GB2086167A - Carrier concentration controlled surface acoustic wave resonator - Google Patents
Carrier concentration controlled surface acoustic wave resonator Download PDFInfo
- Publication number
- GB2086167A GB2086167A GB8131579A GB8131579A GB2086167A GB 2086167 A GB2086167 A GB 2086167A GB 8131579 A GB8131579 A GB 8131579A GB 8131579 A GB8131579 A GB 8131579A GB 2086167 A GB2086167 A GB 2086167A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- reflector
- arrays
- resonator
- elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims description 19
- 239000000758 substrate Substances 0.000 claims description 37
- 238000003491 array Methods 0.000 claims description 17
- 239000000969 carrier Substances 0.000 claims description 3
- 241001137251 Corvidae Species 0.000 claims 1
- 235000015108 pies Nutrition 0.000 claims 1
- 239000000463 material Substances 0.000 description 9
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical group [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/0296—Surface acoustic wave [SAW] devices having both acoustic and non-acoustic properties
- H03H9/02976—Surface acoustic wave [SAW] devices having both acoustic and non-acoustic properties with semiconductor devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B2200/00—Indexing scheme relating to details of oscillators covered by H03B
- H03B2200/0002—Types of oscillators
- H03B2200/0012—Pierce oscillator
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
1 GB 2 086 167 A 1 SPECIFICA11ON Carrier concentration controlled surface
65 acoustic wave resonator 20, 400 (910
Technical Field
This invention relates to electrically tunable surface acoustic wave reflector resonators, and more particularly to control of surface acoustic wave resonator frequency by variation of the carrier concentration in piezoelectric and serniconductive substrates of resonator reflector element arrays.
Background Art
Surface acoustic wave (SAW) devices are used as principal frequency control elements in 13 oscillator circuits for a variety of purposes. In some cases, the purpose is simply -to provide a small, competent device capable of being controlled so that its parameters remain essentially constant vijithin a desired to lerance, to provide oscillator frequency control -to a desired degree of accuracy. In other cases, parameters of the SAW device may be altered by a strain or other phenomenon, such as in response -to force, pressure, temperature and the like, -to thereby provide a phenomenon transducer which is compatible with related -frequency-responsive or digital circuitry. In some cases, it is desirable to provide voltage tuning of the SAW resonator in order to change -a mode, to provide temperature stability, or for trimming purposes. A voltage tunable surface acoustic wave reflective resonator is described in Cross, P.S. et al, Electronically Variable Surface-Acoustie-Wave Velocity and Tunable SAW Resonators, Applied Physics Letters, Vol. 28, No. 1, January 1976, SE pp 1-3. The device described therein has a plurality of reflector elements disposed in arrays on either side of a tu nable SAW delay line which has input and GdtpU'Lacoustoelectric transducers spanning an interaction region that includes a tuning transducer. The substrate of that device is lithium niobate,vihich has -a relatively high electromechanical coupling constant, yielding a -theoretical maximum tuning range of 4.5036. Hov,jever, the achievable tuning range is limited by Z1J,3 the ratio of the langth Of the tUnh-10 trai'lSducer along the direction of wave propagation to the 911ective propagation length within elements of the reflector arrays. Thus, achievable tuning ranges are on the order of 1.4%.
The problem with the voltage tunable, lithium niobate SAW resonator is that it is impossible to 115 provide such a resonator in an oscillator configuration integrally formed therewith in a monolithic fashion because the lithium niobate 3 5 does not have senniconductive properdes.
L Provision of voltage tunable devices capable of implementation on serniconductive substrates is disclosed in rny commonly owned, copending U.S. patent application Serial No. 11,612, filed on February 12, 1979 and entitled CARRIER COkICENTRAT ION CO_HT ROLLED SURFACE ACOU STiC WA VE 'JiARIA, BLE D ELAY DE"A CES, novij U.S. Patent No.. In said patent, the entirety of which is incorporated herein by reference, a voltage tunable delay line includes a segmented rectifying contact on a SAW delay line which may either be disposed on a substrate of serniconductive and piezoelectric material, or on a nonpiezoelectric semiconductive material having a piezoelectric surface layer!hereon. Application of voltage to the segmented electrode to enhance carrier concentration in a semiconducting semiconductive material or to deplete carrier concentration in a semi-insulating serniconductive material alters the acoustic velocity and thus -the frequency of the device. As described in said patent, such device may be used as the tuning element disposed between the reflectors of a resonator of the type disclosed in Cross at al, supra. However, because of the much lower electrornechanical coupling constant of a semicondUGtive piezoelectric material, or of' a thin piezoelectric layer, the tuning range of such devices may be limited to a traction of a percent. And, with the further limitation pointed out by Cross et al, supra, -that the overall tuning range is limited by the fraction of cavity length that tuning element occupies, a SAW resonator employing voltage tuning o, said pa-Lent nialy be 'ional cavity length, further limited by that iraCl which may not be adequate in many applications. Furthermore, the larger the spacing between the input and output transducers, -the more anodes which may be supported within the tunable resonator. Therefore, -to reduce the number of rnodes which are supportable, the physical extent of the tuning elernent betvieen the input and output transducers should be as small as possible.
Disclosure of Invention
Objects of the invention include provision of a carrier concentration controlled SAW resonator with improved tuning range, capable of integration with semiconductor circuits.
According to the present invention, an electrically controlled surface acoustic wave reflector resonator includes a piezoelectric and serniconcluctive substrate having two sets of segmented rectifying contacts disposed on opposite sides of a transducer region, each segmented contact serving as a reflector array, and a variable voltage applied to each segmented contact to control carrier concentration within the substrate, thereby To control the velocity of the SAVY wave beneath the reflector elements, and therefore the resonant frequency of the resonator. According further to the present invention,ihe -transducer region may comprise a pair of transducers vihich are acoustically coupled to each oiherfOr use as a series tuning element at which the frequency of lojvesi insertion loss is the tuning phenornenon, or having a single transducer coupled directly to the elements of an oscillator (such as in the -traditional Pierce, Colpitts or Clapp configurations), such that the oscillation is at a 12,163 frequency of correct phase of feedback provided through the single transducer disposed between the reflector elements of the resonator.
2 GB 2 086 167 A 2 The invention may take a variety of forms as described in the aforementioned patent, and is readily implemented utilizing known microcircuit processing techniques, in the light of the teachings which follow herein. Other objects, features and advantages of the present invention will become more apparent in the light of the following detailed description of exemplary embodiments thereof, as illustrated in the accompanying drawings.
Brief Description of Drawings
Fig. 1 is a simplified schematic diagram of a tunable resonator known to the prior art;
Fig. 2 is a simplified diagram of a tunable resonator in accordance with the present invention having acoustically coupled input and output ports; Fig. 3 is a simplified schematic diagram of a tunable resonator in accordance with the invention having but a single transducer; Fig. 4 is a partial plan view of tunable reflector 85 elements in accordance with the present invention; and Fig. 5 is a partial, sectioned side elevation view of the portion disclosed in Fig. 4.
Best Mode for Carrying Out the Invention
Referring now to Fig. 1, a tunable resonator of the general type described by Cross et al, as modified to use carrier concentration control of the type described in my aforementioned patent, includes a substrate 40 having two arrays of reflector elements 6, 7 disposed thereon on opposite sides of an interaction region which includes input and output interdigital transducers 44, 42 and a segmented rectifying contact 35, the 100 fingers of the contact being tilted slightly, if desired, to reduce reflections. A tuning voltage is applied by a variable tuning voltage source 37 and a nearby, ohmic ground contact 55. The input transducer 44 is connected to the output of an amplifier 62 and the output transducer 42 is connected to the input of the amplifier 62.
Therefore, the amplifier 62 is provided with a resonant, acoustic feedback path between the transducers 44, 42 which includes the tuning region between these transducers, in that portion of the substrate subsisting the segmented contact 35. As described in my aforementioned patent, variation of the voltage beneath the contact 35 will vary the carrier concentration in the region between the transducers 44, 42, thereby adjusting the acoustic velocity in a different manner, but for the same purpose as described in Cross et al. The semiconductive piezoelectric substrate 40 may either comprise a material which is both 120 serniconductive and piezoelectric such as gallium arsenide, or it may comprise a nonserniconductive piezoelectric film (such as zinc oxide) on a serniconductive substrate (such as silicon).
Depending upon the substrate, the variable tuning 125 voltage of the source 37 may be selected so as to control depletion of carriers or enhancement of carrier concentration in the serniconductive material of the substrate 40, so as to selectively control the semiconducting/semi-insulating properties thereof, thereby controlling the velocity of the acoustic wave and thus the frequency of the oscillator lormed by the amplifer 62 with its acoustoelectric feedback. As is known, the output may be taken at output terminals 76.
The reflector elements 6, 7 may comprise deposited aluminum, each element having a length (in the propagation direction) of a quarter wavelength, each element being spaced onequarter wavelength from the next. Because the depletion depth of interest is on the order of a wavelength, the fingers of the segmented contact 35 may be separated by on the order of a wavelength or so, to ensure continuity of enhancement or depletion in the successive regions associated with each segment, but may be other than an odd number of wavelengths apart so as to avoid presenting apparent short circuits which could tend to reduce the difference between the potential in a substrate with the substrate nonconducting and the potential in a substrate with the substrate conducting. Although shown directly on the substrate 40, the tuning voltage source 37 may more commonly be formed separately; on the other hand, the invention, employing a serniconductive substrate, is readily adapted for monolithic integration livith an amplifier 62, directly on the substrate 40, as shown in Fig. 1 and as further described in my aforementioned patent.
As described brielly hereinbefore, the problem vjith the configuration of Fig. i is Lha'L there musi be a significant leingth of the Luning Fegion beneath 'the contact 35 along the direction of acoustic vjave propagation in ordsr Lo have a significant tuning capability. And, thiSiS partliculady Lrue vvhere the p@rdCVflar Pi-,ZGeIeG-_Lric semiconducting substrate 40 has a i-elatively lovi electromechanical coupling constant, such as gallium arsenide. This causes the transducers 42, 44 to be separated to such an extent that a large number of modes may be sustainable. These modes may include, typically, spurious sidelobes, or other closely spaced cavity modes.
Referring now to Fig. 2, a piezoelectric serniconductive subSLrate, which may take any of the forms described in my aforementioned patent, has a plurality of reflector elements 10, 11, formed thereon, which elements comprise rectifying junctions, such as Schottky barriers formed by depositing aluminum on the substrate 9. Associated with each of the reflector arrays 10, 11 is an ohmic ground contact 12, 13 to permit impressing a voltage, from a variable tuning voltage source 15, between the reflector elements 10, 11 and the ground contacts 12, 13, thereby to control the carrier concentration in a semiconducting or semi-insulating region ol the substrate 9. An input interdigital transducers 16 and an output interdigital transducer 17 provide acoustically coupled feedbacP to an amplifier 13, so as to form an oscillator, the output of %uhich may be taken at output terminals 19. The W GB 2 086 167 A 3 transducers may be formed in various ways as set forth in my aforementioned patent. According to the invention, the segments 10, 11 are not tilted, but rather are perfectly normal to the direction of wave propagation, thereby to provide reflective arrays on either side of the transducer region which includes the input and output transducers 16, 17. The design of the reflector elements 10, 11 and of the transducers 16, 17 may be in accordance with teachings well known in the art for surface acoustic wave reflective resonators.
The difference in accordance with the invention is that tuning is achieved by adjusting the velocity throughout the acoustic region of the reflective arrays 10, 11 by carrier control concentration of the type described in my aforementioned patent.
This permits having the transducers 16, 17 located immediately adjacent one another, as close as a quarter of a wavelength from each other, if desired. In the invention, the dimensions 85 and spacing of the reflector elements in each of the arrays 10, 11 are chosen for suitable matching with the substrate for the desired design frequency, in contrast with the segmented electrode 35 of my copending patent, in which the 90 segmented electrode is designed to provide minimal surface shorting while at the same time providing sufficient carrier concentration control.
And, the arrays 10, 11. may be disposed immediately adjacent the transducers 16, 17 in accordance with the well known design criteria, so that a substantial portion of the length of the cavity -formed by the resonators is tunable by carrier concentration control. This provides rnaximurn tuning, even though the preferred 100 ser-niconductive piezoelectric substrate which permits iWegrated circuit fabrication is utilized, which has a lower inherent tuning range capability than other materials such as lithium niobate.
In Fig. 2, the oscillator formed by the amplifier 105 18 and the transducer 16, 17 has its frequency controlled by an acoustic wave having a corresponding velocity at which there is minimum insertion loss in the acoustic coupling between the transducers 16, 17 in the feedback path of the 110 oscillator. The embodiment of Fig. 3 is identical to that of Fig. 2 except that a single acoustoelectric intercligital transducer 20 is utilized to couple the resonator to an oscillator circuit 2 1, the resonator 20 being connected between any of the elements of the active device of the oscillator 21 (such as base to collector, collector to emitter, emitter to base, of a bipolar transistor) so as to form a Colpitts, Pierce or Clapp type of oscillator in a fashion which is well known in the art. In this case, the resonator has an acoustic wave launched therein at the frequency of oscillation of the oscillator 2 1, which quickly stabilizes at a frequency which has a correct phase in dependence upon the construction and tuning of the resonator.
not materially affect the operating characteristics of a properly designed and built resonator, only a minor reduction in the resonant quality factor (Q) resulting therefrom. Also, it is immaterial whether the ohmic ground contacts 12, 13 are provided on the same side of the arrays 10, 11 as the connection of the reflector elements in each array (as in Fig. 2) or if the ohmic contacts 12, 13 are provided on the unconnected sides of the reflector elements (as in Fig. 3). On the other hand, the ohmic contacts 12, 13 may be made to the underside of the substrate if the substrate is semiconducting throughout. For instance, if a conducting n-plus-type GaAs substrate with an n- type epitaxial layer is used, the ohmic contact may preferably be made to the underside surface of the n-plus-type material. Other contact locations and methods may be used in various embodiments.
Referring briefly to Fig. 4, the details of a portion of the array 11 and ground contact 13 are shown. And in Fig. 5 a typical illustration of operation, similar to that disclosed in Fig. 6 of the aforementioned patent, is given for the case of an n-type gallium arsenide epitaxial substrate in which the tuning voltage applied to the elements of the reflector array 11 causes depletion of carriers, shown by the dotted line, in dependence on the magnitude of the voltage.
The present invention permits voltage tuning of a SAW reflective resonator lormed on a semiconcluctive substrate, and thus compatible with the formation of integrated circuits directly on the same substrate therewith. The invention may be practiced in all of the variety of forms described in my aforementioned patent, insofar as formation of the reflector elements and the types ol substrates are involved, as vveli as the depletion and enhancement modes described therein. However, the rectifying contacts in all cases in -the present invention are preferably formed by deposition of aluminum, or other suitable metal, in reflector arrays 10, 11 as described hereinbefore.
Although the invention has been shown and described with respect to exemplary embodiments thereof, it should be understood by those skilled in the art that the foregoing and various other changes, omissions and additions in the form and detail thereof may be made therein and thereto, without departing from the spirit and the scope of the invention.
Claims (3)
1. An improved carrier concentration controlled, surface acoustic wave, variable reflector resonator comprising:
a piezoelectric and serniconductive substrate; a pair of arrays of reflector elements disposed on opposite sides of a transducer region on a surface of said substrate; and In the embodimentsof Figs. 2 and 3,itisto be 125 an acoustoelectric transducer disposed on said noted that the reflector elements are connected surface of said substrate between said reflector together so as to permit application of the tuning arrays; characterized by:
voltage thereto. It has been found that this does the reflector elements in each of said arrays 4 GB 2 086 167 A 4 being connected together and forming a segmented rectifying contact with said substrate; an ohmic connection to said substrate formed near each of the reflective elements of each of said arrays; and means for impressing variable voltage between said reflector arrays and said ohmic contacts for altering the concentration of carriers beneath and between said reflector elements, whereby variations in said voltage alter the potential and velocity of the surface acoustic wave at the surface of said substrate, thereby to control the resonant frequency of said resonator.
2. A resonator according to claim I furLher characterized by said acoustoelectric transducer being connected between a pair of elements of an Oscillator to provide phase conLrol tuning thereof.
-
3. A resonator according to claim I including a second acoustoelectric transducer disposed in said transducer region between said first named transducer and one of said reflector arrays, said transducers being respectively connei--wJ to the input and the output of an amplifier so as to iOrm an oscillator circuit.
Printed for Her Majesty's Stationery Office by the Courier Piess, Learnington Spa. 1982. Published by the Pattent OfIEC1-, 25 Southampton Buildings, London. WC2A lAY. from which copies may be obtained.
1 R i
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/199,871 US4354166A (en) | 1980-10-23 | 1980-10-23 | Carrier concentration controlled surface acoustic wave resonator and oscillator |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2086167A true GB2086167A (en) | 1982-05-06 |
GB2086167B GB2086167B (en) | 1984-09-26 |
Family
ID=22739359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8131579A Expired GB2086167B (en) | 1980-10-23 | 1981-10-20 | Carrier concentration controlled surface acoustic wave resonator |
Country Status (4)
Country | Link |
---|---|
US (1) | US4354166A (en) |
JP (1) | JPS5799814A (en) |
FR (1) | FR2493070A1 (en) |
GB (1) | GB2086167B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0189123A2 (en) * | 1985-01-18 | 1986-07-30 | Siemens Aktiengesellschaft | Acoustic-wave filter |
FR2603423A1 (en) * | 1986-09-02 | 1988-03-04 | Clarion Co Ltd | SURFACE ACOUSTIC WAVE CONVERTER |
DE3730107A1 (en) * | 1987-09-08 | 1989-03-16 | Siemens Ag | OSCILLATOR CIRCUIT WITH SURFACE WAVE FILTER |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2503960A1 (en) * | 1981-04-08 | 1982-10-15 | Thomson Csf | INVASIVE ELASTIC WAVE PROCESSING SYSTEM WITH TEMPERATURE |
US4633285A (en) * | 1982-08-10 | 1986-12-30 | University Of Illinois | Acoustic charge transport device and method |
JPS6084005A (en) * | 1984-09-14 | 1985-05-13 | Toshiba Corp | Surface acoustic wave resonator |
US4636678A (en) * | 1985-03-01 | 1987-01-13 | The United States Of America As Represented By The Secretary Of The Army | Compensation of acoustic wave devices |
US4794622A (en) * | 1985-06-03 | 1988-12-27 | Linear Corporation | Low power transmitter frequency stabilization |
US4767198A (en) * | 1987-06-24 | 1988-08-30 | Unisys Corporation | SAW/BAW Bragg cell |
US4760352A (en) * | 1987-09-04 | 1988-07-26 | R.F. Monolithics | Coupled resonator phase shift oscillator |
US4926146A (en) * | 1988-05-09 | 1990-05-15 | Trw Inc. | Parallel-to-serial signal processor using surface acoustic waves |
US5128734A (en) * | 1990-10-02 | 1992-07-07 | United Technologies Corporation | Surface channel hact |
US5166646A (en) * | 1992-02-07 | 1992-11-24 | Motorola, Inc. | Integrated tunable resonators for use in oscillators and filters |
US6003370A (en) * | 1996-05-30 | 1999-12-21 | Minolta Co., Ltd. | Elastic surface wave gyroscope |
US6741944B1 (en) * | 1999-07-20 | 2004-05-25 | Tokyo Electron Limited | Electron density measurement and plasma process control system using a microwave oscillator locked to an open resonator containing the plasma |
US6646386B1 (en) * | 1999-07-20 | 2003-11-11 | Tokyo Electron Limited | Stabilized oscillator circuit for plasma density measurement |
US6861844B1 (en) | 1999-07-21 | 2005-03-01 | Tokyo Electron Limited | Electron density measurement and plasma process control system using changes in the resonant frequency of an open resonator containing the plasma |
JP4546652B2 (en) * | 2001-02-05 | 2010-09-15 | 正樹 小林 | Surface acoustic wave filter |
US8143681B2 (en) * | 2006-04-20 | 2012-03-27 | The George Washington University | Saw devices, processes for making them, and methods of use |
US20100007444A1 (en) * | 2006-04-20 | 2010-01-14 | Anis Nurashikin Nordin | GHz Surface Acoustic Resonators in RF-CMOS |
US7687971B2 (en) * | 2006-08-15 | 2010-03-30 | Northrop Grumman Corporation | Electric field control of surface acoustic wave velocity |
US7656253B2 (en) | 2007-04-18 | 2010-02-02 | Northrop Grumman Space & Mission Systems Corporation | Surface acoustic wave passband control |
US20090124513A1 (en) * | 2007-04-20 | 2009-05-14 | Patricia Berg | Multiplex Biosensor |
DE102008023517B4 (en) | 2008-05-15 | 2018-04-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Field effect transistor with piezoelectric charge generator |
US7821360B2 (en) * | 2008-08-28 | 2010-10-26 | Northrop Grumman Systems Corporation | Multi-channel surface acoustic wave filter device with voltage controlled tunable frequency response |
US8960004B2 (en) | 2010-09-29 | 2015-02-24 | The George Washington University | Synchronous one-pole surface acoustic wave resonator |
US11652463B2 (en) | 2018-06-14 | 2023-05-16 | International Business Machines Corporation | Electrically tunable surface acoustic wave resonator |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4166258A (en) * | 1974-08-29 | 1979-08-28 | International Business Machines Corporation | Thin-film integrated circuit with tank circuit characteristics and applications to thin-film filters and oscillators |
JPS5544245A (en) * | 1978-09-22 | 1980-03-28 | Clarion Co Ltd | Frequency selection unit |
US4233573A (en) * | 1979-02-12 | 1980-11-11 | United Technologies Corporation | Carrier concentration controlled surface acoustic wave variable delay devices |
US4249146A (en) * | 1979-02-23 | 1981-02-03 | Trw Inc. | Surface acoustic wave resonators utilizing harmonic frequencies |
FR2452714A1 (en) * | 1979-03-30 | 1980-10-24 | Thomson Csf | ELASTIC WAVE ACCELEROMETER |
-
1980
- 1980-10-23 US US06/199,871 patent/US4354166A/en not_active Expired - Lifetime
-
1981
- 1981-10-20 GB GB8131579A patent/GB2086167B/en not_active Expired
- 1981-10-23 JP JP56170641A patent/JPS5799814A/en active Granted
- 1981-10-23 FR FR8119897A patent/FR2493070A1/en active Granted
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0189123A2 (en) * | 1985-01-18 | 1986-07-30 | Siemens Aktiengesellschaft | Acoustic-wave filter |
EP0189123A3 (en) * | 1985-01-18 | 1988-09-07 | Siemens Aktiengesellschaft Berlin Und Munchen | Acoustic-wave filter |
FR2603423A1 (en) * | 1986-09-02 | 1988-03-04 | Clarion Co Ltd | SURFACE ACOUSTIC WAVE CONVERTER |
DE3730107A1 (en) * | 1987-09-08 | 1989-03-16 | Siemens Ag | OSCILLATOR CIRCUIT WITH SURFACE WAVE FILTER |
Also Published As
Publication number | Publication date |
---|---|
US4354166A (en) | 1982-10-12 |
JPH0245367B2 (en) | 1990-10-09 |
FR2493070A1 (en) | 1982-04-30 |
JPS5799814A (en) | 1982-06-21 |
FR2493070B1 (en) | 1984-11-09 |
GB2086167B (en) | 1984-09-26 |
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Legal Events
Date | Code | Title | Description |
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PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19921020 |