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GB1504025A - Microwave coupling device - Google Patents

Microwave coupling device

Info

Publication number
GB1504025A
GB1504025A GB3302175A GB3302175A GB1504025A GB 1504025 A GB1504025 A GB 1504025A GB 3302175 A GB3302175 A GB 3302175A GB 3302175 A GB3302175 A GB 3302175A GB 1504025 A GB1504025 A GB 1504025A
Authority
GB
United Kingdom
Prior art keywords
diode
metallization
ground plane
contact
coupling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3302175A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of GB1504025A publication Critical patent/GB1504025A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/005—Diode mounting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguide Connection Structure (AREA)
  • Microwave Amplifiers (AREA)
  • Amplifiers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1504025 Microwave coupling device HUGHES AIRCRAFT CO 7 Aug 1975 [3 Sept 1974] 33021/75 Heading H3T A microwave coupling device, e.g. for an amplifier, oscillator, frequency multiplier or modulator comprises a metallic ground plane and heat sink 12, Fig. 2a, a dielectric waveguide 10 of, for example, high resistivity silicon, GaAs or ceramic and metallization (e.g. evaporated Cr-Au) 16 for coupling microwave energy to the waveguide. In an aperture 14 in the layer 10 is disposed a solid state device such as an IMPATT, Gunn, PIN or varactor diode 26, Fig. 2b. As described, 26 is an IMPATT diode bonded to a copper base 24 in contact with the ground plane 12. Diode 26 is surrounded by a ring 28 having metallized faces and contact is made to the top surface of the diode by a gold ribbon 32 and a solder preform 29 in contact with a molybdenum cap 18. Cap 18 is connected to metallization 16 by a further gold ribbon 20, Fig. 2a, which may be cruciform. Various shapes for the metallization 16 are described, Figs. 3-6 (not shown). D.C. bias for the diode is applied to the metallization 16 and the ground plane 12.
GB3302175A 1974-09-03 1975-08-07 Microwave coupling device Expired GB1504025A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50259574A 1974-09-03 1974-09-03

Publications (1)

Publication Number Publication Date
GB1504025A true GB1504025A (en) 1978-03-15

Family

ID=23998524

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3302175A Expired GB1504025A (en) 1974-09-03 1975-08-07 Microwave coupling device

Country Status (4)

Country Link
JP (1) JPS5150643A (en)
DE (1) DE2536486A1 (en)
FR (1) FR2284195A1 (en)
GB (1) GB1504025A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2346747A (en) * 1999-02-15 2000-08-16 Bosch Gmbh Robert Elastic contact for Gunn element in oscillator

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2524202B1 (en) * 1982-03-23 1985-11-08 Thomson Csf PRE-ADAPTED MODULE FOR MICROWAVE, AND METHOD FOR MAKING THE POLARIZATION CONNECTION OF THE DIODE
EP0180906B1 (en) * 1984-11-02 1989-01-18 Siemens Aktiengesellschaft Wave resistance-adapted chip support for a microwave semiconductor
CA2109441C (en) * 1992-10-29 1997-05-13 Yuhei Kosugi Composite microwave circuit module assembly and its connection structure

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4939542B1 (en) * 1969-08-01 1974-10-26
DE2051064A1 (en) * 1969-12-17 1971-07-08 Combustion Eng Core for a combined fast converter breeder reactor
JPS4947713B1 (en) * 1970-04-27 1974-12-17
JPS5641001B1 (en) * 1971-04-30 1981-09-25
JPS5116987U (en) * 1974-07-25 1976-02-06

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2346747A (en) * 1999-02-15 2000-08-16 Bosch Gmbh Robert Elastic contact for Gunn element in oscillator
US6300842B1 (en) 1999-02-15 2001-10-09 Robert Bosch Gmbh Arrangement for producing electrical oscillations
GB2346747B (en) * 1999-02-15 2001-10-24 Bosch Gmbh Robert Apparatus for generating electrical oscillations

Also Published As

Publication number Publication date
FR2284195B1 (en) 1979-05-18
FR2284195A1 (en) 1976-04-02
DE2536486A1 (en) 1976-04-08
JPS5150643A (en) 1976-05-04

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee