GB2119754A - Blister packs - Google Patents

Abstract

Electronic components, etc, are packed in pockets 1 in a flexible tape 3, which pockets are closed by a membrane attached by welding 2. Sprocket holes 4 facilitate feeding of the tape and the components may be released by the effect of a heat pulse on the membrane. <IMAGE>

Description

SPECIFICATION A novel method of packaging small electronic components In the electronic industry surface mounted components are currently packaged on a tape similar to a sprocket holed piece of photographic film, except that it is normally made of 2 or 3 parts and contains pockets for the storage of components between manufacture and their use by the assemblers at another location by automatic assembly techniques. One part of this tape is designed to be peeled back at the user end to facilitate access to the component.

This method has two failings: it creates two separate waste products, and the component is not protected from the effects of the atmosphere.

In certain constructions of these tapes, there is also a third failing in that, with time, contaminants are liberated by the packaging materials.

The prepared tape is manufactured from a material that is heat sensitive, and is low temperature formable and weldable, e.g. a plastic or PVC.

The tape will be produced from two pieces, one relatively thick, and the other little more than a membrane.

The tape base manufactured from the thicker material will be sprocket holed in a conventional manner, e.g. punching. It is then passed through a forming stage, e.g. heated vacuum stage, to produce pockets to hold the desired components.

The tape will now be passed to the component manufacture to package the components. After component insertion, the tape will pass through a stage where, with or without air evacuation of the pocket, a thin membrane of the base material is welded over the pocket. (See diagram 1.) Obviously, membranes of alternative materials may be successfully welded to the base, or adequately attached to produce a seal that also may be used. The complete tape containing components is now passed to the user. Here a small modification to the existing tape handlers will be required. This will replace the current packer for the cover slip. It will be a means of rapidly heating the thin membrane, e.g. by hot gas blast or by a pulsed electric heating element. It is necessarily of short duration so that it has zero effect on the contained component.The effect of the heat pulse is to rupture the membrane and cause it to shrink back, exposing the component for use. The cover is therefore still attached to the base, and only one piece of waste material has to be handled.

The above, in addition to handling electronic components, is similarly usable wherever automatic exposure of the contained part is required, and could be used in such fields as autodispensers of foodstuffs, mechanical parts, etc..

An example of this could be the automatic dispensing of screws to assembler machiens or pre-determined quantities of foodstuffs at a vending machine providing meals say, in a canteen. In the latter case the sealed nature of the containment part of the tape being most desirable.

So that a better understanding of the above may be achieved the tape structure is shown in accompanying diagrams referred to below.

Fig. 1 shows a section of the tape. The main section (3) in which is formed the pockets (1) and sprocket holes (4). These may be on both sides.

The pockets are sealed with a membrane welded at (2).

Fig. 2 is a cross-section along the line A-A Fig. 1, with a component (5) enclosed. It also clearly shows the sealing membrane (6) and the weld line (2).

Fig. 3 is an identical cross-section of Fig. 2 showing the membrane (6) after it has been ruptured by the application of heat and shrunk back to enable removal of the component (5).

Claims (5)

Claims

1. A continuous flexible tape system for packaging items and give improved protection and accessability in fully sealed pockets.

2. A process for packaging as claimed in Claim 1 for packaging electronic components.

3. A process as claimed in preceding claims adapted for packaging mechanical parts.

4. A process as claimed in preceding claims adapted for handling foodstuffs.

5. A process as claimed in preceding claims adapted for automatic handling and dispensing equipment, giving improved performance on the relavent handling and dispensing machines.