GB1266729A - - Google Patents
Info
- Publication number
- GB1266729A GB1266729A GB1266729DA GB1266729A GB 1266729 A GB1266729 A GB 1266729A GB 1266729D A GB1266729D A GB 1266729DA GB 1266729 A GB1266729 A GB 1266729A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electroless
- plated
- masked
- exposed
- negative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1,266,729. Printed circuits. TECHNOGRAPH INTERNATIONAL DEVELOPMENTS Ltd. 7 Oct., 1970 [29 Aug., 1969], No. 43150/69. Heading HIR. [Also in Division C7] An electroless plating bath useful in the manufacture of printed circuits contains (a) NaH 2 PO 2 , 2À5 to 20 g., (b) trisodium citrate, 3À5 to 28 g., (c) NiCl 2 .6H 2 O, 3À75 to 30g., (d) NH 4 Cl, 4À25 to 34À0 g., (e) aqueous ammonia to pH 9À5 to 12À5 and (f) dimineralized water to 1 litre, the ration (a) : (b) : (c) : (d) being 1À0:1À4:1À5: 1À7Œ20% for each of (a) to (d). Tripotassium citrate may be used instead of trisodium citrate in equimolar amounts. The surface resistivity of the Ni coating can be increased 10 or more times by incorporation in the solution of a zinc compound, e.g. ZnO or ZnCl 2 to give 0À05 to 1À0 g. dissolved Zn/litre. The substrate, e.g. an electrical insulator, or a laminate of insulator and conductor such as Cu or Al, is cleaned, sensitized in a solution of stannous and Pd ions, and immersion plated, e.g. for “ to 1 hour at 50-70‹ C. In the examples, printed circuits are made as follows: (1) a Cu-coated laminate is electroless Ni plated as above, negative masked, electroplated with Cu, then Ni and Au on contact areas, then solder, and the mask is removed with trichlorethylene and the exposed Ni on Cu etched away, (2) a pretreated phenolic board is electroless Ni plated, negative masked, plated with Sn-Ni and Au on the contact areas, and solder on the rest, the mask is removed and exposed Ni etched away, (3) a panel clad on both sides with Cu has all the Cu removed except for the margin thereof, a tape resist is applied, then electroless Ni; the tape is removed and the Cu cut to produce two resistors, one on each side of the panel, (4) a prepared and negative masked phenol board is coated with electroless Ni-Zn, intended resistive areas are masked and electroless Cu deposited to produce the conductors, (5) Cu-clad epoxy fibre laminate is negative masked, electroless Ni plated, unmasked, and the exposed Cu removed by a selective etchant and (6) Al is electroless Ni plated and electroplated with Sn-Ni.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB4315069 | 1969-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1266729A true GB1266729A (en) | 1972-03-15 |
Family
ID=10427532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1266729D Expired GB1266729A (en) | 1969-08-29 | 1969-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB1266729A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2405613A1 (en) * | 1977-10-07 | 1979-05-04 | Hitachi Ltd | PROCESS FOR DEPOSITING A CIRCUIT RESISTOR PRINTED BY NON-GALVANIC VENEERING |
| EP2823890A1 (en) * | 2013-07-11 | 2015-01-14 | FRANZ Oberflächentechnik GmbH & Co KG | Method and installation for the wet chemical deposition of nickel layers |
| CN115116742A (en) * | 2022-08-23 | 2022-09-27 | 苏州聚生精密冲件有限公司 | Capacitor manufacturing process for controlling capacitance resistance and soldering-free tin-copper conducting strip |
-
1969
- 1969-08-29 GB GB1266729D patent/GB1266729A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2405613A1 (en) * | 1977-10-07 | 1979-05-04 | Hitachi Ltd | PROCESS FOR DEPOSITING A CIRCUIT RESISTOR PRINTED BY NON-GALVANIC VENEERING |
| EP2823890A1 (en) * | 2013-07-11 | 2015-01-14 | FRANZ Oberflächentechnik GmbH & Co KG | Method and installation for the wet chemical deposition of nickel layers |
| CN115116742A (en) * | 2022-08-23 | 2022-09-27 | 苏州聚生精密冲件有限公司 | Capacitor manufacturing process for controlling capacitance resistance and soldering-free tin-copper conducting strip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed | ||
| PLNP | Patent lapsed through nonpayment of renewal fees |