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GB2021315A - Container for a semiconductor device - Google Patents

Container for a semiconductor device

Info

Publication number
GB2021315A
GB2021315A GB7916238A GB7916238A GB2021315A GB 2021315 A GB2021315 A GB 2021315A GB 7916238 A GB7916238 A GB 7916238A GB 7916238 A GB7916238 A GB 7916238A GB 2021315 A GB2021315 A GB 2021315A
Authority
GB
United Kingdom
Prior art keywords
container
semiconductor device
resin body
metallic plate
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB7916238A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
ATES Componenti Elettronici SpA
SGS ATES Componenti Elettronici SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATES Componenti Elettronici SpA, SGS ATES Componenti Elettronici SpA filed Critical ATES Componenti Elettronici SpA
Publication of GB2021315A publication Critical patent/GB2021315A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

A container for a semiconductor device 6 has a metallic plate (2) partially embedded in a synthetic resin body (4) with a portion of one of the main surfaces of the plate (2) left free. The metallic plate (2) has, on its other portion of the main surface, at least one groove (16) with undercut walls into which the resin body (4) extends. The container has a high degree of sealing. <IMAGE>
GB7916238A 1978-05-16 1979-05-10 Container for a semiconductor device Withdrawn GB2021315A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT23432/78A IT1095885B (en) 1978-05-16 1978-05-16 HIGH HERMETICITY METAL AND RESIN CONTAINER FOR SEMICONDUCTOR DEVICE

Publications (1)

Publication Number Publication Date
GB2021315A true GB2021315A (en) 1979-11-28

Family

ID=11207026

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7916238A Withdrawn GB2021315A (en) 1978-05-16 1979-05-10 Container for a semiconductor device

Country Status (5)

Country Link
JP (1) JPS553692A (en)
DE (2) DE2919540A1 (en)
FR (1) FR2426333A1 (en)
GB (1) GB2021315A (en)
IT (1) IT1095885B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2537342A1 (en) * 1982-12-01 1984-06-08 Ates Componenti Elettron METAL HOUSING AND HIGH RELIABILITY RESIN FOR SEMICONDUCTOR DEVICE
DE102010005771B4 (en) * 2010-01-25 2012-12-13 Heraeus Materials Technology Gmbh & Co. Kg Modular metal strip, process for its manufacture and component with improved flatness

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4401588C2 (en) * 1994-01-20 2003-02-20 Gemplus Gmbh Method for capping a chip card module and chip card module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2537342A1 (en) * 1982-12-01 1984-06-08 Ates Componenti Elettron METAL HOUSING AND HIGH RELIABILITY RESIN FOR SEMICONDUCTOR DEVICE
GB2132015A (en) * 1982-12-01 1984-06-27 Ates Componenti Elettron Improvements in or relating to semiconductor device encapsulations and mountings
DE102010005771B4 (en) * 2010-01-25 2012-12-13 Heraeus Materials Technology Gmbh & Co. Kg Modular metal strip, process for its manufacture and component with improved flatness

Also Published As

Publication number Publication date
IT7823432A0 (en) 1978-05-16
FR2426333B3 (en) 1982-03-19
JPS553692A (en) 1980-01-11
DE7914024U1 (en) 1983-04-07
IT1095885B (en) 1985-08-17
FR2426333A1 (en) 1979-12-14
DE2919540A1 (en) 1979-11-22

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)