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GB1153282A - Improvements in or relating to Methods Of and Devices For The Thermal Processing of Material By Means Of Laser Beams - Google Patents

Improvements in or relating to Methods Of and Devices For The Thermal Processing of Material By Means Of Laser Beams

Info

Publication number
GB1153282A
GB1153282A GB2258266A GB2258266A GB1153282A GB 1153282 A GB1153282 A GB 1153282A GB 2258266 A GB2258266 A GB 2258266A GB 2258266 A GB2258266 A GB 2258266A GB 1153282 A GB1153282 A GB 1153282A
Authority
GB
United Kingdom
Prior art keywords
laser
scanning
point
mask
welding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2258266A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Philips Electronics UK Ltd
Original Assignee
Philips Electronic and Associated Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Electronic and Associated Industries Ltd filed Critical Philips Electronic and Associated Industries Ltd
Publication of GB1153282A publication Critical patent/GB1153282A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/034—Observing the temperature of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Lasers (AREA)
  • Laser Beam Processing (AREA)

Abstract

1,153,282. Removing metal or welding by fusion. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. 20 May, 1966 [25 May, 1965], No. 22582/66. Headings B3R and B3V. [Also in Divisions C1, G1 and H1] In performing a thermal process, such as evaporating, welding or cutting glass at a specified point on an object by means of a laser beam, either the same beam at low intensity or a low intensity beam from a second laser first, scans the object in search of the point, a photo-cell viewing the object detects the beam's arrival at the point and causes the scanning to stop and starts the thermal process by either increasing the intensity of the scanning laser beam or by switching on a higher powered laser. The scanning laser beam is deflected over the object by a digitally controlled electro-optic device employing a Kerr cell and, if a second laser is used for the thermal process the beam from it is directed at the specific point either by the electro-optic device used for the scanning beam or by a second simultaneously operated electrooptic device. The processing laser beam may be given a particular cross-sectional shape by a mask, which is selected from a number of masks by initially deflecting the beam to pass through that mask. The beam-may scan across the mask if the mask area is larger than the beam crosssection. In an arrangement shown in Fig. 4 for welding two wires D at their cross-over point, a scanning beam from laser LT is scanned in raster fashion across the wires by an electrooptic deflection device A 3 . A photo-cell supplies a pulse each time the scan crosses a wire to a logic circuit Sch which stops the scanning and switches on a second processing laser LL when the cross-over point is reached.
GB2258266A 1965-05-25 1966-05-20 Improvements in or relating to Methods Of and Devices For The Thermal Processing of Material By Means Of Laser Beams Expired GB1153282A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEP0036886 1965-05-25

Publications (1)

Publication Number Publication Date
GB1153282A true GB1153282A (en) 1969-05-29

Family

ID=7374995

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2258266A Expired GB1153282A (en) 1965-05-25 1966-05-20 Improvements in or relating to Methods Of and Devices For The Thermal Processing of Material By Means Of Laser Beams

Country Status (7)

Country Link
AT (1) AT261076B (en)
BE (1) BE681468A (en)
CH (1) CH454302A (en)
DE (1) DE1565007A1 (en)
FR (1) FR1480898A (en)
GB (1) GB1153282A (en)
NL (1) NL6607025A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4063063A (en) * 1975-02-14 1977-12-13 Acieries Reunies De Burbach-Eich-Dudelange S.A. Arbed Method of descaling metal products
US4088890A (en) * 1976-09-28 1978-05-09 United Technologies Corporation Optical position detector
US4151008A (en) * 1974-11-15 1979-04-24 Spire Corporation Method involving pulsed light processing of semiconductor devices
US4257825A (en) * 1978-08-30 1981-03-24 U.S. Philips Corporation Method of manufacturing semiconductor devices having improvements in device reliability by thermally treating selectively implanted test figures in wafers
GB2139614A (en) * 1983-05-13 1984-11-14 Glaverbel Method and apparatus for cutting glass
GB2175737A (en) * 1985-05-09 1986-12-03 Control Laser Limited Laser material processing

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1572642A1 (en) * 1967-06-26 1970-03-26 Euratom Laser irradiation device
NL7002789A (en) * 1969-03-01 1970-09-03
US3621180A (en) * 1969-06-03 1971-11-16 Singer General Precision System for correcting unbalances on a rotating mass
US3689159A (en) * 1970-06-11 1972-09-05 Mitsubishi Electric Corp Laser processing apparatus
FR2096880A1 (en) * 1970-06-11 1972-03-03 Mitsubishi Electric Corp Laser beam machining appts - automatically adjusted using control beam passing through semi-transparent mirrors
US3740524A (en) * 1971-03-26 1973-06-19 Ppg Industries Inc Method for cutting curved patterns in glass sheets disposed on a fluid air support
DE2219317B2 (en) * 1972-04-20 1975-06-12 Messer Griesheim Gmbh, 6000 Frankfurt Device for processing workpieces with a laser beam
DE2321137C3 (en) * 1973-04-26 1981-06-11 Messerschmitt-Boelkow-Blohm Gmbh, 8000 Muenchen Device for material processing by means of laser beams
US4323755A (en) * 1979-09-24 1982-04-06 Rca Corporation Method of making a machine-readable marking in a workpiece
US4545018A (en) * 1982-09-01 1985-10-01 Westinghouse Electric Corp. Calibration of automated laser machining apparatus
EP0195825A3 (en) * 1985-02-20 1987-07-29 Robert Langen Process for removing pollution, especially rust, from a metal surface
DE3733489A1 (en) * 1987-10-03 1989-04-20 Telemit Electronic Gmbh METHOD AND DEVICE FOR PROCESSING MATERIALS WITH THE AID OF A LASER

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4151008A (en) * 1974-11-15 1979-04-24 Spire Corporation Method involving pulsed light processing of semiconductor devices
US4063063A (en) * 1975-02-14 1977-12-13 Acieries Reunies De Burbach-Eich-Dudelange S.A. Arbed Method of descaling metal products
US4088890A (en) * 1976-09-28 1978-05-09 United Technologies Corporation Optical position detector
US4257825A (en) * 1978-08-30 1981-03-24 U.S. Philips Corporation Method of manufacturing semiconductor devices having improvements in device reliability by thermally treating selectively implanted test figures in wafers
GB2139614A (en) * 1983-05-13 1984-11-14 Glaverbel Method and apparatus for cutting glass
GB2175737A (en) * 1985-05-09 1986-12-03 Control Laser Limited Laser material processing

Also Published As

Publication number Publication date
DE1565007A1 (en) 1970-05-21
BE681468A (en) 1966-11-23
NL6607025A (en) 1966-11-28
CH454302A (en) 1968-04-15
FR1480898A (en) 1967-05-12
AT261076B (en) 1968-04-10

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees