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GB2042282A - Mounting hybrid circuits - Google Patents

Mounting hybrid circuits Download PDF

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Publication number
GB2042282A
GB2042282A GB7904505A GB7904505A GB2042282A GB 2042282 A GB2042282 A GB 2042282A GB 7904505 A GB7904505 A GB 7904505A GB 7904505 A GB7904505 A GB 7904505A GB 2042282 A GB2042282 A GB 2042282A
Authority
GB
United Kingdom
Prior art keywords
substrate
hybrid circuit
contact portion
connections
solderable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB7904505A
Other versions
GB2042282B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Priority to GB7904505A priority Critical patent/GB2042282B/en
Publication of GB2042282A publication Critical patent/GB2042282A/en
Application granted granted Critical
Publication of GB2042282B publication Critical patent/GB2042282B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H05K2201/10765—Leads folded back, i.e. bent with an angle of 180 deg
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A hybrid circuit (1) is provided with solderable edge connections (2). The circuit is mounted in a frame (3) provided with contacts (4). Each contact has a resilient inner contact portion (4a) which bears against a corresponding edge connection and an outer contact portion (4b) which transmits heat and pressure to the inner contact portion when deflected by a special soldering tool (6). <IMAGE>

Description

SPECIFICATION Mounting hybrid circuits This invention relates to the mounting of hybrid circuits using soldered connections.
A hybrid circuit is defined as one or more monolithic circuits used in conjunction with discrete circuit components on an interconnecting thick or thin film or printed circuit board. One form of hybrid circuit comprises a substrate, e.g. of ceramic material, on which the monolithic circuit(s) and the discrete components are mounted and interconnected by a thick film circuit pattern. Such a hybrid circuit is then mounted in a base card using soldered joints to make input and output electrical connections between the circuit pattern on the substrate and electrical conductors on the base card.
According to the invention a method of mounting a hybrid circuit, as hereinbefore defined, comprises the steps of providing on the edge surfaces of the substrate carrying the hybrid circuit a plurality of solderable electrical connections for the interconnecting circuit of the hybrid circuit, locating the hybrid circuit in a mounting frame provided with a corresponding plurality of solderable contacts spring urged into contact with the substrate connections, and soldering the connections to the contacts.
In a preferred embodiment of the invention the spring urged contacts are each formed with an inner contact portion which makes contact with the substrate connection and an outer contact portion adapted to bear against a soldering tool whereby both heat and pressure from the soldering tool may be transmitted to the inner contact portion during the act of soldering.
An embodiment of the invention will now be described with reference to the accompanying drawings, in which: Fig. 1 illustrates a mounting arrangement for a hybrid circuit, and Fig. 2 illustrates a soldering tool suitable for use with the mounting arrangement of Fig. 1.
Fig. 1 shows a substrate 1, on which a hybrid circuit (not shown in detail) is formed. The substrate is provided with solderable connections 2 on its edge surfaces. The substrate is located on a mounting frame 3 carried on a base card 5. the mounting frame is provided with contacts 4 which each have an inner contact portion 4a, spring urged by its own resilience against the edge connection 2, and an outer contact portion 4b. The stem 4c of the contact protrudes through the base card to enable wiring connections to be made thereto. It will be appreciated that a hybrid circuit may have many edge connections spaced around its substrate edges.To effect a satisfactory electrical connection between the contact 4 and the edge connection 2 a soldering. tool 6 is moved downwardly over the outer contact portion 4b causing the inner contact portion 4a to bear with increased pressure against the substrate edge connection 2. When the soldering tool 6 is heated heat flows from the outer contact portion 4b to the inner contact portion 4a to effect soldering between the inner contact portion 4a and the edge connection 2.
A form of soldering tool suitable for simultaneously soldering the edge connections on all four edges of a rectangular substrate is shown in Fig. 2.
Two copper plates 20, 21 are separated by an electrically insulating film 22. The plates are secured together by insulating screws and bolts 23. From two opposing corners 25a of plate 20 and the other two corners 25b of plate 21 depend four copper brackets 26. Joining each adjacent pair of brackets 26 is a copper heating element 27. The two plates 20, 21 are connected by way of conductors bolted through holes 28, 29 to a power source (not shown). The tool may thus be placed over a rectangular substrate to make contact with the outer contacts simultaneously. When current flows through tool the plates 20, 21 remain cool due to their large area and low impedance whilst the narrow heating elements 27 heat up due to their relatively high impedance.
Demounting of the hybrid circuit can readily be accomplished using the same tool. The tool is fitted over the contacts and heat is applied to melt the soldered joints. Whilst the solder is molten the hybrid circuit can be pushed clear of the contacts, e.g. by a rod inserted through a hole in the base card beneath the hybrid circuit.

Claims (6)

1. A method of mounting an hybrid circuit as hereinbefore defined, comprising the steps of providing on the edge surfaces of the substrate carrying the hybrid circuit a plurality of solderable electrical connections for the interconnecting circuit of the hybrid circuit, locating the hybrid circuit in a mounting frame provided with a corresponding plurality of solderable contact spring urged into contact with the substrate connections, and soldering the connections to the contacts.
2. A method according to claim 1 wherein the solderable contacts in the mounting frame each comprise a stem part secured in the frame, and a resilient part extending from the frame shaped to provide an inner contact portion adjacent to and normally urged against a corresponding edge connection on the substrate when the latter is located in the frame and an outer contact portion extending away from the substrate, the outer contact portion being deflectable by a soldering tool whereby heat and pressure from the soldering tool are transmitted to the inner contact portion which is solderable to the edge connector.
3. A method according to claim 1 or 2 wherein the substrate is rectangular and is provided with edge connections on at least two opposing edges.
4. A method according to claim 1,2 or 3 wherein the substrate is rectangular and is provided with edge connections on all four edges.
5. A method of mounting a hybrid circuit substantially as described with reference to Fig. 1 of the accompanying drawings.
6. A hybrid circuit, as hereinbefore defined, when mounted by the method claimed in any preceding claim.
GB7904505A 1979-02-08 1979-02-08 Mounting hybrid circuits Expired GB2042282B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB7904505A GB2042282B (en) 1979-02-08 1979-02-08 Mounting hybrid circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB7904505A GB2042282B (en) 1979-02-08 1979-02-08 Mounting hybrid circuits

Publications (2)

Publication Number Publication Date
GB2042282A true GB2042282A (en) 1980-09-17
GB2042282B GB2042282B (en) 1983-01-06

Family

ID=10503061

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7904505A Expired GB2042282B (en) 1979-02-08 1979-02-08 Mounting hybrid circuits

Country Status (1)

Country Link
GB (1) GB2042282B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001097581A1 (en) * 2000-06-14 2001-12-20 Infineon Technologies Ag Connector arrangement made from electrical/electronic component supports
CN107205316A (en) * 2016-03-17 2017-09-26 上海嘉捷通电路科技股份有限公司 It is a kind of to be applied to the PCS auxiliary machining devices without interior positioning external form processing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001097581A1 (en) * 2000-06-14 2001-12-20 Infineon Technologies Ag Connector arrangement made from electrical/electronic component supports
CN107205316A (en) * 2016-03-17 2017-09-26 上海嘉捷通电路科技股份有限公司 It is a kind of to be applied to the PCS auxiliary machining devices without interior positioning external form processing

Also Published As

Publication number Publication date
GB2042282B (en) 1983-01-06

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee