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GB1168370A - Improvements in and relating to plating Processes - Google Patents

Improvements in and relating to plating Processes

Info

Publication number
GB1168370A
GB1168370A GB5769267A GB5769267A GB1168370A GB 1168370 A GB1168370 A GB 1168370A GB 5769267 A GB5769267 A GB 5769267A GB 5769267 A GB5769267 A GB 5769267A GB 1168370 A GB1168370 A GB 1168370A
Authority
GB
United Kingdom
Prior art keywords
salt
formaldehyde
solution
colourimeter
spectro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5769267A
Inventor
Hyogo Hirohata
Masahiro Oita
Katsuhiko Honjo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of GB1168370A publication Critical patent/GB1168370A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)

Abstract

1,168,370. Electroless deposition of copper. MATSUSHITA ELECTRIC INDUSTRIAL CO. Ltd. Dec.19, 1967 [Dec.19, 1966], No.57692/67. Heading C7F. [Also in Division G3] Cu is deposited from an aqueous solution comprising: A Cu salt Formaldehyde. A complexing agent An alkali hydroxide, replenished with a mixture of a Cu salt and formaldehyde, in a proportion corresponding to their rates of exhaustion and kept at an approximately constant pH by addition of alkalihydroxide. Substrates 4, which may be printed circuit boards and may be of a phenolic resin, activated by immersion in a solution of Sn chloride and Pd chloride, are immersed in bath 2, which may contain Cu sulphate, Cu nitrate or Cu chloride with EDTA, one of its alkali salts, tartaric acid or one of its alkali salts and NaOH, the pH being at least 12. Liquid from bath 2 is circulated through spectro-colourimeter 10 and pH meter 25 measures the pH at electrodes 23. Suitably an electric output from spectro-colourimeter 10, which measures the concentration of Cu ions, is arranged to control addition of a Cu salt/formaldehyde solution 19 to bath 2 and a signal from pH meter addition of alkali hydroxide solution 32, but the spectro-colourimeter and pH meter may be arranged to give visual outputs and the Cu salt and formaldehyde be added by any convenient means as a solution or powder, e.g. by an electrically operated powder feeding device.
GB5769267A 1966-12-19 1967-12-19 Improvements in and relating to plating Processes Expired GB1168370A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8334766 1966-12-19

Publications (1)

Publication Number Publication Date
GB1168370A true GB1168370A (en) 1969-10-22

Family

ID=13799891

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5769267A Expired GB1168370A (en) 1966-12-19 1967-12-19 Improvements in and relating to plating Processes

Country Status (2)

Country Link
FR (1) FR1551275A (en)
GB (1) GB1168370A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0016415A1 (en) * 1979-03-21 1980-10-01 Siemens Aktiengesellschaft Method for measurement and regulation of the concentration of copper, formaldehyde and sodiumhydroxide in an electroless copper deposition bath and sampling apparatus for use in this method
US4350717A (en) 1979-12-29 1982-09-21 C. Uyemura & Co., Ltd. Controlling electroless plating bath
US4353933A (en) 1979-11-14 1982-10-12 C. Uyemura & Co., Ltd. Method for controlling electroless plating bath
GB2198750A (en) * 1986-10-31 1988-06-22 Kollmorgen Corp Controlling electroless deposition
DE3718584A1 (en) * 1987-06-03 1988-12-15 Norddeutsche Affinerie METHOD FOR MEASURING THE ACTIVE INHIBITOR CONCENTRATION DURING METAL DEPOSITION FROM AQUEOUS ELECTROLYTE
GB2218714A (en) * 1988-04-29 1989-11-22 Kollmorgen Corp Electroless plating.

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA936304A (en) * 1970-08-10 1973-11-06 B. Saubestre Edward Electroless copper plating

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0016415A1 (en) * 1979-03-21 1980-10-01 Siemens Aktiengesellschaft Method for measurement and regulation of the concentration of copper, formaldehyde and sodiumhydroxide in an electroless copper deposition bath and sampling apparatus for use in this method
US4353933A (en) 1979-11-14 1982-10-12 C. Uyemura & Co., Ltd. Method for controlling electroless plating bath
US4350717A (en) 1979-12-29 1982-09-21 C. Uyemura & Co., Ltd. Controlling electroless plating bath
GB2198750A (en) * 1986-10-31 1988-06-22 Kollmorgen Corp Controlling electroless deposition
GB2198750B (en) * 1986-10-31 1991-01-02 Kollmorgen Corp Method for electrolessly depositing high quality copper
DE3718584A1 (en) * 1987-06-03 1988-12-15 Norddeutsche Affinerie METHOD FOR MEASURING THE ACTIVE INHIBITOR CONCENTRATION DURING METAL DEPOSITION FROM AQUEOUS ELECTROLYTE
GB2218714A (en) * 1988-04-29 1989-11-22 Kollmorgen Corp Electroless plating.
GB2218714B (en) * 1988-04-29 1992-10-14 Kollmorgen Corp Method of formulating and operating an electroless plating bath solution for forming cu-deposits which are essentially free of fissures

Also Published As

Publication number Publication date
DE1621294A1 (en) 1971-06-03
FR1551275A (en) 1968-12-27
DE1621294B2 (en) 1975-07-24

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years