GB201503788D0 - Heatsink - Google Patents

Heatsink

Info

Publication number: GB201503788D0
Authority: GB; United Kingdom
Prior art keywords: heatsink
Prior art date: 2015-03-06
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

GB201503788A

Other versions

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hiflux Ltd

Original Assignee

Hiflux Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-03-06

Filing date

2015-03-06

Publication date

2015-04-22

2015-03-06 Application filed by Hiflux Ltd filed Critical Hiflux Ltd

2015-03-06 Priority to GB1503788.0A priority Critical patent/GB2536051A/en

2015-04-22 Publication of GB201503788D0 publication Critical patent/GB201503788D0/en

2016-09-07 Publication of GB2536051A publication Critical patent/GB2536051A/en

Status Withdrawn legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Power Engineering (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

GB1503788.0A 2015-03-06 2015-03-06 Heatsink Withdrawn GB2536051A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
GB1503788.0A GB2536051A (en)	2015-03-06	2015-03-06	Heatsink

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GB1503788.0A GB2536051A (en)	2015-03-06	2015-03-06	Heatsink

Publications (2)

Publication Number	Publication Date
GB201503788D0 true GB201503788D0 (en)	2015-04-22
GB2536051A GB2536051A (en)	2016-09-07

Family

ID=52998478

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
GB1503788.0A Withdrawn GB2536051A (en)	2015-03-06	2015-03-06	Heatsink

Country Status (1)

Country	Link
GB (1)	GB2536051A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP3379908B1 (en) *	2017-03-24	2020-04-29	EKWB d.o.o.	Method for manufacturing a fluid-based cooling element and fluid-based cooling element
DE102017217537B4 (en) *	2017-10-02	2021-10-21	Danfoss Silicon Power Gmbh	Power module with integrated cooling device
US11968805B2 (en)	2018-11-02	2024-04-23	Telefonaktiebolaget Lm Ericsson (Publ)	Heatsink having air partitioning baffle
USD904323S1 (en)	2019-01-17	2020-12-08	Telefonaktiebolaget Lm Ericsson (Publ)	Heat sink
FR3108823B1 (en) *	2020-03-26	2022-08-05	Valeo Systemes De Controle Moteur	Cooling circuit for electronics housing with power module
US12213240B2 (en) *	2022-09-16	2025-01-28	Hamilton Sundstrand Corporation	Pin-fin cooling for printed circuit boards (PCBs)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2004022914A (en) *	2002-06-19	2004-01-22	Hitachi Ltd	Insulated circuit board, cooling structure therefor, power semiconductor device, and cooling structure therefor
US7215545B1 (en) *	2003-05-01	2007-05-08	Saeed Moghaddam	Liquid cooled diamond bearing heat sink
DE602005008566D1 (en) *	2004-03-11	2008-09-11	Danfoss Silicon Power Gmbh	ELEMENT FOR CARRYING ELECTRONIC COMPONENTS
JP2007294891A (en) *	2006-03-30	2007-11-08	Dowa Metaltech Kk	Heat sink
JP5343574B2 (en) *	2009-01-20	2013-11-13	トヨタ自動車株式会社	Brazing method of heat sink
US20120026692A1 (en) *	2010-07-28	2012-02-02	Wolverine Tube, Inc.	Electronics substrate with enhanced direct bonded metal
JP5568026B2 (en) *	2011-01-20	2014-08-06	トヨタ自動車株式会社	Brazing method and brazing structure
CN103575140A (en) *	2012-07-19	2014-02-12	格伦格斯有限公司	Compact type aluminum heat exchanger with welding pipe for power electronic equipment and battery cooling

2015
- 2015-03-06 GB GB1503788.0A patent/GB2536051A/en not_active Withdrawn

Also Published As

Publication number	Publication date
GB2536051A (en)	2016-09-07

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EP3322270A4 (en)	2018-12-26	Heatsink
GB201503788D0 (en)	2015-04-22	Heatsink
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Legal Events

Date	Code	Title	Description
2020-01-08	WAP	Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)