GB1408352A - Electrolytic methods of etching thin films - Google Patents
Electrolytic methods of etching thin filmsInfo
- Publication number
- GB1408352A GB1408352A GB4878373A GB4878373A GB1408352A GB 1408352 A GB1408352 A GB 1408352A GB 4878373 A GB4878373 A GB 4878373A GB 4878373 A GB4878373 A GB 4878373A GB 1408352 A GB1408352 A GB 1408352A
- Authority
- GB
- United Kingdom
- Prior art keywords
- etched
- reference electrode
- auxiliary electrode
- periodicity
- oct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 title abstract 2
- 239000010409 thin film Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 229910052697 platinum Inorganic materials 0.000 abstract 4
- 239000010408 film Substances 0.000 abstract 3
- 229910052703 rhodium Inorganic materials 0.000 abstract 3
- 239000002253 acid Substances 0.000 abstract 2
- 229910052737 gold Inorganic materials 0.000 abstract 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 229940075397 calomel Drugs 0.000 abstract 1
- 229910052799 carbon Inorganic materials 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical compound Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 abstract 1
- 238000000866 electrolytic etching Methods 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 abstract 1
- 238000007654 immersion Methods 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910052723 transition metal Inorganic materials 0.000 abstract 1
- 150000003624 transition metals Chemical class 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
1408352 Electrolytic etching of thin metal films WESTERN ELECTRIC CO Inc 19 Oct 1973 [19 Oct 1972] 48783/73 Heading C7B A thin film containing Au, Pt and/or Rh is etched electrolytically by immersion in an acid bath of pH less than 1, together with an auxiliary electrode and a reference electrode and applying between the film and auxiliary electrode a potential which periodically varies between limiting values of 1600 mV and -60mV (hydrogen scale) with respect to the reference electrode. Rh is selectively etched with respect to Au with an upper potential of 900-1100mV; Rh and Pt are selectively etched at 1100-1450 mV; and Rh, Pt and Au are etched together above 1450 mV. A pulsed potentiostat leaving a periodicity of 1-10 mSec may be used. The acid may be HF, HCl, HClO 4 , H 2 SO 4 or H 3 PO 4 . The film may be a composite comprising the following respective layers on an insulating substrate; (1) a transition metal e.g. Ti, (2) Pt or Rh, (3) Au. Speed of etching is controlled by variation of the periodicity. A carbon auxiliary electrode is specified together with a calomel reference electrode. The Ti layer may be etched by a constant or pulsed voltage of e.g. -300 to -500 mV.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29885672A | 1972-10-19 | 1972-10-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1408352A true GB1408352A (en) | 1975-10-01 |
Family
ID=23152265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB4878373A Expired GB1408352A (en) | 1972-10-19 | 1973-10-19 | Electrolytic methods of etching thin films |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3798141A (en) |
| JP (1) | JPS4974140A (en) |
| BE (1) | BE806230A (en) |
| CA (1) | CA1026704A (en) |
| DE (1) | DE2351664B2 (en) |
| FR (1) | FR2203890B1 (en) |
| GB (1) | GB1408352A (en) |
| IT (1) | IT999661B (en) |
| NL (1) | NL157062B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3898141A (en) * | 1974-02-08 | 1975-08-05 | Bell Telephone Labor Inc | Electrolytic oxidation and etching of III-V compound semiconductors |
| NL7609816A (en) * | 1976-09-03 | 1978-03-07 | Philips Nv | PROCESS OF MANUFACTURING A BODY PROVIDED WITH A GOLD PATTERN AND BODY MANUFACTURED BY THE PROCESS. |
| US4206028A (en) * | 1976-12-14 | 1980-06-03 | Inoue-Japax Research Incorporated | Electrochemical polishing system |
| GB1539309A (en) * | 1976-12-14 | 1979-01-31 | Inoue Japax Res | Electrochemical polishing |
| DE3029277C2 (en) * | 1980-08-01 | 1983-10-20 | Siemens AG, 1000 Berlin und 8000 München | Build-up of metal layers |
| WO2002030401A2 (en) | 2000-10-11 | 2002-04-18 | Microchips, Inc. | Microchip reservoir devices and facilitated corrosion of electrodes |
| WO2002099457A1 (en) | 2001-05-31 | 2002-12-12 | Massachusetts Inst Technology | Microchip devices with improved reservoir opening |
| US7175752B2 (en) * | 2002-05-24 | 2007-02-13 | Federal-Mogul Worldwide, Inc. | Method and apparatus for electrochemical machining |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3566358A (en) * | 1968-03-19 | 1971-02-23 | Bevier Hasbrouck | Integrated multi-computer system |
-
1972
- 1972-10-19 US US00298856A patent/US3798141A/en not_active Expired - Lifetime
-
1973
- 1973-05-09 CA CA170,822A patent/CA1026704A/en not_active Expired
- 1973-10-15 NL NL7314162.A patent/NL157062B/en unknown
- 1973-10-15 DE DE2351664A patent/DE2351664B2/en not_active Withdrawn
- 1973-10-18 FR FR7337216A patent/FR2203890B1/fr not_active Expired
- 1973-10-18 IT IT70089/73A patent/IT999661B/en active
- 1973-10-18 BE BE136820A patent/BE806230A/en unknown
- 1973-10-19 JP JP48116978A patent/JPS4974140A/ja active Pending
- 1973-10-19 GB GB4878373A patent/GB1408352A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CA1026704A (en) | 1978-02-21 |
| IT999661B (en) | 1976-03-10 |
| FR2203890B1 (en) | 1976-07-23 |
| JPS4974140A (en) | 1974-07-17 |
| US3798141A (en) | 1974-03-19 |
| BE806230A (en) | 1974-02-15 |
| DE2351664B2 (en) | 1975-09-18 |
| DE2351664A1 (en) | 1974-05-02 |
| FR2203890A1 (en) | 1974-05-17 |
| NL7314162A (en) | 1974-04-23 |
| NL157062B (en) | 1978-06-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |