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GB2015405A - Method of Effecting a Solder Connection Between a Component Connection Element and a Conductor Plate - Google Patents

Method of Effecting a Solder Connection Between a Component Connection Element and a Conductor Plate

Info

Publication number
GB2015405A
GB2015405A GB7904447A GB7904447A GB2015405A GB 2015405 A GB2015405 A GB 2015405A GB 7904447 A GB7904447 A GB 7904447A GB 7904447 A GB7904447 A GB 7904447A GB 2015405 A GB2015405 A GB 2015405A
Authority
GB
United Kingdom
Prior art keywords
conductor plate
solder
eyelet
effecting
connection element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB7904447A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deutsche Telephonwerke und Kabelindustrie AG
Original Assignee
Deutsche Telephonwerke und Kabelindustrie AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Telephonwerke und Kabelindustrie AG filed Critical Deutsche Telephonwerke und Kabelindustrie AG
Publication of GB2015405A publication Critical patent/GB2015405A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0004—Resistance soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/005—Soldering by means of radiant energy
    • B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/101—Using electrical induction, e.g. for heating during soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connection Of Plates (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

In effecting solder connection between a component connection element and a conductor plate which for technical reasons, for example, items fitted on both principal faces or connection elements projecting a long way from both faces, cannot be taken through soldering baths to effect the solder connections, a punched or drilled hole (2) in the conductor plate (1), which has a copper lining (6), is provided with an electro-deposited solder alloy coating (7), preferably approximately 25 microns thick, which extends onto one or both exposed faces of the conductor plate (1) to provide a solder eyelet (4) about the hole (2), this eyelet preferably being about 35 microns thick, and after the component connection element has been fitted into the eyelet and hole, the soldered joint is produced by heating. <IMAGE>
GB7904447A 1978-03-01 1979-02-08 Method of Effecting a Solder Connection Between a Component Connection Element and a Conductor Plate Withdrawn GB2015405A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782809288 DE2809288A1 (en) 1978-03-01 1978-03-01 PROCESS FOR A CONTINUOUS BONDING ON CIRCUIT BOARDS

Publications (1)

Publication Number Publication Date
GB2015405A true GB2015405A (en) 1979-09-12

Family

ID=6033520

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7904447A Withdrawn GB2015405A (en) 1978-03-01 1979-02-08 Method of Effecting a Solder Connection Between a Component Connection Element and a Conductor Plate

Country Status (9)

Country Link
BE (1) BE874479A (en)
DE (1) DE2809288A1 (en)
DK (1) DK53579A (en)
FR (1) FR2418991A1 (en)
GB (1) GB2015405A (en)
IE (1) IE790296L (en)
IT (1) IT1111863B (en)
LU (1) LU80700A1 (en)
NL (1) NL7900112A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3008285A1 (en) * 1980-03-04 1981-09-17 Kurt-Åke Vallentuna Wallberg DEVICE FOR CREATING A SEALED CONNECTION BETWEEN TWO METAL LINKS
GB8404342D0 (en) * 1984-02-18 1984-03-21 Lucas Ind Plc Manufacture of armature winding conductors
CN110303213A (en) * 2019-07-05 2019-10-08 深圳市集银科技有限公司 A kind of backlight module FPC welding wire pressing plate technology

Also Published As

Publication number Publication date
FR2418991A1 (en) 1979-09-28
IT1111863B (en) 1986-01-13
DK53579A (en) 1979-09-02
NL7900112A (en) 1979-09-04
BE874479A (en) 1979-06-18
LU80700A1 (en) 1979-04-13
IT7920456A0 (en) 1979-02-23
DE2809288A1 (en) 1979-09-06
IE790296L (en) 1979-09-01

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)