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GB201820270D0 - Method and apparatus for treating semiconductor substrate - Google Patents

Method and apparatus for treating semiconductor substrate

Info

Publication number
GB201820270D0
GB201820270D0 GBGB1820270.5A GB201820270A GB201820270D0 GB 201820270 D0 GB201820270 D0 GB 201820270D0 GB 201820270 A GB201820270 A GB 201820270A GB 201820270 D0 GB201820270 D0 GB 201820270D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor substrate
treating semiconductor
treating
substrate
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1820270.5A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research AG
Original Assignee
Lam Research AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research AG filed Critical Lam Research AG
Priority to GBGB1820270.5A priority Critical patent/GB201820270D0/en
Publication of GB201820270D0 publication Critical patent/GB201820270D0/en
Priority to TW108144847A priority patent/TWI845569B/en
Priority to CN201980082628.1A priority patent/CN113169043B/en
Priority to KR1020217021324A priority patent/KR20210100686A/en
Priority to PCT/EP2019/084696 priority patent/WO2020120597A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02046—Dry cleaning only
    • H01L21/02049—Dry cleaning only with gaseous HF
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
GBGB1820270.5A 2018-12-12 2018-12-12 Method and apparatus for treating semiconductor substrate Ceased GB201820270D0 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GBGB1820270.5A GB201820270D0 (en) 2018-12-12 2018-12-12 Method and apparatus for treating semiconductor substrate
TW108144847A TWI845569B (en) 2018-12-12 2019-12-09 Method and apparatus for treating semiconductor substrate
CN201980082628.1A CN113169043B (en) 2018-12-12 2019-12-11 Method and apparatus for processing semiconductor substrates
KR1020217021324A KR20210100686A (en) 2018-12-12 2019-12-11 Methods and apparatus for processing semiconductor substrates
PCT/EP2019/084696 WO2020120597A1 (en) 2018-12-12 2019-12-11 Method and apparatus for treating semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1820270.5A GB201820270D0 (en) 2018-12-12 2018-12-12 Method and apparatus for treating semiconductor substrate

Publications (1)

Publication Number Publication Date
GB201820270D0 true GB201820270D0 (en) 2019-01-30

Family

ID=65147333

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB1820270.5A Ceased GB201820270D0 (en) 2018-12-12 2018-12-12 Method and apparatus for treating semiconductor substrate

Country Status (5)

Country Link
KR (1) KR20210100686A (en)
CN (1) CN113169043B (en)
GB (1) GB201820270D0 (en)
TW (1) TWI845569B (en)
WO (1) WO2020120597A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102765522B1 (en) * 2022-12-22 2025-02-12 세메스 주식회사 Apparatus and method for processing substrate

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06196469A (en) * 1992-12-25 1994-07-15 Sumitomo Metal Ind Ltd Vapor cleaning equipment
JPH06283492A (en) * 1993-03-29 1994-10-07 Sumitomo Metal Ind Ltd Vapor cleaning equipment
US6485531B1 (en) 1998-09-15 2002-11-26 Levitronix Llc Process chamber
KR100381011B1 (en) * 2000-11-13 2003-04-26 한국전자통신연구원 Stiction-free release method of microstructure for fabrication of MEMS device
CN100447943C (en) 2003-03-20 2008-12-31 Sez股份公司 Device and method for wet treating disc-shaped articles
US7279431B2 (en) * 2003-06-18 2007-10-09 Semitool, Inc. Vapor phase etching MEMS devices
JP2007227764A (en) * 2006-02-24 2007-09-06 Dainippon Screen Mfg Co Ltd Substrate surface-treating device, substrate surface treatment method, and substrate-treating device
JP5958950B2 (en) * 2011-07-13 2016-08-02 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method and substrate processing apparatus
JP6230809B2 (en) * 2013-04-22 2017-11-15 株式会社日立国際電気 Semiconductor device manufacturing method, substrate processing apparatus, and program
JP6466315B2 (en) * 2015-12-25 2019-02-06 東京エレクトロン株式会社 Substrate processing method and substrate processing system
JP6611172B2 (en) * 2016-01-28 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method
US10446416B2 (en) 2016-08-09 2019-10-15 Lam Research Ag Method and apparatus for processing wafer-shaped articles
JP6881922B2 (en) * 2016-09-12 2021-06-02 株式会社Ｓｃｒｅｅｎホールディングス Board processing method and board processing equipment
JP6875811B2 (en) * 2016-09-16 2021-05-26 株式会社Ｓｃｒｅｅｎホールディングス Pattern collapse recovery method, board processing method and board processing equipment
JP7412340B2 (en) 2017-10-23 2024-01-12 ラム・リサーチ・アーゲー Systems and methods for preventing stiction of high aspect ratio structures and/or systems and methods for repairing high aspect ratio structures.

Also Published As

Publication number Publication date
KR20210100686A (en) 2021-08-17
WO2020120597A1 (en) 2020-06-18
TWI845569B (en) 2024-06-21
TW202044453A (en) 2020-12-01
CN113169043B (en) 2025-06-24
CN113169043A (en) 2021-07-23

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)