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GB201203405D0 - Electronic device comprising an electric die and a substrate integrated waveguide, and flip-chip ball grid array package - Google Patents

Electronic device comprising an electric die and a substrate integrated waveguide, and flip-chip ball grid array package

Info

Publication number
GB201203405D0
GB201203405D0 GBGB1203405.4A GB201203405A GB201203405D0 GB 201203405 D0 GB201203405 D0 GB 201203405D0 GB 201203405 A GB201203405 A GB 201203405A GB 201203405 D0 GB201203405 D0 GB 201203405D0
Authority
GB
United Kingdom
Prior art keywords
electronic device
integrated waveguide
substrate
substrate integrated
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB1203405.4A
Other versions
GB2499792B (en
GB2499792A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to GB1203405.4A priority Critical patent/GB2499792B/en
Publication of GB201203405D0 publication Critical patent/GB201203405D0/en
Publication of GB2499792A publication Critical patent/GB2499792A/en
Application granted granted Critical
Publication of GB2499792B publication Critical patent/GB2499792B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/08—Dielectric windows
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/202—Coaxial filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/12—Hollow waveguides
    • H01P3/121—Hollow waveguides integrated in a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00—Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/02—Refracting or diffracting devices, e.g. lens, prism
    • H01Q15/08—Refracting or diffracting devices, e.g. lens, prism formed of solid dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0239—Signal transmission by AC coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Aerials With Secondary Devices (AREA)

Abstract

An electronic device comprises an electronic die 110 such as a power amplifier mounted via conductive bumps 114, 114', 114" on a dielectric substrate 112, and a waveguide 111 integrated in the dielectric substrate 112. It comprises a conductive projection 120 extending in the substrate integrated waveguide 111 and electrically connected to the electronic die 110 through at least one conductive bump 114'. The conductive projection may be a blind metalized hole extending into the dielectric of the substrate. In addition, the electronic device may have several conductive bumps 114 surrounding the conductive projection which are electrically connected to the top 117 and/or bottom 118 metal plate associated with the substrate integrated waveguide. The substrate integrated waveguide may have at the input end 120 the conductive projection 120 and at the other end an antenna lens 113. The electronic device may be used to provide a low-loss transition between the electrical output of a power amplifier and the electromagnetic field associated with the microwave antenna lens 113. The device may typically operate in the 50-70GHz region.
GB1203405.4A 2012-02-28 2012-02-28 Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package Active GB2499792B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1203405.4A GB2499792B (en) 2012-02-28 2012-02-28 Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1203405.4A GB2499792B (en) 2012-02-28 2012-02-28 Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package

Publications (3)

Publication Number Publication Date
GB201203405D0 true GB201203405D0 (en) 2012-04-11
GB2499792A GB2499792A (en) 2013-09-04
GB2499792B GB2499792B (en) 2016-05-04

Family

ID=45991820

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1203405.4A Active GB2499792B (en) 2012-02-28 2012-02-28 Electronic device comprising an electronic die and a substrate integrated waveguide, and flip-chip ball grid array package

Country Status (1)

Country Link
GB (1) GB2499792B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113972469A (en) * 2016-03-15 2022-01-25 安波福技术有限公司 Signal device including substrate-integrated waveguide

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103762400B (en) * 2014-02-20 2016-04-13 东南大学 A kind of method and circuit transmission structure using substrate integration wave-guide connection circuit structure
EP2945222A1 (en) * 2014-05-14 2015-11-18 Gapwaves AB A microwave or millimeter wave RF part using pin grid array (PGA) and/or ball grid array (BGA) technologies
US10199707B2 (en) * 2016-10-13 2019-02-05 Aptiv Technologies Limited Ball-grid-array radio-frequency integrated-circuit printed-circuit-board assembly for automated vehicles
US11183751B2 (en) * 2017-09-20 2021-11-23 Aptiv Technologies Limited Antenna device with direct differential input useable on an automated vehicle
DE102019200902A1 (en) * 2019-01-24 2020-07-30 Audi Ag Radar sensor, motor vehicle and method for producing a radar sensor
US11139581B2 (en) 2019-03-07 2021-10-05 Aptiv Technologies Limited Signaling device including a slot transition between a substrate integrated waveguide and a signal generator
DE102023102086A1 (en) * 2023-01-27 2024-08-01 Bea Sa Microwave radiation unit and associated transceiver
DE102023204741A1 (en) * 2023-05-22 2024-11-28 Infineon Technologies Ag chip packages with substrate-integrated waveguides

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10224141A (en) * 1997-02-10 1998-08-21 Toshiba Corp Monolithic antenna
JP4752369B2 (en) * 2004-08-24 2011-08-17 ソニー株式会社 Semiconductor device and substrate
DE112008000985T5 (en) * 2007-04-13 2010-02-04 Kyocera Corp. High-frequency circuit board, high-frequency switching module and radar device
US8450846B2 (en) * 2008-06-19 2013-05-28 Broadcom Corporation Method and system for communicating via flip-chip die and package waveguides
FR2938982B1 (en) * 2008-11-25 2012-01-13 Thales Sa NETWORK OF RADIANT ELEMENTS, AND ANTENNA COMPRISING SUCH A NETWORK.
JP5556072B2 (en) * 2009-01-07 2014-07-23 ソニー株式会社 Semiconductor device, method of manufacturing the same, and millimeter wave dielectric transmission device
US8674892B2 (en) * 2010-06-20 2014-03-18 Siklu Communication ltd. Accurate millimeter-wave antennas and related structures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113972469A (en) * 2016-03-15 2022-01-25 安波福技术有限公司 Signal device including substrate-integrated waveguide

Also Published As

Publication number Publication date
GB2499792B (en) 2016-05-04
GB2499792A (en) 2013-09-04

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