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GB1446196A - Electrical leaf-spring contact pile-ups - Google Patents

Electrical leaf-spring contact pile-ups

Info

Publication number
GB1446196A
GB1446196A GB4028573A GB4028573A GB1446196A GB 1446196 A GB1446196 A GB 1446196A GB 4028573 A GB4028573 A GB 4028573A GB 4028573 A GB4028573 A GB 4028573A GB 1446196 A GB1446196 A GB 1446196A
Authority
GB
United Kingdom
Prior art keywords
ups
pile
spring contact
springs
relay contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4028573A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Priority to GB4028573A priority Critical patent/GB1446196A/en
Publication of GB1446196A publication Critical patent/GB1446196A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H50/00—Details of electromagnetic relays
    • H01H50/54—Contact arrangements
    • H01H50/56—Contact spring sets

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Springs (AREA)
  • Vibration Prevention Devices (AREA)

Abstract

1446196 Relay contact spring pile-ups PLESSEY CO Ltd 5 July 1974 [24 Aug 1973] 40285/73 Heading H1N A relay contact spring pile up is provided with spring vibration clamping means comprising a soft resilient material extending at 6 between the springs 2 and retained at a preset distance from the pile up support 5 by a clip 7. The damping means may be made from soft polyvinylchloride, neoprene, or other plastics or rubber material and have strips 8 from which damping ports extend at 6 between the springs 2 under slight compression.
GB4028573A 1973-08-24 1973-08-24 Electrical leaf-spring contact pile-ups Expired GB1446196A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4028573A GB1446196A (en) 1973-08-24 1973-08-24 Electrical leaf-spring contact pile-ups

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4028573A GB1446196A (en) 1973-08-24 1973-08-24 Electrical leaf-spring contact pile-ups

Publications (1)

Publication Number Publication Date
GB1446196A true GB1446196A (en) 1976-08-18

Family

ID=10414125

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4028573A Expired GB1446196A (en) 1973-08-24 1973-08-24 Electrical leaf-spring contact pile-ups

Country Status (1)

Country Link
GB (1) GB1446196A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001048818A1 (en) * 1999-12-29 2001-07-05 Formfactor, Inc. Resilient interconnect structure for electronic components and method for making the same
US6491968B1 (en) 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures
US6520778B1 (en) 1997-02-18 2003-02-18 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US6616966B2 (en) 1998-12-02 2003-09-09 Formfactor, Inc. Method of making lithographic contact springs
US6615485B2 (en) 1993-11-16 2003-09-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6672875B1 (en) 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
US6791176B2 (en) 1998-12-02 2004-09-14 Formfactor, Inc. Lithographic contact elements
US6807734B2 (en) 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
CN100468598C (en) * 2007-04-13 2009-03-11 上海德力西集团有限公司 Plane spring capable of eliminating short-range vibratory
US7553165B2 (en) 1998-12-02 2009-06-30 Formfactor, Inc. Spring interconnect structures
US8373428B2 (en) 1993-11-16 2013-02-12 Formfactor, Inc. Probe card assembly and kit, and methods of making same

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6615485B2 (en) 1993-11-16 2003-09-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US8373428B2 (en) 1993-11-16 2013-02-12 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6520778B1 (en) 1997-02-18 2003-02-18 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US6807734B2 (en) 1998-02-13 2004-10-26 Formfactor, Inc. Microelectronic contact structures, and methods of making same
US7798822B2 (en) 1998-02-13 2010-09-21 Formfactor, Inc. Microelectronic contact structures
US6616966B2 (en) 1998-12-02 2003-09-09 Formfactor, Inc. Method of making lithographic contact springs
US6672875B1 (en) 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
US6791176B2 (en) 1998-12-02 2004-09-14 Formfactor, Inc. Lithographic contact elements
US7287322B2 (en) 1998-12-02 2007-10-30 Formfactor, Inc. Lithographic contact elements
US7371072B2 (en) 1998-12-02 2008-05-13 Formfactor, Inc. Spring interconnect structures
US7553165B2 (en) 1998-12-02 2009-06-30 Formfactor, Inc. Spring interconnect structures
US7555836B2 (en) 1998-12-02 2009-07-07 Formfactor, Inc. Method of making lithographic contact elements
US7841863B2 (en) 1998-12-02 2010-11-30 Formfactor, Inc. Spring interconnect structures
US6491968B1 (en) 1998-12-02 2002-12-10 Formfactor, Inc. Methods for making spring interconnect structures
WO2001048818A1 (en) * 1999-12-29 2001-07-05 Formfactor, Inc. Resilient interconnect structure for electronic components and method for making the same
CN100468598C (en) * 2007-04-13 2009-03-11 上海德力西集团有限公司 Plane spring capable of eliminating short-range vibratory

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee