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GB1178541A - Improvements in or relating to Thin Film Circuits - Google Patents

Improvements in or relating to Thin Film Circuits

Info

Publication number
GB1178541A
GB1178541A GB1440066A GB1440066A GB1178541A GB 1178541 A GB1178541 A GB 1178541A GB 1440066 A GB1440066 A GB 1440066A GB 1440066 A GB1440066 A GB 1440066A GB 1178541 A GB1178541 A GB 1178541A
Authority
GB
United Kingdom
Prior art keywords
relating
thin film
film circuits
mask
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1440066A
Inventor
John Clark Maddison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GE Healthcare UK Ltd
Plessey Co Ltd
Original Assignee
GE Healthcare UK Ltd
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GE Healthcare UK Ltd, Plessey Co Ltd filed Critical GE Healthcare UK Ltd
Priority to GB1440066A priority Critical patent/GB1178541A/en
Priority to US623922A priority patent/US3503796A/en
Publication of GB1178541A publication Critical patent/GB1178541A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682Mask-wafer alignment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/042Coating on selected surface areas, e.g. using masks using masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143Masks therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

1,178,541. Coating by vapour deposition. PLESSEY CO. Ltd. April 28, 1967 [March 31, 1966], No.14400/66. Heading C7F. An assembly comprising a substrate 13 of e.g. glass, a frame 8 and a mask 3 of e.g. molybdenum are located above a hole 2 in an arm 1 by pins 12, and the arm 1 is so rotated that the centrifugal force along the axis A-A moves the mask to align it correctly.
GB1440066A 1966-03-31 1966-03-31 Improvements in or relating to Thin Film Circuits Expired GB1178541A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB1440066A GB1178541A (en) 1966-03-31 1966-03-31 Improvements in or relating to Thin Film Circuits
US623922A US3503796A (en) 1966-03-31 1967-03-17 Thin film circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1440066A GB1178541A (en) 1966-03-31 1966-03-31 Improvements in or relating to Thin Film Circuits

Publications (1)

Publication Number Publication Date
GB1178541A true GB1178541A (en) 1970-01-21

Family

ID=10040525

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1440066A Expired GB1178541A (en) 1966-03-31 1966-03-31 Improvements in or relating to Thin Film Circuits

Country Status (1)

Country Link
GB (1) GB1178541A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2233983A (en) * 1989-06-07 1991-01-23 Ppg Industries Inc Producing sputtered coating using foraminous mask member

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2233983A (en) * 1989-06-07 1991-01-23 Ppg Industries Inc Producing sputtered coating using foraminous mask member
GB2233983B (en) * 1989-06-07 1993-07-21 Ppg Industries Inc Apparatus and method for making sputtered coatings

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