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GB1524331A - Clamping device for a semiconductor element - Google Patents

Clamping device for a semiconductor element

Info

Publication number
GB1524331A
GB1524331A GB755877A GB755877A GB1524331A GB 1524331 A GB1524331 A GB 1524331A GB 755877 A GB755877 A GB 755877A GB 755877 A GB755877 A GB 755877A GB 1524331 A GB1524331 A GB 1524331A
Authority
GB
United Kingdom
Prior art keywords
plate
spring plate
screw
semiconductor device
pressure plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB755877A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC BROWN BOVERI and CIE
BBC Brown Boveri AG Germany
Original Assignee
BBC BROWN BOVERI and CIE
Brown Boveri und Cie AG Germany
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC BROWN BOVERI and CIE, Brown Boveri und Cie AG Germany filed Critical BBC BROWN BOVERI and CIE
Priority to GB755877A priority Critical patent/GB1524331A/en
Publication of GB1524331A publication Critical patent/GB1524331A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

1524331 Semiconductor devices BROWN BOVERI & CIE AG 23 Feb 1977 07558/77 Heading H1K A semiconductor device 1 having thermal and electrical contacts 2, 2<SP>1</SP> is clamped between two pressure plates 4, 11 connected by four rods 6 acting via part-spherical washers 9 in countersunk portions of the one plate 11, wherein at least one pressure plate 11 is a square spring plate with a screw-threaded insert 12 guiding a screw 13 which acts on a convex thrust member 8 on one contact 2<SP>1</SP>. The other pressure plate 4 may be a heat dissipating crossmember or it may be a spring plate of another semiconductor device in a stack. The contacts 2, 2<SP>1</SP> or the pressure plate 4 may be part of a heat pipe. The spring plate 11 has flat characteristics so that a large range of compressive forces can be applied by it.
GB755877A 1977-02-23 1977-02-23 Clamping device for a semiconductor element Expired GB1524331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB755877A GB1524331A (en) 1977-02-23 1977-02-23 Clamping device for a semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB755877A GB1524331A (en) 1977-02-23 1977-02-23 Clamping device for a semiconductor element

Publications (1)

Publication Number Publication Date
GB1524331A true GB1524331A (en) 1978-09-13

Family

ID=9835431

Family Applications (1)

Application Number Title Priority Date Filing Date
GB755877A Expired GB1524331A (en) 1977-02-23 1977-02-23 Clamping device for a semiconductor element

Country Status (1)

Country Link
GB (1) GB1524331A (en)

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee