GB1178541A - Improvements in or relating to Thin Film Circuits - Google Patents
Improvements in or relating to Thin Film CircuitsInfo
- Publication number
- GB1178541A GB1178541A GB1440066A GB1440066A GB1178541A GB 1178541 A GB1178541 A GB 1178541A GB 1440066 A GB1440066 A GB 1440066A GB 1440066 A GB1440066 A GB 1440066A GB 1178541 A GB1178541 A GB 1178541A
- Authority
- GB
- United Kingdom
- Prior art keywords
- relating
- thin film
- film circuits
- mask
- arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
Abstract
1,178,541. Coating by vapour deposition. PLESSEY CO. Ltd. April 28, 1967 [March 31, 1966], No.14400/66. Heading C7F. An assembly comprising a substrate 13 of e.g. glass, a frame 8 and a mask 3 of e.g. molybdenum are located above a hole 2 in an arm 1 by pins 12, and the arm 1 is so rotated that the centrifugal force along the axis A-A moves the mask to align it correctly.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1440066A GB1178541A (en) | 1966-03-31 | 1966-03-31 | Improvements in or relating to Thin Film Circuits |
US623922A US3503796A (en) | 1966-03-31 | 1967-03-17 | Thin film circuits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1440066A GB1178541A (en) | 1966-03-31 | 1966-03-31 | Improvements in or relating to Thin Film Circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1178541A true GB1178541A (en) | 1970-01-21 |
Family
ID=10040525
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1440066A Expired GB1178541A (en) | 1966-03-31 | 1966-03-31 | Improvements in or relating to Thin Film Circuits |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB1178541A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2233983A (en) * | 1989-06-07 | 1991-01-23 | Ppg Industries Inc | Producing sputtered coating using foraminous mask member |
-
1966
- 1966-03-31 GB GB1440066A patent/GB1178541A/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2233983A (en) * | 1989-06-07 | 1991-01-23 | Ppg Industries Inc | Producing sputtered coating using foraminous mask member |
GB2233983B (en) * | 1989-06-07 | 1993-07-21 | Ppg Industries Inc | Apparatus and method for making sputtered coatings |
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