GB2047476A - Improvement in or relating to applying circuit elements to a substrate - Google Patents
Improvement in or relating to applying circuit elements to a substrate Download PDFInfo
- Publication number
- GB2047476A GB2047476A GB8006068A GB8006068A GB2047476A GB 2047476 A GB2047476 A GB 2047476A GB 8006068 A GB8006068 A GB 8006068A GB 8006068 A GB8006068 A GB 8006068A GB 2047476 A GB2047476 A GB 2047476A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- circuit element
- circuit
- carrier substrate
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 109
- 238000000034 method Methods 0.000 claims abstract description 50
- 239000010408 film Substances 0.000 claims abstract description 20
- 239000010409 thin film Substances 0.000 claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 238000004377 microelectronic Methods 0.000 claims abstract description 13
- 238000003780 insertion Methods 0.000 claims abstract 2
- 230000037431 insertion Effects 0.000 claims abstract 2
- 238000007736 thin film deposition technique Methods 0.000 claims abstract 2
- 239000000463 material Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 239000004830 Super Glue Substances 0.000 claims description 3
- FGBJXOREULPLGL-UHFFFAOYSA-N ethyl cyanoacrylate Chemical compound CCOC(=O)C(=C)C#N FGBJXOREULPLGL-UHFFFAOYSA-N 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 229930195733 hydrocarbon Natural products 0.000 claims description 2
- 150000002430 hydrocarbons Chemical class 0.000 claims description 2
- 238000001465 metallisation Methods 0.000 claims description 2
- 239000004798 oriented polystyrene Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229920002223 polystyrene Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052729 chemical element Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000003415 peat Substances 0.000 description 1
- 229940104181 polyflex Drugs 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229960002415 trichloroethylene Drugs 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
In a method of applying micro- electronic circuit elements, such as a high definition thin-film microwave filter 5 to a lower definition thick film or printed circuit board substrate 2, the filter is formed on the surface of a transparent, flexible carrier substrate 6 using thin film deposition techniques, and the circuit element is then adhesive bonded face down on the surface of the permanent substrate 2. The thin film circuit element 5 is formed with contact areas which overlap cooperating portions of the thick film circuit 4 e.g. a stripline, on insertion of the circuit element to provide electrical connections. The carrier substrate may then be removed, eg by dissolving, and the overlapping contact areas may be permanently bonded together. <IMAGE>
Description
SPECIFICATION
Improvements in or relating to methods of applying circuit elements to a substrate
This invention relates to methods of applying circuit elements to a substrate.
The invention is particularly, though not exclusively concerned with microwave microelectronic circuits or microwave integrated circuits (MICs) of the kind in which a number of active and/or passive circuit elements and their interconnecting patterns are formed on a single substrate, usually of a material having a relatively high dielectric constant, such as high alumina ceramics material whose dielectric constant is about 10. Other typical substrates include sapphire, beryllia and ferrite.
MlCs of this kind are generally fabricated by either thin film technology or thick film technology. Thin film technology generally involves the deposition in a vacuum, of thin films of conductive, resistive or insulating materials by sputtering, evaporation or chemical vapour deposition. Thick film technology on the other hand involves the deposition of pastes, or "inks", usually by a silk screen process followed by firing at high temperature. Where different types of pastes are used, eg to give resistors, conductors or insulating layers, more than one cycle of screen printing and firing is usually required. Further definition of the screen-printed pattern can be effected by etching back after firing.
Thick film technology has the advantage of being relatively inexpensive, particularly in quantity production, but the screen printing process used for printing the thick film patterns has inherent limitations on the precision with which patterns can be defined. Conductor line widths can only be produced to an accuracy of approximately 20 jum at best, and the line edges may be somewhat irregular unless etching or laser trimming is used.
Minimum line widths and line spacing are generally both limited to approximately 40 jum.
Thus, distributed circuit elements that require precise complex geometries and high definition, such as filters and couplers cannot be obtained using thick film techniques. As a result where such elements are required, the
MIC has generally had to be fabricated using the more expensive, labour-intensive thin film technology, as this technique enables the desired definition to be achieved.
According to the present invention, a method of applying a circuit element to a substrate comprises forming the circuit element on the face of a carrier substrate, placing the carrier substrate face down onto the surface of a second substrate and attaching the circuit element to the second substrate.
Preferably the circuit element is formed by thin film fabrication techniques, and may comprise a metallisation pattern defining a distributed microwave circuit element such as a filter.
The second or main substrate may comprise a a thick film substrate, a thin film substrate or a printed circuit board. Thus, it will be seen, the invention enables individual high definition circuit elements formed by thin film circuit techniques to be inserted in a partially completed circuit otherwise fabricated using lower definition techniques, such as thick film, lower definition thin film, or printed circuit board techniques.
The circuit element may be attached to the second or main substrate using an adhesive, excess adhesive preferably being exuded before setting by applying pressure between the two substrates.
Preferably the carrier substrate is removed after attachment of the circuit element to the second substrate, for example, by dissolving, etching or peeling, following which an required electrical connections between the circuit element and other circuitry carried on the second substrate may be made.
In this regard the circuit element may be attached in a position adjacent an existing conductor pattern on the second substrate, and electrical connection made therebetween by tape or wire bonding, or soldering. Alternatively, the circuit element may be formed with one or more contact areas which, when located on the second substrate, overlap contact areas provided in the second substrate. Following removal of the carrier substrate, the overlapping contact areas may be electrically connected eg by ultrasonic bonding or conductive adhesive.
To facilitate location of the circuit element on the second substrate, the carrier substrate is preferably transparent, and may also be flexible to facilitate removal of excess adhesive, where adhesive is used to attach the circuit element to the second substrate. In some applications the second substrate itself may be transparent
In a preferred embodiment, the carrier substrate is a biaxially orientated polystyrene material, being transparent and readily available in flexible sheet form. A cyanoacrylate adhesive may then be used as the attachment adhesive and the carrier substrate subsequently removed using a suitable hydrocarbon solvent.
The invention also extends to circuit substrates incorporating one or more circuit elements applied thereto by a method as aforesaid.
The invention will now be described, by way of example only, with reference to the accompanying drawings, of which:
Figures (la) to 1(c) show diagrammatic sectional views of various stages in a method in accordance with the present invention of transferring a pre-formed thin film circuit ele
ment on to a thick film circuit substrate; and
Figure 2 shows a diagrammatic plan view
of the thin film circuit element located on the
thick film circuit substrate.
Referring to the drawings, Fig. 1 shows
part of a thick film microwave integrated
circuit (MIC) 1 comprising a substrate 2 of
high dielectric constant material, such as alu
mina, formed in known manner with a ground
plane conductor 3 on one surface and on its
other surface with a thick film microwave
circuit pattern including a strip transmission
line (microstrip line) 4. The microstrip line 4 is
formed with a gap dfor receiving a pre
formed high definition distributed microwave
circuit element 5.
The circuit element 5, in this example a
parallel gap filter (see Fig. 2) is formed using
standard thin film techniques, on a carrier
substrate 6 (Fig. 1(a)) comprising a 250#m thick flexible sheet of clear biaxially orientated
polystyrene material, such as that sold under the Registered Trade Mark "POLYFLEX". A
number of identical such metallised circuit
elements may be deposited on a common
piece of carrier substrate using step and re
peat processes, and the carrier substrate then
cut up into individual "chip" form.
The circuit element 5 is then attached to
the thick film substrate 2 by placing the
carrier substrate 6 onto the thick film circuit
substrate 2 in a suitably aligned position
across the gap din the transmission line 4,
such that contact areas 8 (Fig. 2) of the circuit
element 5 overlap the ends of the transmis
sion line 4, a layer 9 of a suitable adhesive
being applied between the substrate 2 and
the parts of the circuit element 5 which do
not overlap the transmission line 4. (Fig.
1(b)). The alignment -of the circuit element 5
is facilitated by the transparency of the carrier
substrate material. Excess adhesive between
the contact element 5 and the substrate 2 is
exuded by squeezing the flexible carrier sub
strate 6 against the thick film substrate 2
using, for example, a resilient roller whose
width is slightly smaller than the width of the
gap d. The adhesive is then set and the carrier
substrate 6 removed by dissolving it in a
suitable solvent which does not attack the
adhesive. (Fig. 1 (c)). Suitable trichloroethy
lene may be used as the solvent, with a
cyano-acrylate adhesive which appears to
combine good microwave properties with a
resistance to attack by the solvent.
With the carrier substrate removed, the
unattached contact areas 8 of the circuit ele
ment 5 which now loosely overlap the ends of the transmission line 4, may then be permamently connected to the transmission line using any suitable electrical bonding technique such as ultrasonic bonding. However, this is not essential. In the example of Fig. 2 which shows a dc blocking filter, no electrical bonding is necessary as the overlap areas provide sufficient, probably capacitive, coupling to the filter at operating frequencies.
In an alternative method the entire circuit element 5 may be attached to the thick film substrate 2 without any overlap with the transmission line, and with contact areas positioned adjacent the ends of the transmission line 4 so that they can be electrically connected by conventional wire or tape bonding techniques.
Because the carrier substrate is removed, standard microstrip design data can be used for design purposes because there is minimal disturbance of the microstrip environment.
The invention thus enables precision circuit elements having the high definition achievable with thin film fabrication techniques to be incorporated in circuits made by methods which do not achieve the same precision, such as thick film circuits, low definition thin film circuits and copper laminate type printed circuit boards such as Polyguide (Registered
Trade Mark) for microwave applications. Such precision circuit elements may be produced on individual carrier substrates, ie in "chip" form, and used in similar manner to known chip devices. Thus different complex circuit functions can be made available for incorporation on a common circuit substrate design to obtain different operating characteristics.
In some applications the carrier substrate need not be removed. On such application of the invention in which it may even be desirable to retain the carrier substrate is in stub tuning of MICs. A present only destructive one way" trimming of fixed position stubs is possible. However, by forming a suitably dimensioned open circuit stub line on a carrier substrate, eg a sheet of biaxially oriented polystyrene as before, this substrate can then be positioned face down onto the appropriate part of a transmission line and adjusted in position to obtain the desired characteristic.
Metal-to-metal contact between the transmission line and the stub formed on the carrier substrate is normally satisfactory for test purposes during adjustment, which can be effected to vary the length of the stub and its position along the transmission line. Once the correct positional and lengthwise adjustments have been obtained, adhesive is applied to the non overlapping region of the stub line and the stub line attached to the transmission line substrate in the desired position. Permanent electrical connection between the overlapping regions of the stub line and transmission line may then be effected using a conductive adhesive.
Thus problems of de-tuning as a result of removal of the carrier substrate are avoided.
To facilitate handling of the carrier substrate during adjustment, it may be temporarily attached to a low dielectric constant "probe", for example of foam polystyrene, which is removed after attachment of the stub to the transmission line circuit.
Although in the described embodiment the carrier substrate is of transparent flexible sheet material, removed by dissolving in a suitable solvent, the invention is not limited to carrier substrates of this type. Although the use of a transparent carrier substrate is advantageous for alignment purposes, it is not essential and non-transparent substrates may be used. Similarly, the use of a flexible carrier substrate is useful, particularly where areas of the circuit element formed thereon are required to overlap metallised areas on the receiving substrate, the use of flexible carrier substrates is not essential.
Furthermore, it is envisaged that other methods of removing the carrier substrate may be used. For example, the carrier substrate may be removed by etching or it may simply be peeled off depending on the form of carrier substrate and the materials used.
Similarly other forms of adhesive may be used to attach the circuit element to the second substrate.
While the invention is primarily applicable to microwave integrated circuits, for the purpose of enabling individual high definition distributed microwave components such as filters and couplers to be incorporated in less costly, lower definition circuits, it may also be applied, where appropriate to other forms of hybrid microelectronic circuitry. For example, a thin-film resistor may be appropriately placed on a printed circuit board, the carrier remaining in-situ to provide an environmental protective barrier while electrical contact may be effected using a conductive adhesive such as conductive epoxy.
Claims (25)
1. A method of applying a planar microelectronic circuit element to a substrate comprising, forming the the circuit element on the face of a first carrier substrate, placing the carrier substrate face down onto the surface of a second substrate and attaching the circuit element to the second substrate.
2. A method as claimed in Claim 1, wherein the circuit element is a thin-film microelectronic circuit element formed on the face of the carrier substrate using thin-film deposition techniques.
3. A method as claimed in Claim 2, wherein the circuit element comprises a metal- lisation pattern defining a distributed microwave circuit element.
4. A method as claimed in Claim 3, wherein the circuit element is a microwave filter.
5. A method as claimed in any one of
Claims 1 to 4, wherein the carrier substrate is removed following attachment of the circuit element to the second substrate.
6. A method as claimed in Claim 5, wherein the carrier substrate is removed by dissolving or etching.
7. A method as claimed in any preceding
Claim, wherein the circuit element is attached to the surface of the second substrate by means of an adhesive.
8. A method as claimed in Claim 7, wherein excess adhesive is exuded before setting by applying pressure between the two substrates.
9. A method as claimed in any preceding
Claim wherein the carrier substrate is transparent.
10. A method as claimed in any preceding
Claim, wherein the carrier substrate is flexible.
11. A method as claimed in any preceding
Claim, wherein the carrier substrate is of biaxially oriented polystyrene sheet material.
12. A method as claimed in Claim 11, wherein the circuit element is attached to the surface of the second substrate using a cyanoacrylate adhesive.
13. A method as claimed in Claim 11 or
Claim 12, wherein, following attachment of the circuit element to the surface of the second substrate, the polystrene carrier substrate is removed using a hydrocarbon solvent.
14. A method as claimed in any preceding
Claim, wherein the surface of the second substrate to which the circuit element is attached carries a conductive planar micro-circuit pattern and an electrical connection is provided between the circuit element and the conductive pattern.
15. A method as claimed in Claim 14, wherein the second substrate comprises a thick film microelectronic circuit substrate on which the conductive circuit pattern is formed by thick film fabrication techniques.
16. A method as claimed in Claim 14, wherin the second substrate comprises a micro-electronic printed circuit board on which the conductive circuit pattern is formed by printed circuit board fabrication techniques.
17. A method as claimed in Claim 14, wherein the second substrate comprises a thin film microelectronic circuit substrate on which the conductive circuit pattern is formed by thin film fabrication techniques.
18. A method as claimed in any one of
Claims 14 to 17, wherein the circuit element is attached to the surface of the second substrate in a position adjacent the conductive circuit pattern, and following removal of the carrier substrate, permanent electrical connection is provided between the circuit element and the conductive pattern by means of one or more bridging electrical connections.
19. A method as claimed in Claim 18, wherein the or each bridging electrical connection is formed by tape or wire bonding, or soldering.
20. A method as claimed in any one of
Claims 14 to 17, wherein the circuit element is formed on the face of the carrier substrate with one or more metallised contact areas which, when the circuit element is located on the second substrate, overlap respective contact areas provided by the conductive circuit pattern on the surface of the second substrate.
21. A method as claimed in Claim 20, wherein following attachment of the circuit element to the surface of the second substrate, the carrier substrate is removed, and the overlapping contact areas of the circuit element and conductive circuit pattern are permanently electrically connected.
22. A method as claimed in Claim 20, wherein the circuit element is a radio frequency element, and wherein, following attachment of the circuit element to the surface of the second substrate, no permanent electrical connection is provided between the loosely overlapping areas of the circuit element and the conductive circuit pattern, the engagement between these overlapping areas providing sufficient radio frequency coupling between the circuit and the circuit element,
23. A method of applying a planar microelectronic circuit element to a substrate substantially as shown in, and as herein before described with reference to, the accompanying drawings.
24. A carrier substrate formed on its face with a planar microelectronic circuit element in combination with a second substrate carrying on its surface a planar conductive microelectronic circuit pattern, the circuit element and or the circuit pattern being adapted for insertion of the circuit element on the carrier substrate into the circuit pattern on the carrier substrate by a method as claimed in any preceding Claim.
25. A microelectronic circuit including one or more microelectronic circuit elements attached to the surface of a substrate by a method as claimed in any one of Claims 1 to 23.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8006068A GB2047476B (en) | 1979-02-26 | 1980-02-22 | Applying circuit elements to a substrate |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB7906701 | 1979-02-26 | ||
| GB8006068A GB2047476B (en) | 1979-02-26 | 1980-02-22 | Applying circuit elements to a substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2047476A true GB2047476A (en) | 1980-11-26 |
| GB2047476B GB2047476B (en) | 1983-06-15 |
Family
ID=26270701
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8006068A Expired GB2047476B (en) | 1979-02-26 | 1980-02-22 | Applying circuit elements to a substrate |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2047476B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2540328A1 (en) * | 1983-01-31 | 1984-08-03 | Inf Milit Spatiale Aeronaut | |
| EP0140619A2 (en) * | 1983-10-14 | 1985-05-08 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film and circuit connecting method using the same |
| EP0298219A2 (en) * | 1987-06-08 | 1989-01-11 | Tektronix Inc. | Method and apparatus for testing unpackaged integrated circuits in a hybrid circuit environment |
| FR2807907A1 (en) * | 2000-04-13 | 2001-10-19 | Schott Glas | ELECTRICAL CONNECTION BETWEEN A CONNECTION POINT AND A CONDUCTIVE TRACK APPLIED TO A PLATE, PARTICULARLY TO A VITROCERAMIC PLATE |
| EP1198161A1 (en) * | 2000-10-10 | 2002-04-17 | Morton International, Inc. | Method for securing and processing thin film materials |
-
1980
- 1980-02-22 GB GB8006068A patent/GB2047476B/en not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2540328A1 (en) * | 1983-01-31 | 1984-08-03 | Inf Milit Spatiale Aeronaut | |
| EP0115460A2 (en) * | 1983-01-31 | 1984-08-08 | Compagnie D'informatique Militaire Spatiale Et Aeronautique | Flexible printed circuit card, process for the modification of a printed circuit card, and printed circuit card |
| EP0115460A3 (en) * | 1983-01-31 | 1984-08-29 | Compagnie D'informatique Militaire Spatiale Et Aeronautique | Flexible printed circuit card, process for the modification of a printed circuit card, and printed circuit card |
| EP0140619A2 (en) * | 1983-10-14 | 1985-05-08 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film and circuit connecting method using the same |
| EP0140619A3 (en) * | 1983-10-14 | 1986-05-14 | Hitachi Chemical Co., Ltd. | Anisotropic-electroconductive adhesive film and circuit connecting method using the same |
| EP0298219A2 (en) * | 1987-06-08 | 1989-01-11 | Tektronix Inc. | Method and apparatus for testing unpackaged integrated circuits in a hybrid circuit environment |
| EP0298219A3 (en) * | 1987-06-08 | 1990-08-01 | Tektronix Inc. | Method and apparatus for testing unpackaged integrated circuits in a hybrid circuit environment |
| FR2807907A1 (en) * | 2000-04-13 | 2001-10-19 | Schott Glas | ELECTRICAL CONNECTION BETWEEN A CONNECTION POINT AND A CONDUCTIVE TRACK APPLIED TO A PLATE, PARTICULARLY TO A VITROCERAMIC PLATE |
| EP1198161A1 (en) * | 2000-10-10 | 2002-04-17 | Morton International, Inc. | Method for securing and processing thin film materials |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2047476B (en) | 1983-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |