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GB2013722A - Plating process - Google Patents

Plating process

Info

Publication number
GB2013722A
GB2013722A GB7900840A GB7900840A GB2013722A GB 2013722 A GB2013722 A GB 2013722A GB 7900840 A GB7900840 A GB 7900840A GB 7900840 A GB7900840 A GB 7900840A GB 2013722 A GB2013722 A GB 2013722A
Authority
GB
United Kingdom
Prior art keywords
article
metal
immersing
electrolessly
aqueous oxidising
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB7900840A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CANNING W MATERIALS Ltd
Original Assignee
CANNING W MATERIALS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CANNING W MATERIALS Ltd filed Critical CANNING W MATERIALS Ltd
Priority to GB7900840A priority Critical patent/GB2013722A/en
Publication of GB2013722A publication Critical patent/GB2013722A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A process for plating metal on an electrically-insulating, non-metallic article e.g. of A-B-S plastics comprises the following steps in sequence with rinses as required: (i) preparing the surface of the article eg by immersion in an alkaline cleaner, then a chromic acid etch; (ii) immersing the article in a Pd/Sn activator; (iii) immersing the article in an accelerator which is an aqueous oxidising agent eg hydrogen peroxide, a peroxo complex of a transition metal ion, a perborate or a persulphate; (iv) plating metal (eg Ni/P alloy) electrolessly on the article; and (v) electroplating metal (eg Cu, Ni and Cr in succession) on the electrolessly plated metal. Aqueous oxidising agents have advantageously different characteristics to conventional accelerators.
GB7900840A 1978-01-19 1979-01-10 Plating process Withdrawn GB2013722A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB7900840A GB2013722A (en) 1978-01-19 1979-01-10 Plating process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB229178 1978-01-19
GB7900840A GB2013722A (en) 1978-01-19 1979-01-10 Plating process

Publications (1)

Publication Number Publication Date
GB2013722A true GB2013722A (en) 1979-08-15

Family

ID=26237425

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7900840A Withdrawn GB2013722A (en) 1978-01-19 1979-01-10 Plating process

Country Status (1)

Country Link
GB (1) GB2013722A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3248000A1 (en) * 1981-12-30 1983-07-07 Occidental Chemical Corp., 48089 Warren, Mich. Method for the pretreatment of plastic substrates for electroless metallisation
GB2232168A (en) * 1989-05-01 1990-12-05 Enthone Pretreating circuit boards for electroless coating
US5108786A (en) * 1989-05-01 1992-04-28 Enthone-Omi, Inc. Method of making printed circuit boards
WO1999013696A1 (en) * 1997-09-11 1999-03-18 Atotech Deutschland Gmbh Method for metallization of a substrate containing electric non-conductive surface areas
EP1897974A1 (en) * 2006-09-07 2008-03-12 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
WO2011070167A1 (en) * 2009-12-10 2011-06-16 Commissariat à l'énergie atomique et aux énergies alternatives Method for preparing a metallized polymer substrate
US8366901B2 (en) 2006-09-07 2013-02-05 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3248000A1 (en) * 1981-12-30 1983-07-07 Occidental Chemical Corp., 48089 Warren, Mich. Method for the pretreatment of plastic substrates for electroless metallisation
GB2232168A (en) * 1989-05-01 1990-12-05 Enthone Pretreating circuit boards for electroless coating
US5108786A (en) * 1989-05-01 1992-04-28 Enthone-Omi, Inc. Method of making printed circuit boards
GB2232168B (en) * 1989-05-01 1993-06-16 Enthone Circuit boards
WO1999013696A1 (en) * 1997-09-11 1999-03-18 Atotech Deutschland Gmbh Method for metallization of a substrate containing electric non-conductive surface areas
EP1897974A1 (en) * 2006-09-07 2008-03-12 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
US8366901B2 (en) 2006-09-07 2013-02-05 Enthone Inc. Deposition of conductive polymer and metallization of non-conductive substrates
WO2011070167A1 (en) * 2009-12-10 2011-06-16 Commissariat à l'énergie atomique et aux énergies alternatives Method for preparing a metallized polymer substrate
FR2953861A1 (en) * 2009-12-10 2011-06-17 Commissariat Energie Atomique PROCESS FOR PREPARING A METALLIC POLYMER SUBSTRATE

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)