GB1568985A - Thin and small sized piezo-electric oscilator - Google Patents
Thin and small sized piezo-electric oscilator Download PDFInfo
- Publication number
- GB1568985A GB1568985A GB4635976A GB4635976A GB1568985A GB 1568985 A GB1568985 A GB 1568985A GB 4635976 A GB4635976 A GB 4635976A GB 4635976 A GB4635976 A GB 4635976A GB 1568985 A GB1568985 A GB 1568985A
- Authority
- GB
- United Kingdom
- Prior art keywords
- oscillating element
- oscillator
- figures
- transparent plates
- transparent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000007767 bonding agent Substances 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
- H03H3/04—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks for obtaining desired frequency or temperature coefficient
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/21—Crystal tuning forks
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
(54) THIN AND SMALL SIZED PIEZO-ELECTRIC OSCILLATOR
(71) We, CITIZEN WATCH COMPANY LIMITED, a Japanese corporate body of 1-9-18
Nishishinjuku, Shinjuku-ku, Tokyo, Japan, do hereby declare the invention for which we pray that a patent may be granted to us, and the method by which it is to be performed to be particularly described in and by the following statement:- This invention relates to an improved piezo-electric oscillator, and more particularly, to a thin and small sized piezo-electric oscillator wherein an oscillating element is sandwiched between a base body and a cover.
Heretofore, the miniaturization of a small sized oscillating element has been accomplished by application of semiconductor technology, especially, photo-etching technology, whereby production of small sized piezo-electric oscillating elements having a thickness of 100 ,am or less has been attained.
One problem with a small sized oscillating element such as aforementioned is, however, that it is weak and cannot withstand shocks.
For instance, as shown in Figures 1 A and 11B, of the accompanying drawings which show a conventional small sized piezoelectric oscillator, wherein Figure 1 A is a plan view and Figure 1 B is a sectional view thereof, the free ends Id of the vibrating part of a tuning-fork type thin plate oscillating element I accommodated in a ceramic package 2 tend to be displaced by shocks due to their thin configuration, and stress tends to be concentrated on the neighbourhood of the peripheral part 6a of supporting bed 2a of the base body 2. Therefore, the oscillating element l often breaks due to cracks in the oscillating element 1 coupled with the coarseness in the outline of the oscillating element 1.
It has been often observed that since the oscillating element 1 is weak with respect to shocks due to its thin configuration, if, for instance, a wristwatch having such an oscillator as mentioned above is dropped from the height of about 1 metre, the free ends id of the oscillating element are displaced. This causes stress to concentrate in the neighbourhood of the supporting bed 2a of the base body 2 made of ceramic, whereby the oscillating element 1 is broken by cracks crossing the element coupled with the coarseness in the outline of the oscillating element 1; or cauxes a bonding agent for fixing a base part 1 a of the oscillating element 1 to be distorted, thereby causing frequency deviation of the element.Further, in the process of mounting the oscillating element 1 to the base body 2, since the oscillating member 1 is very small in size and thin in thickness, the accurate positioning thereof could not be obtained even if the mounting was carefully carried out by using pincette. Therefore, the holder of the oscillating element has been required to be large in its overall size to compensate the positioning deviation. Furthermore, even though the element is carefully positioned, there have been often observed lowerings in its efficiency resulting from unappropriate treatments which cause scratches on the electrode films formed on the surface of the oscillating element 1 and breakages.
In view of the above defects, it is an object of the present invention to provide an improved thin and small-sized piezo-electric oscillator.
According to the present invention, a thin and small sized piezo-electric oscillator comprises
a receptacle having a base body and a cover, at least one of which is of transparent material and which are hermetically sealed to provide a cavity,
a tuning fork type piezo-electric oscillating element having a portion which vibrates upon operation of the element and a support portion formed integrally with said vibrating portion, said support portion being sandwiched between said base body and said cover with the vibrating portion in the cavity and with both the base body and the cover being separated from the bivrating portion of the element by a gap of up to 0-2 mm.
If an impact is imparted to a wristwatch accomodating such a piezo-electric oscillator, the vibrating part of the oscillating element makes surface-contact with the two housing parts which function as stops and because of the small gaps between the parts and the element and the parallel plane construction, large displacement of the oscillating element are prevented. This eliminates breakages of the oscillating element, minimizes the frequency deviation due to its displacement, facilitates handling of the oscillating element and improves positioning accuracy in mounting the oscillating element.
One advantage of the construction of the piezo-electric oscillator according to the present invention in that the frequency of the oscillator can be adjusted by irradiation by a laser beam.
Embodiments of a piezo-electric oscillator in accordance with the invention are hereinafter described, by way of example, with reference to Figures 2 to 6 of the accompanying drawings, in which: Figures 2A, 2B, 2C and 2D show a first embodiment according to the present invention, wherein Figure 2A is a plan view thereof,
Figure 2B a sectional view, and Figures 2C and 2D plan views showing front and reverse sides of the oscillating element, respectively;
Figures 3A, 3B, 3C and 3D show a second embodiment according to the present invention, wherein Figure 3A is a plan view thereof, Figure 3B a sectional view, and
Figures 3C and 3D plan views showing the front and reverse sides of the oscillating element;;
Figures 4A, 4B, 4C and 4D show a third embodiment of this invention, wherein Figure 4A is a plan view thereof, Figure 4B a sectional view, and Figures 4C and 4D plan views showing the front and reverse sides of the oscillating element;
Figures SA and 5B show a fourth embodiment of this invention, wherein Figure 5A is a plan view thereof and Figure SB a sectional view; and
Figures 6A and 6B show a fifth embodiment of this invention, wherein Figure 6A is a plan view thereof and Figure 6B a sectional view taken along a line A-A in Figure 6A.
In Figures 2A, 2B, 2C and 2D, a thin tuning fork type piezo-electric oscillating element 1 is sandwiched between two transpaent plates 31, 32 and is joined to the plates by a material 8 which is a bonding agent. As shown in Figures 2C and 2D the element 1 includes an integral rectangular frame-like portion ig surrounding the fork. The magnitude of the gap between the oscillating element 1 and each of the transparent plates 31, 32 in the thickness direction of the oscillating element 1 is less than or equal to 0-2 mm and may be equal to one layer ofjoining material 8. The gap between the two plates 31, 32 may be less than 0 3 mm.The frame-like portion lg acts as a spacer, as shown in the drawing, and it is possible to improve the accuracy of the size of the gaps by interposing spacers 7a, 7a therein. Moreover, by variation in the thickness of the spacers, the magnitude of said gaps can be easily controlled. In the above described construction, two sep rentinelike film electrodes ib ic are formed on each side of the oscillating element 1.The electrode 1 c on the front side of the element 1 as viewed in Figure 2C extends from the base part of the tuning fork to the side of the frame-like portion lg opposed to the base portion on the front side of the oscillating element 1 and is electrically connected, by means of solder 7, to an electrode pad 31a provided on the transparent plate 31 by vapor-deposition. 06 the one hand, the electrode lb on the reverse side of the element 1 as shown in Figure 2D, extends across the base part of the tuning fork to a connection part lf formed by a thin plate conducting wafer provided on the frame-like portion ig on the reverse side of the oscillating element, and the part lf is electrically connected by solder 7 to an electrode pad 32a provided on the transparent plate 32 by vapor-deposition.Further, the two electrodes lb provided on the front and reverse sides of the oscillating element 1 are connected to each other by vapordeposited films at the lateral sides of the oscillating element 1; similarly, the two electrodes lc are connected to each other, whereby a two terminal electrode structure is formed.
Further, in the neighbourhood of the free ends of the oscillating arms of the oscillating element 1 weights are provided in the form of metallic films Ih such as of Cr or Au, by a known metallizing method such as vapordeposition or plating. The oscillating element thus treated on both sides with the films lh is sandwiched between said two transparent plates 31, 32 and is vacuum-sealed so that the portion of the element which vibrates in use is in a cavity.Thereafter, the frequency is adjusted by means of a laser beam irradiated from the outside of either one or both of the transparent plates 31 and 32 to cause evaporation removal of the films lh. Furthermore, mounting of this oscillator in a wristwatch can be made freely in any orientation without regard to its front or reverse side and its right or left side for the symmetrical configuration of the oscillator. At the same time, irradiation by the laser beam for adjusting the frequency can be made from either side through the transparent plate 31 or 32.
Figures 3A, 3B, 3C and 3D show the second embodiment according to this invention, wherein Figure 3A is a plan view thereof,
Figure 3B a longitudinal section of Figure 3A,
Figure 3C a plan view showing the front side of the oscillating element and Figure 3D a plan view showing the reverse side of the oscillating element, wherein the following features are the same as those of the example shown in Figures 2A through 2D, that is, the tuning fork type oscillating element 1 comprises a frame-like portion lg integrally extending from the base part of the tuning fork and the oscillating element 1 is sandwiched between the transparent plate 31, 32 at the frame-like portion Ig with the vibrating portion in a cavity.One difference from the first embodiment is that the length of the transparent plate 32 is longer than that of the transparent plate 31 although the widths thereof are the same as each other. Also, the two electrode pads 32a, 32b to be connected to the two electrodes lb, 1c are provided on the plate 32 on the same side of the oscillating element, and glass 82 having a low melting point and soft solder 81 are used as the jointing material for sandwiching, holding in position and vacuum-sealing the oscillating element. The arrangement of the electrode pads on the same side of the oscillating element and facing in the same direction is advantageous when the oscillator is practically mounted on the circuit substrate.However, the assembling of the three parts, that is, the sandwiching of the oscillating element 1 between the two transparent plates 31, 32 would be accompanied with difficulties in practical assembly apart from the use of the glass 82 and solder 81. Therefore, the transparent plate 32 is first conected to the reverse surface of the oscillating element 1 by means of glass 82 of a low melting point, and then the transparent plate 31 and the front side of the oscillating element 1 are fixed together by the soft solder 81, whereby the oscillating element 1 is sandwiched between the two transparent plates 31, 32 without causing any large positioning deviation.In order to carry out the assembly as aforementioned, metallization having a good wettability with the soft solder 81, is applied along the entire periphery of the frame-like part 1 g on the front side of the oscillating element 1, as shown in Figure 3C. Further, it is necessary to connect the metallized portion with electrode 1c to eliminate the need for another electrode connection. As a matter of course, the peripheral joining part of the transparent
Since the transparent plate 32 is joined to the reverse side of the oscillating element 1 by means of glass 82 having a low melting point, the process in Figure 3D is carried out in almost the same manner as that in Figure 2D.
However, an electrode extension part li whereby the electrode lb is connected to a connection part lf, is required to be coated with only Cr or with Cr superimposed on the generally used electrode film of Cr and Au, taking into consideration its wettability with
low melting point glass 82.
Figures 4A, 4B, 4C and 4D show the third embodiment according to this invention, wherein Figure 4A is a plan view, Figure 4B a longitudinal section of Figure 4A, Figure 4C a plan view showing the front side of the oscillating element, and Figure 4D a plan view showing the reverse side of the oscillating element. In this embodiment, transparent plate 32 is longer than a transparent plate 31 and has electrode pads 32a, 32b at its opposite ends in the longitudinal direction, these features being different from those of the aforementioned two embodiments.Further, the configuration of the oscillating element 1 is also different from said two embodiments in that the frame-like part lg integrally extending from the base part la of the oscillating element 1 does not encircle the entire outline of the tuning fork of the oscillating element 1, but is open at the free end side of the tuning fork. This is for the reason that when the oscillating element 1 is sandwiched, at the same time, between the two transparent plates 31, 32 by means of glass 82 of a low melting point, it is not only difficult to carry out said sandwiching process in vacuum but also it is impossible to make coolete airtight sealing. Accordingly, the join between said parts except for one portion is carried out previously and then complete local sealing is made in vacuum at the open end of the frame-like part 1 g.
In this embodiment, after the oscillating element 1 is sandwiched and held between the two transparent plates 31 and 32 by means of glass 82 of a low melting point, the sealing portion lj formed on the frame-like elongated part 1 g of the oscillating element 1 is sealed by solder in vacuum.
Figures 5A and 5B show the fourth embodiment according to the present invention, wherein Figure 5A is a plan view thereof and
Figure 5B a longitudinal section of Figure
SA. In this embodiment, two transaprent plates 31, 32 are each provided with a concavity facing each other to define a cavity receiving the vibrating part of the oscillating element 1. The concavity provided on the transparent plate 31 extends to its left-hand end as viewed in figures 5A and 5B.
The oscillating element 1 does not have the frame-like part as in the previous embodiments but, the base part la of the oscillating element is longer than those of the aforementioned embodiments. The oscillating element 1 is sandwiched and held between the two transparent plate 31, 32 by means of glass of a low melting point in the same manner as in the embodiment shown in
Figure 4. Thereafter, the sealing can be made with solder 7 in vacuum. Connection to the electrodes 1b and lc can be made by extending them to the end of the base part la of the oscillating element 1, to the electrode pads 32a, 32b respectively by means of solder 7 as shown in Figure 5A.
Figures 6A and 6B show the fifth embodiment according to the present invention, wherein Figure 6A is a plan view thereof, and
Figure 6B a sectional view taken along a line
A-A in Figure 6A. This embodiment is almost the same as the fifth embodiment.
However, the concavities provided in the transparent plates 31, 32 are extended to their right-hand ends in their longitudinal direction as shown in Figure 6A, and the thickness of the joint layer of the glass 82 of a low melting point is approximately uniform as shown in Figure 6B, which improves the efficiency and reliability of the air-tight sealing.
In the five described embodiments according to the invention, the two transparent plates and the joining material such as glass having a low melting point, solder a bonding agent, etc. for sandwiching and holding the oscillating element between the two transpaent plates, should preferably be selected so as to minimize the difference between the coefficients of thermal expansion of the oscillating element, joining material and transparent plates. For instance, when the difference between coefficients of thermal expansion of the transparent plates and the oscillating element is large, the joining material should preferably be selected to have an intermediate value therof.Alternatively, more than two kinds of the joining materials may be used stepwisely according to the magnitude of the difference of the thermal expansion coefficients so as to mimimize the thermal distortion between the joined parts and to attain complete air-tight sealing.
The oscillator as described hereinabove has many advantages and industrial merits.
For example, the oscillating element is sandwiched between two transparent plates so that the gap between the oscillating element and each of the transparent plates is maintained less than or equal to 0 2 mm and the gap between the two transparent plates may be kept within 0 3 mm, thereby preventing breakage of the oscillating element due to the impact. If a wristwatch incorporating the oscillator is dropped from the height of 1 meter the frequency deviation of the oscillator is less than 0-2 ppm.Since the oscillating element comprises an elongated part extending integrally from the base part of the tuning fork with a minimum length sufficient to be sandwiched and joined, there is no necessity for employing a large receptacle to prevent the positioning deviation of the oscillating element as in the conventional oscillator. This configuration therefore allows miniaturization of the oscillator. Further, since the oscillator comprises only tow plates and an oscillating element, its production cost is reduced.
The oscillator obtained according to the present invention can be positioned irrespective of its front and reverse sides when it is mounted in a wristwatch, thereby facilitating wristwatch production.
WHAT WE CLAIM IS:
1. A thin and small sized piezo-electric oscillator comprising
a receptacle having a base body and a cover, at least one of which is of transparent material and which are hermetically sealed to provide a cavity,
a tuning fork type piezo-electric oscillating element having a portion which vibrates upon operation of the element and a support portion formed integrally with said vibrating portion, said support portion being sandwiched between said base body and said cover with the vibrating portion in the cavity and with both the base body and the cover being separated from the vibrating portion of the element by a gap of up to 0-2 mm.
2. An oscillator as claimed in claim 1, in which the base body is a trnsparent plate.
3. An oscillator as claimed in claim 1, in which the cover is a transparent plate.
4. An oscillator as claimed in claim 1, 2 or 3, wherein the support portion comprises a frame surrounding the portion which vibrates upon operation of the element.
5. A thin and small sized piezo-electric oscillator substantially as hereinbefore described with reference to Figures 2A to 2D or
Figures 3A to 3D or Figures 4A to 4D or
Figures 5A and 5B or Figures 6A and 6B of the accompanying drawings.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (5)
1. A thin and small sized piezo-electric oscillator comprising
a receptacle having a base body and a cover, at least one of which is of transparent material and which are hermetically sealed to provide a cavity,
a tuning fork type piezo-electric oscillating element having a portion which vibrates upon operation of the element and a support portion formed integrally with said vibrating portion, said support portion being sandwiched between said base body and said cover with the vibrating portion in the cavity and with both the base body and the cover being separated from the vibrating portion of the element by a gap of up to 0-2 mm.
2. An oscillator as claimed in claim 1, in which the base body is a trnsparent plate.
3. An oscillator as claimed in claim 1, in which the cover is a transparent plate.
4. An oscillator as claimed in claim 1, 2 or 3, wherein the support portion comprises a frame surrounding the portion which vibrates upon operation of the element.
5. A thin and small sized piezo-electric oscillator substantially as hereinbefore described with reference to Figures 2A to 2D or
Figures 3A to 3D or Figures 4A to 4D or
Figures 5A and 5B or Figures 6A and 6B of the accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13599775A JPS5260090A (en) | 1975-11-12 | 1975-11-12 | Thin and small type piezo electric vibrator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1568985A true GB1568985A (en) | 1980-06-11 |
Family
ID=15164769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4635976A Expired GB1568985A (en) | 1975-11-12 | 1976-11-08 | Thin and small sized piezo-electric oscilator |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS5260090A (en) |
| GB (1) | GB1568985A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0062604A1 (en) * | 1981-04-02 | 1982-10-13 | Ebauches S.A. | Piezo-electric oscillator and its manufacturing process |
| US4445256A (en) * | 1979-07-05 | 1984-05-01 | Dryan-Fordahl Technologies S.A. | Method of manufacturing piezoelectric resonator components |
| EP0593070A2 (en) * | 1992-10-15 | 1994-04-20 | Matsushita Electric Industrial Co., Ltd. | Oscillator |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5598023U (en) * | 1978-12-27 | 1980-07-08 | ||
| JP4561521B2 (en) * | 2005-08-02 | 2010-10-13 | 株式会社大真空 | Piezoelectric vibration device |
-
1975
- 1975-11-12 JP JP13599775A patent/JPS5260090A/en active Pending
-
1976
- 1976-11-08 GB GB4635976A patent/GB1568985A/en not_active Expired
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4445256A (en) * | 1979-07-05 | 1984-05-01 | Dryan-Fordahl Technologies S.A. | Method of manufacturing piezoelectric resonator components |
| EP0062604A1 (en) * | 1981-04-02 | 1982-10-13 | Ebauches S.A. | Piezo-electric oscillator and its manufacturing process |
| EP0593070A2 (en) * | 1992-10-15 | 1994-04-20 | Matsushita Electric Industrial Co., Ltd. | Oscillator |
| EP0593070A3 (en) * | 1992-10-15 | 1994-06-08 | Matsushita Electric Ind Co Ltd | Oscillator |
| US5449965A (en) * | 1992-10-15 | 1995-09-12 | Matsushita Electric Industrial Co., Ltd. | Oscillator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5260090A (en) | 1977-05-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PE20 | Patent expired after termination of 20 years |
Effective date: 19961107 |