[go: up one dir, main page]

GB1083168A - Adhesive mixtures - Google Patents

Adhesive mixtures

Info

Publication number
GB1083168A
GB1083168A GB4396864A GB4396864A GB1083168A GB 1083168 A GB1083168 A GB 1083168A GB 4396864 A GB4396864 A GB 4396864A GB 4396864 A GB4396864 A GB 4396864A GB 1083168 A GB1083168 A GB 1083168A
Authority
GB
United Kingdom
Prior art keywords
resins
formula
aromatic
specified
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4396864A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of GB1083168A publication Critical patent/GB1083168A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention comprises adhesive mixtures of (A) a polyamide having end-groups of formula -NH-R2-NH2 and recurring units of formula <FORM:1083168/C3/1> where the two pairs of carbonyl groups 1, 2 and 3, 4 are attached to adjacent or peri-carbon atoms in R1, and R1 and R2, which may vary from one structural unit to another are aliphatic, aromatic, carbocyclic or heterocyclic and (B) at least 15 mole per cent of a diamine of formula NH2-R2-NH2, the polymer containing at least 30 aromatic ketone groups as part of R1 or R2 per 100 recurring units. An aromatic ketone group is defined as a carbonyl group linked to 2 carbon atoms at least one of which is a member of an aromatic ring. R1 may be of formula <FORM:1083168/C3/2> <FORM:1083168/C3/3> <FORM:1083168/C3/4> or <FORM:1083168/C3/5> R2 may be of formula <FORM:1083168/C3/6> <FORM:1083168/C3/7> <FORM:1083168/C3/8> <FORM:1083168/C3/9> <FORM:1083168/C3/100> <FORM:1083168/C3/111> <FORM:1083168/C3/122> <FORM:1083168/C3/133> <FORM:1083168/C3/144> <FORM:1083168/C3/155> <FORM:1083168/C3/166> <FORM:1083168/C3/177> or <FORM:1083168/C3/188> where R7 and R9 are any divalent radicals. R1, R2, R7 and R9 may be substituted. The composition may also contain a filler, e.g. Al dust, Al2O3 powder or Zn dust, a thermostabilizer, e.g. arsenic thioarsenate, copper quinolate, or arsenic pentoxide, a solvent, e.g. dimethyl acetamide, xylene, N-methylpyrrolidone or toluene and another resin, e.g. a phenoplast resin or an epoxy-resin. Phenoplast resins specified are a butylated phenoplast and a novolak. Epoxy resins specified are: bisphenol type resins, <FORM:1083168/C3/199> and epoxy novolacs. The composition may be produced by reacting the corresponding tetracarboxylic acid dianhydride with 15% excess of the corresponding diamine at up to 175 DEG C. in an organic solvent for the reactants and optionally for the polymer. Anhydrides specified include those of benzophenone tetracarboxylic acid, diphenyl ether tetracarboxylic acid and diphenyl methane tetracarboxylic acid. Diamines specified include hexamethylene diamine, bis(aminophenyl) methane, bis(aminophenyl) ether and bis(aminophenyl) ketone. Reaction solvents specified include dimethyl acetamide and N - methyl pyrrolidone. The polymer may be precipitated from the product by adding a non-solvent or the polyamide-acid composition may be cured to a cross-linked polyimide by heating at 50-200 DEG C. Curing may be in two stages: initially at 80-150 DEG C. and then at 150-500 DEG C.ALSO:Adhesive coatings comprise mixtures of (A) a polyamide having end-groups of formula -NH-R2-NH2 and recurring units of formula:- <FORM:1083168/B1-B2/1> where R1 and R2 may vary from one structural unit to another and are aliphatic aromatic; carbocyclic or heterocyclic and (B) at least 15 mole % of a diamine of formula NH2-R2-NH2 the polymer containing at least 30 aromatic ketone groups per 100 recurring units. An aromatic ketone group is defined as a carbonyl group linked to 2 carbon atoms at least one of which is a member of an aromatic ring. On curing the mixture a cross-linked polyimide is formed. Substrates specified are: aluminium alloys, stainless steel, cold rolled steel, magnesium, titanium, copper, brass, galvenized iron, glass, ceramics, quartz, silicone resins, and polytetrafluoroethylene. The polyimide coatings may be overcoated with epoxy-resins, silicone resins, phenolic resins, polyvinyl formal, acetal or butyral resins, polyurethanes, alkyds, polyamides, polyesters, melamine-formaldehyde resins, urea-formaldehyde resins, benzo-guanamine-formaldehyde resins and polytetrafluoroethylene.
GB4396864A 1963-11-01 1964-10-28 Adhesive mixtures Expired GB1083168A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US32093763A 1963-11-01 1963-11-01

Publications (1)

Publication Number Publication Date
GB1083168A true GB1083168A (en) 1967-09-13

Family

ID=23248495

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4396864A Expired GB1083168A (en) 1963-11-01 1964-10-28 Adhesive mixtures

Country Status (6)

Country Link
BE (1) BE654849A (en)
CH (1) CH493614A (en)
DE (1) DE1595081A1 (en)
GB (1) GB1083168A (en)
NL (1) NL6412662A (en)
SE (1) SE314153B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2067245A1 (en) * 1969-11-12 1971-08-20 Du Pont
EP0337355A2 (en) * 1988-04-14 1989-10-18 Nissan Chemical Industries Ltd. Composition for liquid crystal aligning agent
EP0648795A1 (en) * 1993-10-18 1995-04-19 BASF Lacke + Farben AG Solutions of polyimide-forming substances and their use as coating material
EP1770137A3 (en) * 2005-09-26 2007-07-18 National Starch and Chemical Investment Holding Corporation Metal salts of quinolinols and quinolinol derivatives as adhesion and conductivity promoters in die attach adhesives

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4698295A (en) * 1984-11-16 1987-10-06 Ciba-Geigy Corporation Polyimides, a process for their preparation and their use, and tetracarboxylic acids and tetracarboxylic acid derivatives

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2067245A1 (en) * 1969-11-12 1971-08-20 Du Pont
EP0337355A2 (en) * 1988-04-14 1989-10-18 Nissan Chemical Industries Ltd. Composition for liquid crystal aligning agent
EP0337355A3 (en) * 1988-04-14 1990-10-03 Nissan Chemical Ind Ltd Composition for liquid crystal aligning agent
EP0648795A1 (en) * 1993-10-18 1995-04-19 BASF Lacke + Farben AG Solutions of polyimide-forming substances and their use as coating material
EP1770137A3 (en) * 2005-09-26 2007-07-18 National Starch and Chemical Investment Holding Corporation Metal salts of quinolinols and quinolinol derivatives as adhesion and conductivity promoters in die attach adhesives

Also Published As

Publication number Publication date
BE654849A (en) 1965-04-26
CH493614A (en) 1970-07-15
SE314153B (en) 1969-09-01
DE1595081A1 (en) 1970-03-26
NL6412662A (en) 1965-05-03

Similar Documents

Publication Publication Date Title
GB1241445A (en) Polyimide polymers
GB1063340A (en) Polyimide resins
US3663651A (en) Thermal-resistant polyimide-epoxy polymers
JPH0262152B2 (en)
US3625912A (en) Polyimide lacquers
GB1355408A (en) Epoxy resin compositions
US3883486A (en) Heat-resistant polymers based on polyamines and oligomers possessing imide groups
US3277043A (en) Process to obtain phenolic solvent soluble polycarbonamide-imides and solutions thereof
US3407176A (en) Polyamide-acids and polyimide from a mixture of dianhydrides
US3725345A (en) Composition comprising an epoxy resin acid anhydride and a n,n{40 {0 bis-imide
JP2007302843A (en) Method for producing curing agent, and thermosetting resin composition using the same
GB1083168A (en) Adhesive mixtures
JPS6164730A (en) Production of heat-resistant resin
US3635843A (en) Crystalline 1,5-diglycidylnaphthalene and cured products thereof
GB2112388A (en) Carboxylic acid amides containing amino groups, and mixtures containing these amides and epoxy resins
US3369055A (en) Nitrogenous copolymers
US3886119A (en) Epoxy end-capped aromatic polyimides
GB1162203A (en) Production of Polyamic Acids and Polyimides
US3386924A (en) Curing polyepoxy compounds with tetrahydrotricyclopentadienylene diamine
GB1515862A (en) Coating compositions and process of coating substrates therewith
US3575914A (en) Polymeric materials which are the reaction product of (a) a primary polyamine and (b) a polycarboxylic anhydride which is the thermal condensation product of (1) an aromatic intramolecular carboxylic anhydride (2) aromatic polysulfonyl halide (3) other aromatics
US3674741A (en) Copolymer of poly(quinozolone and imide) and process for producing the same
US3836506A (en) Compositions of cyanoimide polymers and heterocyclic polymers made from cyanoimide precursors
US5614606A (en) Polyamic acids and polyimides
US4366302A (en) Imide-anhydrides and epoxy resin systems containing such compounds