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GB1031043A - Improvements in or relating to semi-conductor devices - Google Patents

Improvements in or relating to semi-conductor devices

Info

Publication number
GB1031043A
GB1031043A GB6852/63A GB685263A GB1031043A GB 1031043 A GB1031043 A GB 1031043A GB 6852/63 A GB6852/63 A GB 6852/63A GB 685263 A GB685263 A GB 685263A GB 1031043 A GB1031043 A GB 1031043A
Authority
GB
United Kingdom
Prior art keywords
layer
semi
conductivity type
conductivity
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB6852/63A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Secheron SA
Original Assignee
Ateliers de Secheron SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ateliers de Secheron SA filed Critical Ateliers de Secheron SA
Publication of GB1031043A publication Critical patent/GB1031043A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/104Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices having particular shapes of the bodies at or near reverse-biased junctions, e.g. having bevels or moats
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

1,031,043. Semi-conductor devices. DES ATELIERS DE SECHERON. S.A. Feb. 20, 1963 [Feb. 20, 1962], No. 6852/63. Heading H1K. In semi-conductor devices, at a junction between a layer of one conductivity type and a more highly doped layer of different conductivity type, the surface of the layer of lower conductivity is shaped so that this layer decreases in cross-sectional area in a direction away from the junction. This is to reduce the tangential electric field at the surface of the body. The surface of the layer of higher conductivity may also be shaped. Various forms which the surface of the layers may take are described. Reference is made to devices in which a layer of one conductivity type is sandwiched between two more highly conductive layers of the opposite or different conductivity type. The low conductivity layer is shaped so that its cross-sectional area initially decreases in the direction away from both junctions. This construction is used in the only complete embodiment-a silicon PvPN controlled-rectifier. Shaping may be effected by methods including jet etching, jet etching in which abrasive particles are included in the etchant, sand blasting, and grinding with emery wheels. The devices may be provided with protective coatings, especially over the layers of lower conductivity. Suitable materials include silicone laquers or silica. The Specification states that in some cases the semi-conductor body may be metallized or coated with graphite in regions of greatest tangential field intensity, i.e. at reverse biased junctions. Reference has been directed by the Comptroller to Specification 968,105.
GB6852/63A 1962-02-20 1963-02-20 Improvements in or relating to semi-conductor devices Expired GB1031043A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH202162A CH414866A (en) 1962-02-20 1962-02-20 Rectifier element made up of p- and n-layers

Publications (1)

Publication Number Publication Date
GB1031043A true GB1031043A (en) 1966-05-25

Family

ID=4224045

Family Applications (1)

Application Number Title Priority Date Filing Date
GB6852/63A Expired GB1031043A (en) 1962-02-20 1963-02-20 Improvements in or relating to semi-conductor devices

Country Status (6)

Country Link
AT (1) AT255569B (en)
BE (1) BE628619A (en)
CH (1) CH414866A (en)
DE (2) DE1789155B1 (en)
FR (1) FR1360744A (en)
GB (1) GB1031043A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1589529A1 (en) * 1967-06-19 1970-04-09 Bosch Gmbh Robert Planar transistor
US4110780A (en) * 1973-07-06 1978-08-29 Bbc Brown Boveri & Company, Limited Semiconductor power component
EP4109495A1 (en) * 2021-06-23 2022-12-28 Infineon Technologies Bipolar GmbH & Co. KG Method and device for forming an edge structure of a semiconductor component

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL6603372A (en) * 1965-03-25 1966-09-26
DE2340107A1 (en) * 1973-07-06 1975-01-23 Bbc Brown Boveri & Cie POWER SEMICONDUCTOR COMPONENT
CH566643A5 (en) * 1973-10-11 1975-09-15 Bbc Brown Boveri & Cie
DE2358937C3 (en) * 1973-11-27 1976-07-15 Licentia Gmbh THYRISTOR FOR HIGH VOLTAGE IN THE KILOVOLT RANGE

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1589529A1 (en) * 1967-06-19 1970-04-09 Bosch Gmbh Robert Planar transistor
US4110780A (en) * 1973-07-06 1978-08-29 Bbc Brown Boveri & Company, Limited Semiconductor power component
EP4109495A1 (en) * 2021-06-23 2022-12-28 Infineon Technologies Bipolar GmbH & Co. KG Method and device for forming an edge structure of a semiconductor component

Also Published As

Publication number Publication date
BE628619A (en)
DE1439215B2 (en) 1973-10-18
FR1360744A (en) 1964-05-15
DE1789155B1 (en) 1976-03-11
DE1439215A1 (en) 1968-10-17
AT255569B (en) 1967-07-10
CH414866A (en) 1966-06-15

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