesses specified by the relevant standards over the cross-section mentioned, which means that difficulties may occur during soldering. As a result of diffusion of atoms from the core consisting of, for example, copper into the tin layer applied and vice versa, a copper/tin phase forms.However, if, because of the non-uniformity mentioned, the layer of tin is so thin that it is completely occupied by the copper/tin phase, no further wetting with tin in the context of a subsequent processing operation can be achieved. Such a processing operation can be, for example, soldering of a component into a printed circuit board or soldering of a wire onto a component, such as, for example, in the production of capacitors, contamination of the electrode occurring in the latter case
The invention is therefore based on the object of providing a process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers, the invention being characterised in that the electrotinned goods are subjected to subsequent heat treatment, during which they are heated to a temperature just below the melting point of the tin applied by electroplating or just below the eutectic temperature of the tin alloy applied. The advantage of a tin layer of uniform thickness produced by electrotinning and its substantially whisker-free formation can thereby be achieved.
This reliably ensures that the layer of tin is wettable at all points and hence any subsequent processing operations can be carried out without problems.
The abovementioned mechanical tension is released by heating the material to be tinned to a high temperature, and the formation of whiskers is therefore stopped in a relatively simple and reliable manner. It is of no importance here whether the layer of tin applied by electroplating consists of pure tin or of a tin alloy, such as, for example, a tin/lead alloy. It is advantageous, especially in the case of tin/lead alloys with a high lead content, to carry out the heating according to the invention under an inert gas.
According to another advantageous embodiment of the process, the tinned goods can be heated to about 5 to about 300C below the melting point of tin or to just below the eutectic temperature of the alloy.
In the heat treatment, according to the invention, of wires, it has proved particularly advantageous if the wire or wires passes or pass continuously through a heat treatment zone. The best results have been achieved with a heating oven, but heating can also be effected inductively by infrared treatment or the like. The wire heattreated in this manner is then advantageously subjected to enforced cooling, that is to say it passes through a cooling zone, which can be realised in the most diverse manners which are known per se.
Preferably, with tinned piece goods, these can most advantageously be introduced as such into a heating oven for the purpose of the heat treatment according to the invention. When the heat treatment has been carried out, the piece goods are preferably left to cool at room temperature.
Claims
1. Process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers, characterised in that the electrotinned goods are subjected to subsequent heat treatment, during which they are warmed to a temperature must below the melting point of the tin applied by electroplating or below the eutectic temperature of the tin alloy applied.
2. Process according to claim 1, characterised in that the tinned goods are heated to a temperature which is up to 50C to about 300C below the melting point of tin or below the eutectic temperature.
3. Process according to claim 1 or 2, characterised in that the heating is carried out under an inert gas.
4. Process according to claim 1, 2 or 3, characterised in that the electrotinned goods are subjected to the subsequent heat treatment by continuously passing through a heat treatment zone, for example in a heating oven.
5. Process according to claim 4, characterised in that the electrotinned goods are subjected to enforced cooling after the subsequent heat treatment.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (7)
1. Process for the production of electrotinned goods, in particular electrotinned wires, substantially free from whiskers, characterised in that the electrotinned goods are subjected to subsequent heat treatment, during which they are warmed to a temperature must below the melting point of the tin applied by electroplating or below the eutectic temperature of the tin alloy applied.
2. Process according to claim 1, characterised in that the tinned goods are heated to a temperature which is up to 50C to about 300C below the melting point of tin or below the eutectic temperature.
3. Process according to claim 1 or 2, characterised in that the heating is carried out under an inert gas.
4. Process according to claim 1, 2 or 3, characterised in that the electrotinned goods are subjected to the subsequent heat treatment by continuously passing through a heat treatment zone, for example in a heating oven.
5. Process according to claim 4, characterised in that the electrotinned goods are subjected to enforced cooling after the subsequent heat treatment.
6. Process according to claim 1, 2 or 3, characterised in that the electrotinned goods are subjected to the subsequent heat treatment by introduction as piece goods into a heating oven.
7. Process according to claim 6, characterised in that the tinned goods are brought out of the oven when the heat treatment has ended and are exposed to room temperature.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT334882A AT378008B (en) | 1982-09-07 | 1982-09-07 | METHOD FOR PRODUCING WIRE COATED WITH A TIN ALLOY |
Publications (2)
Publication Number | Publication Date |
---|---|
GB8323942D0 GB8323942D0 (en) | 1983-10-12 |
GB2126250A true GB2126250A (en) | 1984-03-21 |
Family
ID=3549178
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08323942A Withdrawn GB2126250A (en) | 1982-09-07 | 1983-09-07 | Production of electrotinned goods free from whiskers |
Country Status (3)
Country | Link |
---|---|
AT (1) | AT378008B (en) |
DE (2) | DE3331212A1 (en) |
GB (1) | GB2126250A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1614771A1 (en) * | 2004-06-25 | 2006-01-11 | Ormecon GmbH | Tin-coated printed circuit boards with a low tendency to the whisker formation |
US7396596B2 (en) | 2004-06-23 | 2008-07-08 | Ormecon Gmbh | Article with a coating of electrically conductive polymer |
WO2010061259A1 (en) * | 2008-11-27 | 2010-06-03 | Toyota Jidosha Kabushiki Kaisha | Plating substrate having sn plating layer, and fabrication method therefor |
US7947199B2 (en) | 2005-03-02 | 2011-05-24 | Ormecon Gmbh | Conductive polymers consisting of anisotropic morphology particles |
US7989533B2 (en) | 2005-08-19 | 2011-08-02 | Ormecon Gmbh | Chemical compound comprising an indium-containing intrinsically conductive polymer |
US8153271B2 (en) | 2006-09-13 | 2012-04-10 | Ormecon Gmbh | Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |
US8344062B2 (en) | 2004-01-23 | 2013-01-01 | Ormecon Gmbh | Dispersions of intrinsically conductive polymers |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3440668A1 (en) * | 1984-11-07 | 1986-05-07 | Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen | METHOD FOR PRESERVING THE SOLUTABILITY OF LEAD TIN |
AT386147B (en) * | 1986-04-16 | 1988-07-11 | Neumayer Karl | METHOD FOR PRODUCING TAPE OR WIRE SHAPED MATERIAL |
DE102010054539A1 (en) * | 2010-12-15 | 2012-06-21 | OTB Oberflächentechnik in Berlin GmbH & Co. KG | Method for producing a workpiece made of copper or a copper alloy with a coating |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB985044A (en) * | 1960-09-12 | 1965-03-03 | United States Steel Corp | Method and apparatus for reflowing the coating on tin plate |
FR2244017B1 (en) * | 1973-09-14 | 1977-09-23 | Stephanois Rech | |
DE2730625C3 (en) * | 1977-07-07 | 1980-01-17 | Kabel- Und Metallwerke Gutehoffnungshuette Ag, 3000 Hannover | Process for the production of heavily tinned copper wires |
DE2931939C2 (en) * | 1979-08-07 | 1982-07-08 | Felten & Guilleaume Carlswerk AG, 5000 Köln | Method and device for the production of heavily tinned copper wires, in particular jumper wires |
-
1982
- 1982-09-07 AT AT334882A patent/AT378008B/en not_active IP Right Cessation
-
1983
- 1983-08-30 DE DE19833331212 patent/DE3331212A1/en not_active Withdrawn
- 1983-09-07 DE DE19838325961 patent/DE8325961U1/en not_active Expired
- 1983-09-07 GB GB08323942A patent/GB2126250A/en not_active Withdrawn
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8344062B2 (en) | 2004-01-23 | 2013-01-01 | Ormecon Gmbh | Dispersions of intrinsically conductive polymers |
US7396596B2 (en) | 2004-06-23 | 2008-07-08 | Ormecon Gmbh | Article with a coating of electrically conductive polymer |
EP1614771A1 (en) * | 2004-06-25 | 2006-01-11 | Ormecon GmbH | Tin-coated printed circuit boards with a low tendency to the whisker formation |
US7547479B2 (en) | 2004-06-25 | 2009-06-16 | Ormecon Gmbh | Tin-coated printed circuit boards with low tendency to whisker formation |
US7947199B2 (en) | 2005-03-02 | 2011-05-24 | Ormecon Gmbh | Conductive polymers consisting of anisotropic morphology particles |
US7989533B2 (en) | 2005-08-19 | 2011-08-02 | Ormecon Gmbh | Chemical compound comprising an indium-containing intrinsically conductive polymer |
US8153271B2 (en) | 2006-09-13 | 2012-04-10 | Ormecon Gmbh | Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |
WO2010061259A1 (en) * | 2008-11-27 | 2010-06-03 | Toyota Jidosha Kabushiki Kaisha | Plating substrate having sn plating layer, and fabrication method therefor |
Also Published As
Publication number | Publication date |
---|---|
GB8323942D0 (en) | 1983-10-12 |
DE3331212A1 (en) | 1984-03-08 |
ATA334882A (en) | 1984-10-15 |
DE8325961U1 (en) | 1984-12-13 |
AT378008B (en) | 1985-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |