GB1052862A - - Google Patents
Info
- Publication number
- GB1052862A GB1052862A GB1052862DA GB1052862A GB 1052862 A GB1052862 A GB 1052862A GB 1052862D A GB1052862D A GB 1052862DA GB 1052862 A GB1052862 A GB 1052862A
- Authority
- GB
- United Kingdom
- Prior art keywords
- flange
- contact
- insert
- heat sink
- electrical contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Rectifiers (AREA)
Abstract
1,052,862. Semi-conductor devices. ASSOCIATED ELECTRICAL INDUSTRIES Ltd. Dec. 19, 1963 [May 1, 1963], No. 17229/63. Heading H1K. A semi-conductor rectifier enclosed in a casing with a conductive flange at one end is clamped in thermal contact with a heat sink by means of a mounting structure which engages the flange with a high pressure good electrical contact and provides external connecting means. As shown, the rectifier 1 has a base 2 with a flange 3 forming one contact to which electrical contact is made by an insert 8 which is pressed against the top of the flange 3 by clamping ring 5<SP>1</SP> which is urged towards a copper or aluminium heat sink 4 by three bolts 6. The small area high pressure contact between flange 3 and insert 8 forms an efficient electrical contact while the large area low pressure contact between base 2 and heat sink 4 forms an efficient thermal contact. The conductive insert 8 has a terminal portion 11 which may be connected directly to other components or clamped to heat sink 4. Either the insert 8 or the top of base 2 may be provided with one or more annular ridges to reduce the area and increase the pressure of the electrical contact, and the insert may be omitted, a ridge being provided on the top of the flange 3.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1722963 | 1963-05-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1052862A true GB1052862A (en) |
Family
ID=10091503
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1052862D Active GB1052862A (en) | 1963-05-01 |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE1275689B (en) |
GB (1) | GB1052862A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3624452A (en) * | 1968-11-26 | 1971-11-30 | Westinghouse Brake & Signal | Heat sink mountings for rectifier devices |
WO2012113584A1 (en) * | 2011-02-22 | 2012-08-30 | Infineon Technologies Bipolar Gmbh & Co. Kg | Power semiconductor module |
-
0
- GB GB1052862D patent/GB1052862A/en active Active
-
1964
- 1964-03-21 DE DE1964A0045568 patent/DE1275689B/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3624452A (en) * | 1968-11-26 | 1971-11-30 | Westinghouse Brake & Signal | Heat sink mountings for rectifier devices |
WO2012113584A1 (en) * | 2011-02-22 | 2012-08-30 | Infineon Technologies Bipolar Gmbh & Co. Kg | Power semiconductor module |
Also Published As
Publication number | Publication date |
---|---|
DE1275689B (en) | 1968-08-22 |
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