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GB1395887A - Process for preparing an insulating substrate for use in printed circuits - Google Patents

Process for preparing an insulating substrate for use in printed circuits

Info

Publication number
GB1395887A
GB1395887A GB4944371A GB4944371A GB1395887A GB 1395887 A GB1395887 A GB 1395887A GB 4944371 A GB4944371 A GB 4944371A GB 4944371 A GB4944371 A GB 4944371A GB 1395887 A GB1395887 A GB 1395887A
Authority
GB
United Kingdom
Prior art keywords
mixture
sheet
layer
fibrous
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4944371A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Formica International Ltd
Original Assignee
Formica International Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formica International Ltd filed Critical Formica International Ltd
Priority to GB4944371A priority Critical patent/GB1395887A/en
Priority to ZA727423A priority patent/ZA727423B/en
Priority to AU47998/72A priority patent/AU478139B2/en
Priority to FR7237639A priority patent/FR2158256A2/fr
Publication of GB1395887A publication Critical patent/GB1395887A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/24—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)

Abstract

1395887 Laminates FORMICA INTERNATIONAL Ltd 17 Oct 1972 [25 Oct 1971] 49443/71 Addition to 1355331 Heading B5N An insulating substrate suitable for use in printed circuits is produced by curing a mixture comprising a selectively or uniformly etchable synthetic rubber polymer and a first thermosettable resin to give a selectively etchable layer, superimposing the layer on a fibrous sheet or web impregnated with a second thermosettable resin or on a stack of such impregnated fibrous sheets or webs, and consolidating the assembly so produced and curing the second thermosettable resin by heating under pressure. Suitable thermosettable resins are phenol-, urea- or melamine-formaldehyde, modified methacrylic, polyester and epoxy resins, and suitable etchable synthetic rubber polymers are acrylonitrilebutadiene-styrene terpolymers. acrylonitrilebutadiene copolymers and butadiene-styrene copolymers. The mixture may comprise 10- 99% by weight of the synthetic rubber polymer. The layer of the mixture may be produced (a) by coating the mixture on to a sheet of material which does not adhere to the mixture, e.g. siliconized parchments, silicone-treated aluminium foil or polymeric films, (b) by impregnating a fibrous sheet with the mixture, (c) by casting or extruding the mixture into an unsupported film, (d) by coating the mixture on to a fibrous sheet impregnated with a thermosettable resin or (e) by coating the mixture on to a layer of material, e.g. of aluminium, which adheres to the mixture and which may subsequently be etched away, e.g. with a sodium hydroxide solution. The fibrous sheets or webs may be of paper, glass fibre, cotton or polymeric materials. A metal sheet (e.g. of aluminium), may also be bonded to one surface of the assembly or inserted within the stack. Heat and pressure may be applied in a press, preferably having gloss finish stainless steel press plates and optionally using a polymeric release sheet, for 10-60 minutes at 120-180‹ C. and 35-63 kg./cm.<SP>2</SP>. A printed circuit may be formed on the insulating substrate by electroless deposition.
GB4944371A 1971-10-25 1971-10-25 Process for preparing an insulating substrate for use in printed circuits Expired GB1395887A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB4944371A GB1395887A (en) 1971-10-25 1971-10-25 Process for preparing an insulating substrate for use in printed circuits
ZA727423A ZA727423B (en) 1971-10-25 1972-10-18 Improved process for preparing printed circuit substrates
AU47998/72A AU478139B2 (en) 1971-10-25 1972-10-20 Process for preparing an insulating substrate for use in printed circuits
FR7237639A FR2158256A2 (en) 1971-10-25 1972-10-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4944371A GB1395887A (en) 1971-10-25 1971-10-25 Process for preparing an insulating substrate for use in printed circuits

Publications (1)

Publication Number Publication Date
GB1395887A true GB1395887A (en) 1975-05-29

Family

ID=10452355

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4944371A Expired GB1395887A (en) 1971-10-25 1971-10-25 Process for preparing an insulating substrate for use in printed circuits

Country Status (3)

Country Link
FR (1) FR2158256A2 (en)
GB (1) GB1395887A (en)
ZA (1) ZA727423B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008119803A1 (en) * 2007-04-02 2008-10-09 Basf Se Method for producing a base laminate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0003718A1 (en) * 1978-02-07 1979-08-22 Hug Interlizenz AG Synthetic resins reinforced with glass fibres and process for their manufacture
US4913955A (en) * 1987-06-05 1990-04-03 Shin-Kobe Electric Machinery Co., Ltd. Epoxy resin laminate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1275231A (en) * 1958-06-16 1961-11-03 Formica Int Manufacturing process of metallized insulating materials and their applications

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008119803A1 (en) * 2007-04-02 2008-10-09 Basf Se Method for producing a base laminate

Also Published As

Publication number Publication date
FR2158256A2 (en) 1973-06-15
ZA727423B (en) 1974-05-29
AU4799872A (en) 1974-04-26

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Legal Events

Date Code Title Description
PS Patent sealed [section 19, patents act 1949]
PLE Entries relating assignments, transmissions, licences in the register of patents
PCNP Patent ceased through non-payment of renewal fee