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GB1176088A - Temperature Compensated Zener Diode. - Google Patents

Temperature Compensated Zener Diode.

Info

Publication number
GB1176088A
GB1176088A GB40946/67A GB4094667A GB1176088A GB 1176088 A GB1176088 A GB 1176088A GB 40946/67 A GB40946/67 A GB 40946/67A GB 4094667 A GB4094667 A GB 4094667A GB 1176088 A GB1176088 A GB 1176088A
Authority
GB
United Kingdom
Prior art keywords
zones
series
junctions
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB40946/67A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
ITT Inc
Original Assignee
Deutsche ITT Industries GmbH
ITT Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19661539867 external-priority patent/DE1539867C3/en
Application filed by Deutsche ITT Industries GmbH, ITT Industries Inc filed Critical Deutsche ITT Industries GmbH
Publication of GB1176088A publication Critical patent/GB1176088A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

1,176,088. Semi-conductor devices. ITT INDUSTRIES Inc. 7 Sept., 1967 [13 Sept., 1966], No. 40946/67. Heading H1K. Several forward biased PN junctions 4 are provided in series with the or each reverse biased junction 5 in a Zener diode to comprensate for the positive temperature coefficient of breakdown voltage at the reverse biased junction(s) for breakdown voltages greater than about 6 volts. As shown the series of P+ and N+ zones 2, 3 defining the junctions 4, 5 may be formed at the interface of an N - substrate 1 and an N - epitaxial layer 10. The zones 2, 3 form by redistribution of pre - deposited doping material during the deposition of the layer 10. Regions 2b, 3b are diffused into the layer 10 through apertures in an oxide coating 11 to contact the end zones 2a, 3a of the series. In another embodiment a P - epitaxial layer (12), Fig. 4 (not shown), is deposited on an N - substrate (1), and a series of alternate P+ and N+ zones (2, 3) are diffused into the layer (12), the N+ zones (3) penetrating through to the N- substrate (1). Simpler embodiments are described in which the series of P+ and N+ zones defining the forward and reverse biased junctions are merely formed in the surface of an N - substrate. The junctions are protected by oxide layers, except for certain of them which may be short-circuited by metal deposits to regulate the degree of temperature compensation.
GB40946/67A 1951-01-28 1967-09-07 Temperature Compensated Zener Diode. Expired GB1176088A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DED0051079 1966-09-13
DE19661539867 DE1539867C3 (en) 1966-09-13 1966-09-13 Temperature-compensated Zener diode and process for its manufacture

Publications (1)

Publication Number Publication Date
GB1176088A true GB1176088A (en) 1970-01-01

Family

ID=25752810

Family Applications (1)

Application Number Title Priority Date Filing Date
GB40946/67A Expired GB1176088A (en) 1951-01-28 1967-09-07 Temperature Compensated Zener Diode.

Country Status (2)

Country Link
FR (1) FR1549324A (en)
GB (1) GB1176088A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3999205A (en) * 1975-04-03 1976-12-21 Rca Corporation Rectifier structure for a semiconductor integrated circuit device
US4005471A (en) * 1975-03-17 1977-01-25 International Business Machines Corporation Semiconductor resistor having a high value resistance for use in an integrated circuit semiconductor device
US4200877A (en) * 1976-12-23 1980-04-29 Hitachi, Ltd. Temperature-compensated voltage reference diode with intermediate polycrystalline layer
WO2002003473A1 (en) 2000-07-05 2002-01-10 Robert Bosch Gmbh Arrangement with p-doped and n-doped semiconductor layers and method for producing the same

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1188398B (en) * 1986-02-18 1988-01-07 Sgs Microelettronica Spa INTEGRATED STRUCTURE FOR PROTECTION AGAINST STATIC DISCHARGES AND A SEMICONDUCTOR DEVICE INCORPORATING THE SAME

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4005471A (en) * 1975-03-17 1977-01-25 International Business Machines Corporation Semiconductor resistor having a high value resistance for use in an integrated circuit semiconductor device
US3999205A (en) * 1975-04-03 1976-12-21 Rca Corporation Rectifier structure for a semiconductor integrated circuit device
US4200877A (en) * 1976-12-23 1980-04-29 Hitachi, Ltd. Temperature-compensated voltage reference diode with intermediate polycrystalline layer
WO2002003473A1 (en) 2000-07-05 2002-01-10 Robert Bosch Gmbh Arrangement with p-doped and n-doped semiconductor layers and method for producing the same

Also Published As

Publication number Publication date
FR1549324A (en) 1968-12-13
DE1539867B2 (en) 1974-05-09
DE1539867A1 (en) 1970-05-21

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