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GB1217148A - Improvements in or relating to substrates for microelectronic components - Google Patents

Improvements in or relating to substrates for microelectronic components

Info

Publication number
GB1217148A
GB1217148A GB3234767A GB3234767A GB1217148A GB 1217148 A GB1217148 A GB 1217148A GB 3234767 A GB3234767 A GB 3234767A GB 3234767 A GB3234767 A GB 3234767A GB 1217148 A GB1217148 A GB 1217148A
Authority
GB
United Kingdom
Prior art keywords
layer
projections
insulating material
components
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3234767A
Inventor
Roger Geoffrey Loasby
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NAT RES DEV
National Research Development Corp UK
Original Assignee
NAT RES DEV
National Research Development Corp UK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NAT RES DEV, National Research Development Corp UK filed Critical NAT RES DEV
Priority to GB3234767A priority Critical patent/GB1217148A/en
Publication of GB1217148A publication Critical patent/GB1217148A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)

Abstract

1,217,148. Circuit assemblies. NATIONAL RESEARCH DEVELOPMENT CORP. 10 Oct., 1968 [13 July, 1967], No. 32347/67. Heading H1R. Heat dissipating microelectronic components or devices are mounted on a substrate comprising a layer of high thermally conductive material provided with projections and covered with a layer of electrically insulating material. A copper sheet is pressed with a die to produce a plurality of conical projections at positions where the components are to be mounted. The layer is then coated with a glass slurry 5 and fired, the portions of the projections extending from the layer 5 being removed to leave the bare flat surface portions 4 of the projections. The components are mounted thereon and interconnections provided on the surface of insulating material 5. In a second embodiment, Fig. 3 (not shown), a further layer of electrically insulating material is positioned over layer 5 and portions 4.
GB3234767A 1967-07-13 1967-07-13 Improvements in or relating to substrates for microelectronic components Expired GB1217148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3234767A GB1217148A (en) 1967-07-13 1967-07-13 Improvements in or relating to substrates for microelectronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3234767A GB1217148A (en) 1967-07-13 1967-07-13 Improvements in or relating to substrates for microelectronic components

Publications (1)

Publication Number Publication Date
GB1217148A true GB1217148A (en) 1970-12-31

Family

ID=10337214

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3234767A Expired GB1217148A (en) 1967-07-13 1967-07-13 Improvements in or relating to substrates for microelectronic components

Country Status (1)

Country Link
GB (1) GB1217148A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135521A (en) * 1983-02-16 1984-08-30 Ferranti Plc Printed circuit boards
US4546028A (en) * 1982-04-27 1985-10-08 Compagnie D'informatique Militaire Spatiale & Aeronautique Composite substrate with high heat conduction
US5172301A (en) * 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
EP0667736A1 (en) * 1994-01-12 1995-08-16 MAGNETEK S.p.A. Laminar board for the production of printed circuits, printed circuit made with the said board, and method for its fabrication
US5869778A (en) * 1993-12-14 1999-02-09 Lsi Logic Corporation Powder metal heat sink for integrated circuit devices
US5963795A (en) * 1993-12-14 1999-10-05 Lsi Logic Corporation Method of assembling a heat sink assembly
US5960975A (en) * 1996-04-01 1999-10-05 Tetra Laval Holdings & Finance S.A. Packaging material web for a self-supporting packaging container wall, and packaging containers made from the web

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546028A (en) * 1982-04-27 1985-10-08 Compagnie D'informatique Militaire Spatiale & Aeronautique Composite substrate with high heat conduction
GB2135521A (en) * 1983-02-16 1984-08-30 Ferranti Plc Printed circuit boards
US5172301A (en) * 1991-10-08 1992-12-15 Lsi Logic Corporation Heatsink for board-mounted semiconductor devices and semiconductor device assembly employing same
US5869778A (en) * 1993-12-14 1999-02-09 Lsi Logic Corporation Powder metal heat sink for integrated circuit devices
US5963795A (en) * 1993-12-14 1999-10-05 Lsi Logic Corporation Method of assembling a heat sink assembly
EP0667736A1 (en) * 1994-01-12 1995-08-16 MAGNETEK S.p.A. Laminar board for the production of printed circuits, printed circuit made with the said board, and method for its fabrication
US5523919A (en) * 1994-01-12 1996-06-04 Magnetek S.P.A. Laminar board for the production of printed circuits, printed circuit made with the said board, and method for its fabrication
US5960975A (en) * 1996-04-01 1999-10-05 Tetra Laval Holdings & Finance S.A. Packaging material web for a self-supporting packaging container wall, and packaging containers made from the web

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