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GB2118392A - Voltage-controlled oscillator mounted on a thick-film printed substrate - Google Patents

Voltage-controlled oscillator mounted on a thick-film printed substrate Download PDF

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Publication number
GB2118392A
GB2118392A GB08307555A GB8307555A GB2118392A GB 2118392 A GB2118392 A GB 2118392A GB 08307555 A GB08307555 A GB 08307555A GB 8307555 A GB8307555 A GB 8307555A GB 2118392 A GB2118392 A GB 2118392A
Authority
GB
United Kingdom
Prior art keywords
oscillator
oscillation
controlled oscillator
resonator
thick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08307555A
Other versions
GB8307555D0 (en
Inventor
Yukio Fukumura
Masayuki Matsukura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of GB8307555D0 publication Critical patent/GB8307555D0/en
Publication of GB2118392A publication Critical patent/GB2118392A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/245Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/18Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance
    • H03B5/1841Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a strip line resonator
    • H03B5/1847Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising distributed inductance and capacitance the frequency-determining element being a strip line resonator the active element in the amplifier being a semiconductor device
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B2200/00Indexing scheme relating to details of oscillators covered by H03B
    • H03B2200/0014Structural aspects of oscillators
    • H03B2200/002Structural aspects of oscillators making use of ceramic material
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B2200/00Indexing scheme relating to details of oscillators covered by H03B
    • H03B2200/0014Structural aspects of oscillators
    • H03B2200/0022Structural aspects of oscillators characterised by the substrate, e.g. material
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B2200/00Indexing scheme relating to details of oscillators covered by H03B
    • H03B2200/003Circuit elements of oscillators
    • H03B2200/004Circuit elements of oscillators including a variable capacitance, e.g. a varicap, a varactor or a variable capacitance of a diode or transistor
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B2200/00Indexing scheme relating to details of oscillators covered by H03B
    • H03B2200/006Functional aspects of oscillators
    • H03B2200/0086Functional aspects of oscillators relating to the Q factor or damping of the resonant circuit
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03BGENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B2200/00Indexing scheme relating to details of oscillators covered by H03B
    • H03B2200/006Functional aspects of oscillators
    • H03B2200/0088Reduction of noise
    • H03B2200/009Reduction of phase noise
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inductance-Capacitance Distribution Constants And Capacitance-Resistance Oscillators (AREA)

Abstract

A voltage-controlled oscillator includes an electrically insulating ceramic substrate 1 on which there is mounted an oscillator 101, 23, a resonator 11 for determining the frequency of oscillation of the oscillator and an oscillation frequency control 41, 21, 22 for changing the frequency of the oscillation, the resonator comprising a thick-film conductive layer forming a quarter- wavelength microstrip line 311a. Conductive connection patterns, e.g. 312a and a grounding pattern 2a on the reverse of the substrate are also thick- film printed. In order to increase the oscillator Q-factor, the pattern 311a for the resonator 11 and preferably also the connecting and grounding patterns are metal-plated (with copper or silver) 311b, 312b, 2b. <IMAGE>

Description

SPECIFICATION Voltage controlled oscillator mounted on a thickfilm printed substrate Background of the invention The present invention relates to a voltage controlled oscillator for use in digital frequency synthesizers, etc.
Digital frequency synthesizers have recently been used as the receiving or transmitting oscillator of a mobile radio equipment for VHF and UHF bands.
High immunity to mechanical vibration and an excellent spectrum purity are required of a digital frequency synthesizer for use in such fields. This is because a mobile radio transmitter is susceptible to vibration and shock, and its oscillator is required to have a high frequency spectrum purity. If a digital frequency synthesizer does not fulfill said requirements, an undesirable modulation tends to be caused at the radio transmitter by vibration to deteriorate the spectrum purity or interfere with adjacent radio channels. Heretofore, to increase the vibration immunity, the voltage controlled oscillator is formed and mounted on a substrate of a ceramic made of a ceramic such as alumina. More specifically, the ceramic substrate is printed with conductive and resistive patterns in thick film and mounted with a chip capacitor, a transistor and a varactor, etc.
Moreover, it is printed in thick film with a resonator which determines the oscillation frequency of the voltage controlled oscillator. An oscillator of this construction may be less expensive and superior in vibration inmunity. However, the quality factor Q of the resonator is decreased because the conductive patterns of the thick film comprise silver-pa radium which has a resistance 10 times greater than that of silver or copper, thereby deteriorating spectrum purity of the oscillator.
Use of a gold evaporated thin film conductive pattern having smaller resistance has been proposed to solve the above problem, but this would make a mobile radio transmitter more costly to manufacture.
Summary of the invention An object of the present invention is, therefore, to provide a voltage controlled oscillator which has a high frequency spectrum purity and high vibration immunity.
In one embodiment a voltage controlled oscillator is obtained by printing the resonator in thick film and then electroplating a metal film over the thick-film printed resonator.
Brief description of drawings The objects and features of the present invention will now be described with reference to the accompanying drawings.
Figure 1 shows a circuit diagram of a voltage controlled oscillator according to the present invention.
Figure 2 is a plan view of the ceramic substrate according to the present invention, on which the voltage controlled oscillator shown in Figure 1 is formed and mounted.
Figures 3A, 3B and 3C are a plan view, a left-side view, and a right-side view of the ceramic substrate, respectively.
Figure 4A is a plan view showing the plated portion of the conductor patterns of Figure 3A.
Figure 4B is a sectional view of Figure 4A along the line X - X'.
Figure 5 is a graph showing the change in the carrier to noise ratio (C/N) with respect to the deviation from the desired oscillation frequency of the voltage controlled oscillator wherein the curve a represents the case where the thick-film printed conductor pattern is not plated; and b in the case where the thick-film printed conductor pattern is plated.
Preferred embodiment of the invention Referring to Figure 1, the voltage controlled oscillator is essentially comprised of an oscillator section, a resonator section and an oscillation frequency control section. The oscillator section comprises a transistor 101, coupling capacitors 22 and 25, a feedback capacitor 23, bypass capacitors 24, 26 and 27, biassing resistors 31 through 33 and a choke coil 13. The resonator section comprises a microstrip line 11 whose length is 1/4 the wavelength of the oscillation frequency in the oscillator section. The oscillation frequency control section comprises a varactor diode 41, a coupling capacitor 21 and a choke coil 12. A terminal 202 is connected to a DC power source. A biassing voltage is supplied to the transistor 101 through the resistors 31 to 33 and the choke coil 13. The oscillator section provides an oscillation signal to a terminal 201.The resonator section stabilizes the oscillation frequency of the oscillator section. The oscillation frequency can be varied by changing the capacitance of the diode 41 by the voltage supplied from a terminal 203. Thus, the oscillation at a constant frequency can be obtained by supplying a constant voltage to the terminal 203. For generating the oscillation at a given frequency, the oscillation frequency control section may be substituted with a capacitor of a fixed capacitance.
Referring now to Figure 2, the voltage controlled oscillator of Figure 1 is formed and mounted on the ceramic substrate 1. Electrical components such as the transistor 101, diode 41, capacitors 21 through 27, choke coils 12, 13 and resistors 31 to 32 are mounted in predetermined arrangement as shown.
Conductive connecting patterns for connecting the electrical components and a pattern for the resonator 11 are printed in a thick film as shown in Figures 3A, 3B and 3C. In Figures 3A and 3B, silver-paradium paste is thick-film printed on the top, sides and bottom surfaces of the ceramic substrate 1 and sintered at a temperature between 7000C and 900 C, to form patterns 2a and 311 a to 324a of approximately 100 microns in thickness. It is noted that the whole bottom surface of the ceramic substrate 1 is printed in thick film to form the grounding pattern 2a.The resonator 11,which is indicated by 311 a in Figures 3A and 3B, is a microstrip line of 1/4 wavelength; one end thereof is connected to the grounding pattern 2a via the pattern printed on the side of the ceramic substrate 1, as shown in Figure 3B. The electrical components 24,26,27,31,32 and 41 shown in Figure 1 are also connected to the grounding pattern 2a via the conductive patterns 320a, 321 a, 323a, 319a, 322a and 312a, and the patterns on the side surfaces, respectively.Among the thick-film printed patterns, those capable of increasing the factor Q of the oscillator, i.e., the pattern 31 1a for the resonator 11, the conductive connecting patterns 312a and 319a to 323a and the grounding pattern 2a, are plated with metal such as copper or silver to form plated layers 311 b, 31 2b, 319b to 323b and 2b 3 of about 2 microns in thickness, as shown in Figures 4A and 4B. Any conventional electroplating may be employed to plate the pattern for the resonator 11, the conductive connecting patterns and the grounding pattern, using the grounding pattern of the ceramic substrate 1 as an electrode. Since one end of the resonator pattern is connected to the grounding pattern, both the grounding pattern and the resonator pattern can be easily plated simultaneously.
The use of the plating can decrease the resistance of the thick-film printed resonator pattern, thereby increasing the factor Q of the reasonator.
It should be noted that the only resonator pattern 31 1a may be metal-plated and the resistors 31 through 33 of Figure 1 can be thick-film printed.
Figure 5 shows the comparison, with respect to the CIN vs. oscillation frequency deviation (Af) characteristics, between the conventional voltage controlled oscillator and the voltage controlled oscillator of the present invention in which the resonator is plated to increase its Q. In Figure 5, the symbol f, represents the oscillation frequency; Af, the frequency deviation from the oscillation frequency; a, C/N vs. Af characteristics of the conventional voltage controlled oscillator; and bC/N vs. Af characteristics of the voltage controlled oscillator according to the present invention. As is evident from the Figure, the voltage controlled oscillator of the present invention is superior in C/N vs. Af characteristics, or in the frequency spectrum purity of the oscillator.
As has been described in the foregoing, a voltage controlled oscillator of an excellent C/N vs. Af characteristics and a high vibration immunity can be obtained by printing the resonator in thick film and then electro plating a metal film over the thick-film printed resonator.

Claims (5)

1. A voltage controlled oscillator comprising an oscillator, a resonator for determining the frequency of oscillation of the oscillator, an oscillation frequency control for changing the frequency of the oscillation and an electrically insulating substrate for mounting the oscillator and the oscillation frequency control thereon, in which the resonator comprises a thick film conductive layer having a length equal to one fourth (1/4) of the wavelength of the oscillation on a surface of said substrate, and a metal layer on a surface of said conductive layer.
2. A voltage controlled oscillator as claimed in claim 1, including a second thin film conductive layer on a rear surface of said substrate, a third thin film conductive layer on the side of said substrate to connect said first and second conductive layers, and second and third metal layers on the surfaces of said second and third conductive layers respectively.
3. A voltage controlled oscillator substantially as described herein with reference to the accompanying drawings.
4. A method of making a voltage controlled oscillator having a resonator for determining the frequency of oscillation of the oscillator, an oscillation frequency control for changing the oscillation frequency and an electrically insulating substrate for mounting the oscillator and the oscillation frequency control thereon, including the steps of printing a thick film conductive layer having a length equal to one fourth (1/4) of the wavelength of the oscillation on a surface of the substrate and plating a metal layer on a surface of the said conductive layer.
5. A method of making a voltage controlled oscillator as claimed in claim 4 substantially as described herein with reference to the accompanying drawings.
GB08307555A 1982-03-19 1983-03-18 Voltage-controlled oscillator mounted on a thick-film printed substrate Withdrawn GB2118392A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57043948A JPS58161504A (en) 1982-03-19 1982-03-19 Voltage control oscillator

Publications (2)

Publication Number Publication Date
GB8307555D0 GB8307555D0 (en) 1983-04-27
GB2118392A true GB2118392A (en) 1983-10-26

Family

ID=12677925

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08307555A Withdrawn GB2118392A (en) 1982-03-19 1983-03-18 Voltage-controlled oscillator mounted on a thick-film printed substrate

Country Status (3)

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JP (1) JPS58161504A (en)
AU (1) AU1257983A (en)
GB (1) GB2118392A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2153598A (en) * 1984-01-26 1985-08-21 British Telecomm Microwave resonator device
WO1993000738A1 (en) * 1991-06-26 1993-01-07 Deutsche Thomson-Brandt Gmbh Arrangement for a modulator
EP1022856A2 (en) * 1999-01-19 2000-07-26 Matsushita Electric Industrial Co., Ltd. Transmitting and receiving apparatus capable of the suppression of the microphonic noise in digital transmission system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1309212A (en) * 1970-03-23 1973-03-07 Rca Corp Tunable resonant circuit

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5013141A (en) * 1973-04-18 1975-02-12
JPS575403A (en) * 1980-06-12 1982-01-12 Mitsubishi Electric Corp Microwave semiconductor oscillator

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1309212A (en) * 1970-03-23 1973-03-07 Rca Corp Tunable resonant circuit

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2153598A (en) * 1984-01-26 1985-08-21 British Telecomm Microwave resonator device
WO1993000738A1 (en) * 1991-06-26 1993-01-07 Deutsche Thomson-Brandt Gmbh Arrangement for a modulator
US5561403A (en) * 1991-06-26 1996-10-01 Deutsche Thomson-Brandt Gmbh Oscillator and modulator arrangements on a circuit board
EP1022856A2 (en) * 1999-01-19 2000-07-26 Matsushita Electric Industrial Co., Ltd. Transmitting and receiving apparatus capable of the suppression of the microphonic noise in digital transmission system
EP1022856A3 (en) * 1999-01-19 2003-04-16 Matsushita Electric Industrial Co., Ltd. Transmitting and receiving apparatus capable of the suppression of the microphonic noise in digital transmission system
US6859502B1 (en) 1999-01-19 2005-02-22 Matsushita Electric Industrial Co., Ltd. Transmitting and receiving apparatus capable of the suppression of the microphonic noise in digital transmission system
US7206371B2 (en) 1999-01-19 2007-04-17 Matsushita Electric Industrial Co., Ltd. Transmitting and receiving apparatus capable of the suppression of the microphonic noise in digital transmission system

Also Published As

Publication number Publication date
GB8307555D0 (en) 1983-04-27
AU1257983A (en) 1983-09-22
JPS58161504A (en) 1983-09-26

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WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)