GB1069520A - Encapsulated semiconductor device - Google Patents
Encapsulated semiconductor deviceInfo
- Publication number
- GB1069520A GB1069520A GB31101/65A GB3110165A GB1069520A GB 1069520 A GB1069520 A GB 1069520A GB 31101/65 A GB31101/65 A GB 31101/65A GB 3110165 A GB3110165 A GB 3110165A GB 1069520 A GB1069520 A GB 1069520A
- Authority
- GB
- United Kingdom
- Prior art keywords
- foils
- bonding agent
- cured silicone
- semi
- insulating ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000011888 foil Substances 0.000 abstract 5
- 239000007767 bonding agent Substances 0.000 abstract 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract 3
- 229920001296 polysiloxane Polymers 0.000 abstract 3
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000010453 quartz Substances 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 abstract 1
- 239000010425 asbestos Substances 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 229910010293 ceramic material Inorganic materials 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229910052750 molybdenum Inorganic materials 0.000 abstract 1
- 239000011733 molybdenum Substances 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229910052895 riebeckite Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
- H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
1,069,520. Semi-conductor devices. SIEMENS-SCHUCKERTWERKE A.G. July 21, 1965 [July 25, 1964], No. 31101/65. Heading H1K. A semi-conductor element 4 is mounted between two metal (e.g. silver) foils 2 and surrounded by an insulating ring which is secured to the edge regions of the two metal foils and which consists at least partially of a cured silicone bonding agent. The insulating ring may consist of two component rings connected together by an intermediate layer 6 of cured silicone-bonding agent, the component rings possibly being of a ceramic material 5 (such as sintered aluminium oxide) hard-soldered to the respective foils 2, as shown, fig. 1, or of a plastic material 7, such as powdered quartz or asbestos with a cured silicone bonding agent as a binder, cast around the edges of the respective foils, Fig. 2 (not shown). Alternatively, the insulating ring may be cast in one piece around the edges of the foils, Fig. 3 (not shown), and consist of a mixture of cured silicone bonding agent and a finely divided filler, such as powdered quartz. The semi-conductor element 4 may be alloyed to molybdenum carrier plates 3.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES0092265 | 1964-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1069520A true GB1069520A (en) | 1967-05-17 |
Family
ID=7517107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB31101/65A Expired GB1069520A (en) | 1964-07-25 | 1965-07-21 | Encapsulated semiconductor device |
Country Status (6)
| Country | Link |
|---|---|
| BE (1) | BE667290A (en) |
| CH (1) | CH427047A (en) |
| DE (1) | DE1439421A1 (en) |
| GB (1) | GB1069520A (en) |
| NL (1) | NL6506706A (en) |
| SE (1) | SE334945B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2000642A (en) * | 1977-07-04 | 1979-01-10 | Commw Scient Ind Res Org | Pyrometric sheath and process |
-
1964
- 1964-07-25 DE DE19641439421 patent/DE1439421A1/en active Pending
-
1965
- 1965-05-24 CH CH721365A patent/CH427047A/en unknown
- 1965-05-26 NL NL6506706A patent/NL6506706A/xx unknown
- 1965-07-20 SE SE09569/65A patent/SE334945B/xx unknown
- 1965-07-21 GB GB31101/65A patent/GB1069520A/en not_active Expired
- 1965-07-23 BE BE667290D patent/BE667290A/xx unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2000642A (en) * | 1977-07-04 | 1979-01-10 | Commw Scient Ind Res Org | Pyrometric sheath and process |
| GB2000642B (en) * | 1977-07-04 | 1982-02-03 | Commw Scient Ind Res Org | Pyrometric sheath and process |
Also Published As
| Publication number | Publication date |
|---|---|
| CH427047A (en) | 1966-12-31 |
| SE334945B (en) | 1971-05-10 |
| DE1439421A1 (en) | 1968-11-28 |
| NL6506706A (en) | 1966-01-26 |
| BE667290A (en) | 1966-01-24 |
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