GB1549103A - Epoxy resin encapsulant compositions - Google Patents
Epoxy resin encapsulant compositionsInfo
- Publication number
- GB1549103A GB1549103A GB30356/77A GB3035677A GB1549103A GB 1549103 A GB1549103 A GB 1549103A GB 30356/77 A GB30356/77 A GB 30356/77A GB 3035677 A GB3035677 A GB 3035677A GB 1549103 A GB1549103 A GB 1549103A
- Authority
- GB
- United Kingdom
- Prior art keywords
- epoxy resin
- resin encapsulant
- encapsulant compositions
- compositions
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008393 encapsulating agent Substances 0.000 title 1
- 239000003822 epoxy resin Substances 0.000 title 1
- 239000000203 mixture Substances 0.000 title 1
- 229920000647 polyepoxide Polymers 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L35/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB30356/77A GB1549103A (en) | 1977-07-19 | 1977-07-19 | Epoxy resin encapsulant compositions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB30356/77A GB1549103A (en) | 1977-07-19 | 1977-07-19 | Epoxy resin encapsulant compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1549103A true GB1549103A (en) | 1979-08-01 |
Family
ID=10306356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB30356/77A Expired GB1549103A (en) | 1977-07-19 | 1977-07-19 | Epoxy resin encapsulant compositions |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1549103A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2238660A (en) * | 1989-11-15 | 1991-06-05 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
CN112852110A (en) * | 2021-02-08 | 2021-05-28 | 温州大学激光与光电智能制造研究院 | Antistatic epoxy plastic packaging material and preparation method thereof |
-
1977
- 1977-07-19 GB GB30356/77A patent/GB1549103A/en not_active Expired
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2238660A (en) * | 1989-11-15 | 1991-06-05 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
US5093712A (en) * | 1989-11-15 | 1992-03-03 | Mitsubishi Denki Kabushiki Kaisha | Resin-sealed semiconductor device |
GB2238660B (en) * | 1989-11-15 | 1993-06-02 | Mitsubishi Electric Corp | Resin-sealed semiconductor device |
CN112852110A (en) * | 2021-02-08 | 2021-05-28 | 温州大学激光与光电智能制造研究院 | Antistatic epoxy plastic packaging material and preparation method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee | ||
PCNP | Patent ceased through non-payment of renewal fee |