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GB1415240A - Machine for cutting brittle materials - Google Patents

Machine for cutting brittle materials

Info

Publication number
GB1415240A
GB1415240A GB5502473A GB5502473A GB1415240A GB 1415240 A GB1415240 A GB 1415240A GB 5502473 A GB5502473 A GB 5502473A GB 5502473 A GB5502473 A GB 5502473A GB 1415240 A GB1415240 A GB 1415240A
Authority
GB
United Kingdom
Prior art keywords
machine
brittle materials
cutting brittle
cutting
materials
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5502473A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to GB5502473A priority Critical patent/GB1415240A/en
Publication of GB1415240A publication Critical patent/GB1415240A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
GB5502473A 1973-11-27 1973-11-27 Machine for cutting brittle materials Expired GB1415240A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB5502473A GB1415240A (en) 1973-11-27 1973-11-27 Machine for cutting brittle materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5502473A GB1415240A (en) 1973-11-27 1973-11-27 Machine for cutting brittle materials

Publications (1)

Publication Number Publication Date
GB1415240A true GB1415240A (en) 1975-11-26

Family

ID=10472742

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5502473A Expired GB1415240A (en) 1973-11-27 1973-11-27 Machine for cutting brittle materials

Country Status (1)

Country Link
GB (1) GB1415240A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000055A (en) * 1977-06-14 1979-01-04 Inoue Japax Res Method of and apparatus for shaping workpieces
FR2627113A1 (en) * 1988-02-17 1989-08-18 Mueller Georg Nuernberg DRIVE UNIT FOR SAW CABLE, METHOD AND DEVICE FOR PRODUCING, FROM SEMICONDUCTOR INGOTS, SEMICONDUCTOR CIRCULAR PADS WITH AT LEAST ONE FLAT SURFACE
EP0694366A1 (en) * 1994-07-29 1996-01-31 Shin-Etsu Handotai Company Limited Wire saw apparatus
EP0745447A1 (en) * 1995-05-31 1996-12-04 Shin-Etsu Handotai Co., Ltd Wire saw apparatus
WO2011151022A1 (en) * 2010-06-04 2011-12-08 Meyer Burger Ag Wire saw having wire-break monitoring

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2000055A (en) * 1977-06-14 1979-01-04 Inoue Japax Res Method of and apparatus for shaping workpieces
GB2000055B (en) * 1977-06-14 1982-03-03 Inoue Japax Research Incorporated Method of and apparatus for shaping workpieces
FR2627113A1 (en) * 1988-02-17 1989-08-18 Mueller Georg Nuernberg DRIVE UNIT FOR SAW CABLE, METHOD AND DEVICE FOR PRODUCING, FROM SEMICONDUCTOR INGOTS, SEMICONDUCTOR CIRCULAR PADS WITH AT LEAST ONE FLAT SURFACE
EP0694366A1 (en) * 1994-07-29 1996-01-31 Shin-Etsu Handotai Company Limited Wire saw apparatus
US5907988A (en) * 1994-07-29 1999-06-01 Shin-Etsu Handotai Co., Ltd. Wire saw apparatus
EP0745447A1 (en) * 1995-05-31 1996-12-04 Shin-Etsu Handotai Co., Ltd Wire saw apparatus
US5699782A (en) * 1995-05-31 1997-12-23 Shin-Etsu Handotai Co., Ltd. Wire saw apparatus
WO2011151022A1 (en) * 2010-06-04 2011-12-08 Meyer Burger Ag Wire saw having wire-break monitoring

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Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee