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GB1352959A - Passivation of semiconductor devices - Google Patents

Passivation of semiconductor devices

Info

Publication number
GB1352959A
GB1352959A GB1352959DA GB1352959A GB 1352959 A GB1352959 A GB 1352959A GB 1352959D A GB1352959D A GB 1352959DA GB 1352959 A GB1352959 A GB 1352959A
Authority
GB
United Kingdom
Prior art keywords
glass
mesas
grooves
fibres
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
Standard Telephone and Cables PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Telephone and Cables PLC filed Critical Standard Telephone and Cables PLC
Publication of GB1352959A publication Critical patent/GB1352959A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157Partial encapsulation or coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

1352959 Semi-conductor-glass seals; glass composition STANDARD TELEPHONES & CABLES Ltd 9 Nov 1972 51659/72 Heading C1M [Also in Division H1] The lateral edges of semi-conductor mesas 46 on a wafer 41 are passivated by positioning an assembly of equally spaced parallel glass fibres 14 so that each fibre occupies one of the grooves between the mesas, and softening the glass so that it flows and fills the grooves. If necessary the process can be repeated with the wafer rotated through a right-angle so that each mesas 46 is entirely surrounded by glass. Optionally the back of the wafer 41 may subsequently be entirely removed by use of a polishing pad impregnated with an etchant, leaving only the mesa portions 46 embedded in a glass matrix. Where shallow mesas are required to be passivated the process of softening of glass fibres is first carried out to fill relatively deep grooves, following which shallower secondary grooves are etched between the mesas and the glass and the latter is reheated so that it flows into the secondary grooves and into contact with the mesas. For GaAs a suitable glass composition is PbO 69%; Al 2 O 3 14%; B 2 O 3 11%; SiO 2 6% (wt. per cents). An apparatus connecting the fibres together in a parallel assembly and spring-loaded apparatus for maintaining the fibres under constant tension during the softening process are also described, Semi-conductor lasers, Gunn diodes and IMPATT diodes are referred to.
GB1352959D 1972-11-09 1972-11-09 Passivation of semiconductor devices Expired GB1352959A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB5165972 1972-11-09

Publications (1)

Publication Number Publication Date
GB1352959A true GB1352959A (en) 1974-05-15

Family

ID=10460891

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1352959D Expired GB1352959A (en) 1972-11-09 1972-11-09 Passivation of semiconductor devices

Country Status (1)

Country Link
GB (1) GB1352959A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2406309A1 (en) * 1977-10-11 1979-05-11 Western Electric Co OPTICAL SEMICONDUCTOR DEVICE WITH A GLASS COATING

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2406309A1 (en) * 1977-10-11 1979-05-11 Western Electric Co OPTICAL SEMICONDUCTOR DEVICE WITH A GLASS COATING

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees