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GB1197048A - A process of Assembling a Semiconductor Device - Google Patents

A process of Assembling a Semiconductor Device

Info

Publication number
GB1197048A
GB1197048A GB2413269A GB2413269A GB1197048A GB 1197048 A GB1197048 A GB 1197048A GB 2413269 A GB2413269 A GB 2413269A GB 2413269 A GB2413269 A GB 2413269A GB 1197048 A GB1197048 A GB 1197048A
Authority
GB
United Kingdom
Prior art keywords
press
spring washers
bolt
nuts
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2413269A
Inventor
Xaver Vogel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Brown Boveri und Cie AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland, Brown Boveri und Cie AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of GB1197048A publication Critical patent/GB1197048A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

1,197,048. Semi-conductor devices. BROWN, BOVERI & CO. Ltd. 12 May, 1969 [16 May, 1968], No. 24132/69. Heading H1K. A semi-conductor device 4 is gripped firmly between two finned heat sink electrodes 1, 2 by three equispaced bolts 3 each insulated from the heat sinks by rings 11, 14 and a sleeve 16 and each provided with spring washers 9. During assembly, the structure is loosely bolted together and placed on the lower bed of an hydraulic press provided with three hexagonal studs each one of which fits into a corresponding recess in one of the bolt heads 6 to secure its bolt against rotation. The top plate of the press is universally jointed and is used to apply an even pressure to heat sink 1. The nuts 12 are then simultaneously tightened through bores in the top plate to bring two thrust washers 7, 10 on each bolt on to a spacer sleeve 8 around the spring washers. Each nut 12 is then loosened off by a predetermined amount (e.g. ¢ turn) so that the thrust is taken by the spring washers 9. (The length of individual spacer sleeves 8 is chosen to allow for production variations in the characteristics of the washer stacks). The completed unit is then removed from the press. In a variant, where even pressure on the device 4 is not so important, the spacer sleeves are omitted and the nuts 12 are simultaneously tightened to a predetermined torque while the assembly. is held in the press.
GB2413269A 1968-05-16 1969-05-12 A process of Assembling a Semiconductor Device Expired GB1197048A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH727168A CH474153A (en) 1968-05-16 1968-05-16 Method for producing a semiconductor unit by assembling a disk-shaped semiconductor element with two heat sinks and a semiconductor unit produced according to this method

Publications (1)

Publication Number Publication Date
GB1197048A true GB1197048A (en) 1970-07-01

Family

ID=4322513

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2413269A Expired GB1197048A (en) 1968-05-16 1969-05-12 A process of Assembling a Semiconductor Device

Country Status (6)

Country Link
AT (1) AT280423B (en)
CH (1) CH474153A (en)
DE (2) DE6910490U (en)
FR (1) FR2008660A1 (en)
GB (1) GB1197048A (en)
NL (1) NL6810991A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH522288A (en) * 1970-09-29 1972-06-15 Bbc Brown Boveri & Cie Semiconductor device and method of manufacturing the same
GB1381778A (en) * 1972-06-08 1975-01-29 Cableform Ltd Semiconductor clamping means
DE2602589C2 (en) * 1976-01-22 1982-02-18 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Device for clamping a disc thyristor between two heat sinks
DE4211426C1 (en) * 1992-04-01 1993-06-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De Clamping device securing gate-turn-off thyristor between opposing heat sinks - has threaded bolts between heat sinks and spring plate laminates activated in succession to exert pressure on pressure plate

Also Published As

Publication number Publication date
FR2008660A1 (en) 1970-01-23
NL6810991A (en) 1969-11-18
AT280423B (en) 1970-04-10
CH474153A (en) 1969-06-15
DE1913229A1 (en) 1970-01-22
DE6910490U (en) 1971-06-09

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees